Project Redesign Brief
Extract official CM4 IO mounting-hole coordinates and current layout hole state
Extract M.2 EM05 and simpleRTK3B mPCIe mechanical fixing requirements from datasheets
Correct/add board, CM4, M.2, and mPCIe mounting holes without moving CM4/Mosaic/LTE modules
Verify mechanical holes and document any remaining datasheet/footprint caveats
dde9bf77-ffc7-4620-972a-a0a2d31f62fc.Table
| Source | Status | How to use |
|---|---|---|
| TI BQ25750 product page | Found | Primary source for datasheet, product collateral, EVM, and design resources. |
| BQ25750EVM User Guide, SLUUCY7B, Rev. B, revised May 2025 | Found | Authoritative EVM schematic, BOM, layout plots, operating limits, setup, and caveats. |
| TI E2E FAQ: BQ25750 Schematic and Layout Checklist | Found | Formal checklist before schematic/layout release. If checklist conflicts with datasheet, datasheet wins. |
| TI E2E design-file thread: BQ25750_EVM_Altium_Design_Files.zip | Found | Useful optional source if accessible. Not a blocker. |
| TI E2E ASCII design-file thread | Found | Optional alternative CAD reference if native files are difficult to import. |
Table
| Circuit item | Requirement / extracted guidance |
|---|---|
| Buck/boost FETs | Four N-channel switching MOSFETs Q1-Q4 required. Gate drive resistors typically 0 ohm; no gate-source pulldowns unless TI says otherwise. |
| Bootstrap | Schottky bootstrap diodes; 100 nF bootstrap caps close to IC; DRV_SUP 4.7 uF close to IC. |
| Input protection FETs | Optional back-to-back input N-FETs; gate-source zener around 15 V if used. |
| Battery FETs | BATDRV drives N-channel battery FETs; gate-drive limiting resistor and turn-on cap per checklist/EVM. |
| Inductor | Required; checklist gives 2.2 uH min, 10 uH typical, 15 uH max range. Must be recalculated for this 2S UPS load/thermal case. |
| Input current sense | RAC optional, 0-5 mΩ. If not used, short ACP/ACN to VAC. For PoE/DC input limiting, RAC is likely useful. |
| Battery current sense | RBAT/SRP-SRN sense resistor is 5 mΩ fixed; different value not recommended by TI checklist. Kelvin route. |
| Input capacitance | Bulk input capacitance 80 uF min / 160 uF typ, mix ceramic + electrolytic. |
| Output capacitance | Bulk output capacitance 80 uF min / 160 uF typ, mix ceramic + electrolytic. |
| TS thermistor | Real 10 k NTC such as 103AT-2 style network from REGN to TS to PGND; select divider values from BQ25750 datasheet JEITA section. |
| Layout | Minimize buck/boost switching loops; Kelvin sense resistors; keep sense traces away from switch nodes; analog ground plane tied to PGND under exposed pad; lowest-value bypass capacitors closest to IC. |
Table
| Item | Requirement |
|---|---|
| VCC operating range | 3.135 V to 4.4 V |
| Typical VCC | 3.3 V |
| VCC pins | M.2 pins 2, 4, 70, 72, 74 |
| Ground pins | 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 |
| Supply current capability | At least 2.0 A; reference supply supports 3.0 A |
| VCC droop warning | Must not fall below 3.135 V during burst transmission |
| Local VCC capacitance | 220 uF low-ESR bulk plus 1 uF, 100 nF, 33 pF, 10 pF close to VCC pins |
| VCC TVS | Low clamp TVS; Quectel suggests VRWM 4.7 V class |
| VCC routing | Wide trace, about >= 2 mm where practical |
3V3_LTE must be a dedicated regulator/load-switch branch sized for 3 A transient margin, not a shared logic rail.Table
| Item | Requirement |
|---|---|
| Interface | USB 2.0 device/slave |
| Speed | High-speed 480 Mbps |
| DP/DM impedance | 90 ohm differential |
| ESD | Low-capacitance USB ESD, typically **=30 ms. Boot to active can take >=12 s. |
| RESET# | Pin 67; active low; pulse low 150-460 ms; no large capacitance on reset. Before forced shutdown, Quectel recommends pulling RESET# low around 100 ms to avoid flash damage. |
| W_DISABLE1# | Pin 8; active low RF disable; hardware control disabled by firmware by default and can be enabled using AT+QCFG="airplanecontrol". |
Table
| Candidate | Output | Power | Library status | Recommendation |
|---|---|---|---|---|
| Silvertel Ag5412 | 12 V / 2.5 A | 30 W | Not found in Flux library | Preferred external BOM target if using Ag5400 family; request/add symbol if selected. |
| Silvertel Ag5424 | 24 V / 1.25 A | 30 W | Not found in Flux library | Good alternate if 24 V intermediate bus is desired. |
| Silvertel AG5300 | 12 V / 2.5 A | 30 W class | Found in Flux library | Best immediate implementation default because symbol exists. |
| Silvertel AG5712-LPB | 12 V / 2.5 A | 30 W | Not found in Flux library | Low-profile alternate; evaluate if height/area matters. |
| PoweredEthernet PEM3212 | 12 V | ~24-30 W peak depending datasheet | Not found in Flux library | Secondary-source candidate; verify continuous output before use. |
| Silvertel Ag59812-LPB / Ag59824-LPB | 12 V / 24 V | 802.3bt high-power class | Not searched in library this pass | Upgrade path if PoE+ power budget is too tight. |
Text
RJ45 / Ethernet magnetics / PoE input -> isolated 12 V PoE+ module, default AG5300 in Flux or Ag5412 external BOM target -> reverse-current blocking / ideal-diode OR with external DC input -> BQ25750 input / direct power-path / 2S charger, provisional until TI checklist complete -> downstream rails: 5V_CM dedicated CM4 regulator 3V3_LTE dedicated 3 A LTE regulator/load switch 3V3_GNSS clean GNSS regulator/filter/load switch 3V3_HUB USB hub/logic rail 3V3_AUX low-current control/peripheral rail
3V3_LTE regulator/load switch with EM05-required bulk/MLCC/TVS/passive footprints.3V3_GNSS clean rail regulator/filter/load switch.Executive recommendation
TI BQ25750 sources found
Important BQ25750EVM caveats
TI checklist items that must be implemented/verified
Quectel EM05 hardware guide findings
EM05 power requirements
EM05 USB requirements
EM05 SIM requirements
EM05 control pins
PoE+ module options
Ag5400 family extracted constraints
Default architecture after research
Remaining documents / unresolved decisions before production-ready schematic
Required documents/datasheets
Unresolved design decisions
Immediate next schematic actions enabled by this research