ESP32 LCSC Part Verification

Verification was limited because the active project data/index exposes only two properties: the Espressif ESP32-S3 datasheet URL and Symbol Style: parametric-v1. I could not retrieve an actual symbol terminal list, footprint pad list, pad mapping, BOM entry, or project-level LCSC/MPN metadata from the project, and the automated review endpoint reported the project as unavailable.
Issues found / recommended fixes:
  1. Missing part metadata
    • Expected LCSC part appears to be C2913192.
    • Expected MPN: ESP32-S3
    • Expected manufacturer: Espressif Systems / ESPRESSIF
    • Expected package: QFN-56-EP(7x7)
    • Add these explicitly to the part project metadata.
  2. Footprint/pad mapping must be verified or added
    • Datasheet package is QFN56, 7 mm × 7 mm, 56 perimeter pins plus exposed pad.
    • Exposed pad must be pad 57 = GND.
    • Confirm the footprint has pads 1–56 plus 57, not just 56 pads.
    • Confirm EPAD dimensions match the base ESP32-S3, not the special ESP32-S3FH4R2 variant, which has a different/larger EPAD.
  3. Pin mapping correction to use
    • Critical datasheet mapping around pins 43–57 is:
      • 43 VDDA
      • 44 GPIO38
      • 45 MTCK
      • 46 MTDO
      • 47 VDD3P3_CPU
      • 48 MTDI
      • 49 MTMS
      • 50 U0TXD
      • 51 U0RXD
      • 52 GPIO45
      • 53 GPIO46
      • 54 XTAL_N
      • 55 XTAL_P
      • 56 VDDA
      • 57 GND / exposed pad
    • If the project symbol has GPIO38 at pin 43 or shifts MTCK/MTDO/VDD3P3_CPU one pin early, that is incorrect.
  4. Electrical metadata to add/check
    • Supply voltage recommended range: 3.0 V to 3.6 V, typical 3.3 V.
    • Absolute max supply should not exceed 3.6 V.
    • Mark power pins correctly: VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDDA, VDD_SPI, and EPAD GND.
    • Strapping pins should be documented: GPIO0, GPIO3, GPIO45, GPIO46.
    • GPIO45 controls VDD_SPI voltage and should not be casually used without noting boot implications.
  5. Documentation gaps
    • Add a short part note stating this is the bare ESP32-S3 SoC, not an ESP32-S3 module.
    • Add a warning that RF matching, crystal, flash/PSRAM usage, boot strapping, decoupling, and antenna/RF layout are design-critical for the bare chip.
    • Add the LCSC URL/reference for C2913192.
Bottom line: the public datasheet/LCSC identity is clear, but the project appears incomplete or not fully indexed. The highest-priority fix is to add/verify the full 57-pad QFN footprint and exact datasheet pin mapping, especially pins 43–57 and exposed pad 57 = GND.
Fix metadata issues
Verify pin mapping
Check footprint pads
Use LCSC reference
Run part review
GPIO36
MTDO
GPIO19
U0TXD
VDD3P3_CPU
MTMS
SPID
GPIO10
SPICLK_P
VDD_SPI
GPIO2
GPIO18
GPIO13
GPIO37
CHIP_PU
GPIO4
SPIHD
GPIO7
LNA_IN
GPIO45
GPIO17
MTDI
VDDA
XTAL_N
GPIO14
GPIO12
VDD3P3
VDD3P3
U0RXD
SPIWP
GND
GPIO3
XTAL_P
GPIO21
GPIO5
GPIO35
SPIQ
MTCK
VDD3P3_RTC
SPICLK
GPIO11
XTAL_32K_P
SPICLK_N
VDDA
SPICS0
GPIO0
GPIO38
XTAL_32K_N
GPIO20
GPIO33
GPIO9
GPIO8
GPIO6
GPIO34
SPICS1
GPIO1
GPIO46

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Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    QFN-56-1EP_7x7mm_P0.4mm_EP.png

    QFN-56-1EP_7x7mm_P0.4mm_EP.png

    QFN-56-1EP_7x7mm_P0.4mm_EPThumbnail
    step

    ESP32-S3R8/ESP32-S3R8.3dshapes/QFN-56_L7.0-W7.0-P0.40-TL-EP4.0.step

    ESP32-S3R8/ESP32-S3R8 Model3D Model
    kicad_mod

    ESP32-S3R8/ESP32-S3R8.pretty/QFN-56_L7.0-W7.0-P0.40-TL-EP4.0.kicad_mod

    ESP32-S3R8/ESP32-S3R8 FootprintFootprint
    ESP32-S3R8.svg

    ESP32-S3R8.svg

    ESP32-S3R8Default

    ESP32-S3R8

    ESP32-S3R8 thumbnail
    IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad
    The ESP32-S3R8 is a high-performance wireless microcontroller system-on-chip manufactured by Espressif Systems. This device integrates dual-core processing, Wi-Fi connectivity, Bluetooth Low Energy communication, embedded memory resources, and advanced peripheral interfaces within a compact package optimized for embedded and IoT applications.
    The microcontroller is based on the Xtensa LX7 architecture and is designed to support edge computing, wireless communication, human-machine interfaces, audio processing, AI acceleration, and low-power connected systems. The ESP32-S3R8 includes integrated flash and RAM resources, advanced security functions, vector instruction acceleration, and extensive GPIO/peripheral capability for modern embedded development.
    The device is widely used in IoT devices, industrial automation systems, smart home equipment, wearable electronics, wireless sensor nodes, edge AI applications, USB-enabled embedded systems, and portable consumer electronics. Its integrated wireless functionality and high processing performance reduce external component count while simplifying system-level design for connected embedded platforms.
    Engineering Specification Device Type
    Wireless microcontroller system-on-chip
    Processor Architecture
    Dual-core Xtensa LX7 microcontroller architecture
    Wireless Connectivity
    Integrated Wi-Fi and Bluetooth Low Energy communication
    Processing Features
    High-performance embedded processing with vector instruction acceleration
    Memory Resources
    Integrated RAM and embedded memory architecture
    Communication Interfaces
    SPI I2C UART I2S USB PWM ADC GPIO interfaces
    Wireless Features
    Secure wireless networking and low-power communication support
    USB Capability
    Integrated USB communication and device functionality
    AI and DSP Features
    Vector instruction support for AI and digital signal processing workloads
    Security Features
    Hardware encryption and secure boot support
    Power Characteristics
    Low-power operating modes for battery-powered systems
    Package Type
    QFN surface-mount package
    Mounting Style
    Surface mount technology
    Applications
    IoT devices Wireless embedded systems Industrial automation Smart home electronics Edge AI applications Wearable devices Consumer electronics USB-enabled systems Sensor networks Embedded communication platforms
    Manufacturer
    Espressif Systems

    Properties

    ESPRESSIF(乐鑫)

    U

    ESP32-S3R8

    C2913194

    QFN-56_L7.0-W7.0-P0.40-TL-EP4.0

    RF Transceiver ICs

    Extended Part

    2412MHz ~ 2484MHz

    Hz

    3V~3.6V

    V

    -40℃~+65℃

    parametric-v1

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