Project Redesign Brief


Because the previous full-board placement oscillated, I’m going to use deterministic moves for the main crowded blocks first, then run the placement agent only to clean passives around those anchors.
The anchor move separated the big zones and fixed some previous placement problems, but many passives now need cleanup around those anchors. I’m handing only the overlap cleanup to the placement engine and allowing small passives on the bottom.
The cleanup pass still could not converge; the overlap set is oscillating. I’m doing one final broader fresh placement with looser grouping priorities: first objective is simply no physical overlaps and all parts inside the board, still with no routing.
I have rearrange the the board this is the finaly position of the cm4, mosiac and 4g modem - correct the io board mounting holes to match the offical io board hole locations as they are currently incorrect, also add/correct the fixings and mounts and holes for the m.2, cm4 and mpcie units to suit the quectel em05 and the mosiac, here are the data sheets.
I’ll preserve your manually placed CM4/Mosaic/4G positions, then correct only mechanical items: official CM4 IO mounting holes, CM4 mounting/fixing holes, and M.2/mPCIe standoff holes from the provided datasheets. I’ll source/inspect the official geometry before mutating holes.

U_DC_OR
D_ESD_USB_SERVICE
Y_HUB_24M
Resistance
60 ohms
D_ESD_USB_LTE
J_MPCIE_GNSS
U_CHG
D_ESD_USB_MOSAIC
U_AUX_LDO
U_POE_OR
PS_POE
R_CHG_ACN_FILT
Resistance
10 Ω
R_HUB_OCS_PU
Resistance
10kΩ
R_HUB_RBIAS
Resistance
12kΩ
R_CHG_FSW
Resistance
80kΩ
R_GNSS_EN_PD
Resistance
100kΩ
R_HUB_CFG1_PD
Resistance
100kΩ
R_CHG_TS_BOT
Resistance
30.31kΩ
R_HUB_P4DIS_P
Resistance
10kΩ
R_CHG_BAT_SNS
Resistance
5mΩ
R_CHG_SRP_FILT
Resistance
10 Ω
R_CHG_SCL_PU
Resistance
10kΩ
R_CHG_PG_PU
Resistance
10kΩ
R_CHG_TS_TOP
Resistance
5.24kΩ
R_CHG_FB_TOP
Resistance
249kΩ
R_CHG_ACP_FILT
Resistance
10 Ω
R_CHG_INT_PU
Resistance
10kΩ
R_LTE_FB_TOP
Resistance
100kΩ
R_CHG_FB_BOT
Resistance
55.6kΩ
R_CHG_AC_SNS
Resistance
2mΩ
R_CHG_CE_PU
Resistance
10kΩ
R_HUB_NONREM1_PU
Resistance
100kΩ
R_LTE_PG_PU
Resistance
100kΩ
R_CHASSIS_BOND
Resistance
1MΩ
R_CHG_ILIM
Resistance
24.9kΩ
R_GNSS_BUCK_FB_BOT
Resistance
43.2kΩ
R_HUB_CFG0_PD
Resistance
100kΩ
R_GNSS_BUCK_FB_TOP
Resistance
100kΩ
R_LTE_FB_BOT
Resistance
43.2kΩ
R_CHG_SRN_FILT
Resistance
10 Ω
R_5V_FB_BOT
Resistance
19.1kΩ
R_CHG_ICHG
Resistance
49.9kΩ
R_HUB_RESET_PU
Resistance
10kΩ
R_HUB_BUCK_FB_BOT
Resistance
43.2kΩ
R_HUB_NONREM0_PD
Resistance
100kΩ
R_LTE_RESET_PU
Resistance
100kΩ
R_SIM_DET_FIX
Resistance
100kΩ
R_LTE_EN_PD
Resistance
100kΩ
R_HUB_BUCK_FB_TOP
Resistance
100kΩ
R_5V_FB_TOP
Resistance
100kΩ
R_HUB_P4DIS_M
Resistance
10kΩ
R_LTE_WDIS_PU
Resistance
100kΩ
R_MOSAIC_RESET_PU
Resistance
100kΩ
R_CHG_SDA_PU
Resistance
10kΩ
C_HUB_XTALO
Capacitance
18pF
C_LTE_OUT_1
Capacitance
22uF
C_HUB_VDD33_1
Capacitance
100 nF
C_GNSS_BULK
Capacitance
10uF
C_HUB_BUCK_OUT1
Capacitance
22uF
C_DC_IN_HF
Capacitance
100nF
C_LTE_EM05_BULK
Capacitance
220uF
C_POE_OR_VCAP
Capacitance
100nF
C_5V_OUT2
Capacitance
47uF
C_GNSS_BUCK_OUT2
Capacitance
22uF
C_5V_BOOT
Capacitance
100nF
C_LTE_VCC
Capacitance
1uF
C_HUB_VDDA33_2
Capacitance
100 nF
C_HUB_BUCK_VCC
Capacitance
1uF
C_HUB_BUCK_OUT2
Capacitance
22uF
C_5V_OUT1
Capacitance
47uF
C_CM4_HF
Capacitance
0.1uF
C_LTE_BULK
Capacitance
100uF
C_CHG_DRV
Capacitance
4.7uF
C_LTE_EM05_10P
Capacitance
10pF
C_GNSS_BUCK_IN
Capacitance
10uF
C_CHG_BAT_CONV_BULK
Capacitance
100uF
C_GNSS_BUCK_HF
Capacitance
220nF
C_LTE_EM05_1U
Capacitance
1uF
C_GNSS_BUCK_VCC
Capacitance
1uF
C_HUB_VDD2
Capacitance
0.1uF
C_CHG_SYS_BULK
Capacitance
100uF
C_LTE_BUCK_HF
Capacitance
220nF
C_LTE_OUT_2
Capacitance
22uF
C_HUB_RESET
Capacitance
100nF
C_5V_HF
Capacitance
220nF
C_HUB_VDDA_BULK
Capacitance
1 µF
C_CHG_VAC
Capacitance
1uF
C_AUX_IN
Capacitance
1uF
C_CHG_SRN_CM
Capacitance
0.1uF
C_HUB_BUCK_BOOT
Capacitance
100nF
C_5V_IN
Capacitance
10uF
C_CHG_AC_DIFF
Capacitance
0.47uF
C_LTE_EM05_33P
Capacitance
33pF
C_CHG_ACN_CM
Capacitance
0.1uF
C_CHG_BAT_HF
Capacitance
2.2uF
C_HUB_CRFILT
Capacitance
0.1uF
C_CHG_ACP_CM
Capacitance
0.1uF
C_HUB_PLLFILT
Capacitance
0.1uF
C_HUB_BUCK_HF
Capacitance
220nF
C_HUB_VDD33_2
Capacitance
100 nF
C_CM4_BULK
Capacitance
10uF
C_AUX_OUT
Capacitance
1uF
C_DC_IN_BULK
Capacitance
47uF
C_CHG_SYS_HF
Capacitance
2.2uF
C_CHG_SRP_CM
Capacitance
0.1uF
C_CHG_BTST1
Capacitance
470nF
C_POE_OUT_HF
Capacitance
100nF
C_SIM_VCC
Capacitance
0.1uF
C_HUB_VDDA33_1
Capacitance
100 nF
C_LTE_BOOT
Capacitance
100nF
C_5V_FF
Capacitance
33pF
C_CHG_BAT_DIFF
Capacitance
0.47uF
C_GNSS_BUCK_OUT1
Capacitance
22uF
C_DC_OR_VCAP
Capacitance
100nF
C_CHG_BAT_PACK_BULK
Capacitance
100uF
C_HUB_XTALI
Capacitance
18pF
C_HUB_VDD1
Capacitance
0.1uF
C_LTE_HF
Capacitance
0.1uF
C_GNSS_BUCK_BOOT
Capacitance
100nF
C_CHG_REGN
Capacitance
4.7uF
C_HUB_VDDA33_3
Capacitance
100 nF
C_HUB_VDDA33_4
Capacitance
100 nF
C_HUB_BUCK_IN
Capacitance
10uF
C_CHG_BTST2
Capacitance
470nF
C_LTE_BUCK_IN
Capacitance
10uF
D_POE_12V_TVS
P_PWR_GOOD
Pin Number
1
P_CHG_INT
Pin Number
1
P_ETH_TRD0_P
Pin Number
1
P_SIM_RST
Pin Number
1
P_GND
Pin Number
1
P_ETH_TRD3_N
Pin Number
1
P_SIM_CLK
Pin Number
1
P_LTE_USB_DP
Pin Number
1
P_ETH_TRD1_N
Pin Number
1
P_ETH_TRD1_P
Pin Number
1
P_ETH_TRD3_P
Pin Number
1
P_SIM_DATA
Pin Number
1
P_LTE_W_DISABLE
Pin Number
1
P_CHG_EN
Pin Number
1
P_SAFE_SHUTDOWN
Pin Number
1
P_FG_INT
Pin Number
1
P_BAT_NTC
Pin Number
1
P_MOSAIC_PWR_EN
Pin Number
1
P_SERVICE_USB_DP
Pin Number
1
P_LTE_USB_DM
Pin Number
1
P_ETH_TRD2_N
Pin Number
1
P_WD_HEARTBEAT
Pin Number
1
P_SIM_VCC
Pin Number
1
P_ETH_TRD2_P
Pin Number
1
P_I2C_SDA
Pin Number
1
P_MOSAIC_USB_DP
Pin Number
1
P_SIM_DET
Pin Number
1
P_CM_USB_DM
Pin Number
1
P_CM_RUN_RESET
Pin Number
1
P_I2C_SCL
Pin Number
1
P_5V_CM
Pin Number
1
P_3V3_AUX
Pin Number
1
P_BAT_2S
Pin Number
1
P_HUB_RESET
Pin Number
1
P_3V3_HUB
Pin Number
1
P_MOSAIC_USB_DM
Pin Number
1
P_MOSAIC_RESET
Pin Number
1
P_HUB_CLK
Pin Number
1
D_DC_IN_TVS
P_SYS_BUS
Pin Number
1
P_POE_RAW
Pin Number
1
P_3V3_GNSS
Pin Number
1
P_CM_USB_DP
Pin Number
1
P_3V3_LTE
Pin Number
1
P_LTE_PWR_EN
Pin Number
1
P_SERVICE_USB_DM
Pin Number
1
P_DC_RAW
Pin Number
1
P_ETH_TRD0_N
Pin Number
1
P_CHG_IN
Pin Number
1
P_CHASSIS
Pin Number
1
P_LTE_RESET
Pin Number
1
U_GNSS_BUCK
U_HUB_BUCK
U_LTE_BUCK
U_5V_BUCK
Q_CHG_BATFET_SYS
Q_DC_OR
Q_POE_OR
U_CM4
J_M2_LTE
L_CHG_POWER
Inductance
10µH
L_LTE_BUCK_REAL
Inductance
2.2uH
D_POE_IN_TVS
Q_CHG_BOOST_HS
Q_CHG_BUCK_HS
Q_CHG_BOOST_LS
L_HUB_BUCK
Inductance
2.2uH
Q_CHG_BUCK_LS
L_GNSS_BUCK
Inductance
2.2uH
L_5V_BUCK
Inductance
4.7uH
C_POE_Y_NEG
Capacitance
4700pF
D_ESD_ETH_B
Q_CHG_BATFET_BAT
F_BAT
D_ESD_ETH_A
J_ETH
C_CHASSIS_BOND
Capacitance
1000 pF
D_CHG_ACDRV_Z
Q_CHG_ACFET_SYS
Q_CHG_ACFET_IN
C_POE_Y_POS
Capacitance
4700pF
D_ESD_SIM
U_USBHUB
J_BAT
J_SIM
BR_POE_A
FB_POE_IN_N
C_POE_OUT_BULK_REAL
D_LTE_3V3_TVS
J_DC_IN
BR_POE_B
FB_POE_IN_P
Phase 1 Schematic Plan
Status: Execution plan for the first electrical skeleton.
Goal
Create a datasheet-backed architecture-validation schematic that proves compute, USB topology, power-path concept, reset/watchdog strategy, and major external interfaces before detailed layout or manufacturing claims.
Functional Sheets / Blocks
1. Top-Level Rails and Signals
  • Named rails: POE_RAW, DC_RAW, VIN_PROT, CHG_IN, BAT_2S, SYS_BUS, 5V_CM, 5V_GNSS, 3V3_LTE, 3V3_AUX, 3V3_HUB, 1V2_HUB if required, GND, CHASSIS.
  • Source priority and current-limit notes.
  • Test-point list for all rails and control signals.
2. CM4 Core Interface
  • CM4 connectors as committed Rev A target.
  • 5V input and decoupling.
  • RUN/reset/safe-shutdown path.
  • USB 2.0 upstream to hub.
  • Ethernet signals to Ethernet/PoE block.
  • I2C/SMBus to BQ25750 and fuel gauge.
  • GPIOs reserved for:
    • LTE reset.
    • LTE load-switch enable.
    • Mosaic reset.
    • Mosaic load-switch enable.
    • Watchdog heartbeat.
    • Charger interrupt/status.
    • Fuel gauge interrupt/status.
    • Power-good/status inputs.
    • Safe shutdown/reboot control.
3. USB2514Bi Hub
  • Upstream USB 2.0 to CM4.
  • Downstream port allocation:
    • Port 1: Mosaic/simpleRTK3B mini PCIe USB.
    • Port 2: Quectel EM05 M.2 USB.
    • Port 3: internal service USB.
    • Port 4: spare/test expansion if useful.
  • Hub reset, clock/crystal, configuration straps/EEPROM, decoupling, power-good, and overcurrent/power-enable policy.
4. Mosaic/simpleRTK3B Mini PCIe Interface
  • Mini PCIe connector wired for USB-only module operation.
  • Required power pins and clean GNSS power branch.
  • Reset line and optional load-switch footprint or 0 ohm bypass.
  • Presence/status pins only if required by module documentation.
  • No-connect treatment for unused PCIe/SIM pins after checking ArduSimple/Septentrio docs.
  • RF handling note: either module antenna connector or carrier RF connector strategy must be confirmed.
5. Quectel EM05 M.2 LTE Interface
  • M.2 B-key connector.
  • USB 2.0 D+/D- from hub.
  • 3.3V LTE rail, local bulk capacitance placeholder, and enable/power switching.
  • Reset/control pins per Quectel hardware guide.
  • SIM interface nets.
  • LTE main and diversity RF connector placeholders.
  • Required pull-ups/pull-downs and no-connect handling from Quectel docs.
6. Nano SIM and ESD
  • Nano SIM socket.
  • SIM_VCC, SIM_CLK, SIM_RST, SIM_DATA, optional card detect.
  • SIM ESD protection placed at connector in layout.
  • Series/filter components only if recommended by Quectel/SIM guidance.
7. PoE, DC Input, and BQ25750 Power Path
  • Integrated PoE+ PD module or placeholder selected after sourcing check.
  • Protected 9-36V DC input.
  • Source ORing/power mux concept.
  • BQ25750 with 2S Li-ion configuration, battery connector, 10k NTC, sense resistor placeholders, SMBus/I2C, INT/status, power-good and fault signals.
  • Input-current limit and charge-current policy notes.
8. Regulators and Load Switches
  • 5V_CM rail sized from budget.
  • 3V3_AUX rail.
  • USB hub rails including 1V2 if required.
  • 3V3_LTE rail with transient support.
  • GNSS/Mosaic clean rail.
  • Load-switch footprints or bypass jumpers for LTE and Mosaic.
  • Power-good signals routed to CM where useful.
9. Ethernet and PoE Interface
  • CM Ethernet pairs to magnetics/RJ45 concept.
  • PoE center-tap extraction path.
  • Surge/ESD placeholders.
  • Chassis/shield grounding strategy placeholder.
  • Controlled-impedance notes.
10. Watchdog and Reset Tree
  • Independent watchdog supervisor powered from an appropriate always-on rail.
  • Heartbeat GPIO from CM.
  • Reset output to CM RUN/reset path.
  • Manual/service reset or disable provision for debug.
  • Separate reset outputs or GPIO-driven reset nets for LTE and Mosaic.
Validation Gates Before Moving to Layout
  1. All main ICs/connectors exist in the Flux library or are created from datasheets.
  2. Every active component has datasheet-backed pin wiring and support passives.
  3. Power budget is updated with actual datasheet values.
  4. BQ25750 reference design checklist is complete.
  5. USB topology and port power/reset behavior are documented.
  6. CM4/CM5 compatibility matrix is updated.
  7. ERC/design review is clean or remaining warnings are documented.
Instantiation Status
2026-07-20: Phase 1 review skeleton instantiated in the schematic as terminal/net-portal markers rather than final datasheet-backed IC symbols. The concrete Flux library search did not return the real IC/connector symbols in this environment, so the current schematic intentionally captures the named rails, high-speed interfaces, RF paths, SIM signals, reset/control nets, watchdog nets, and charger/fuel-gauge telemetry nets for review.
Current schematic summary after instantiation:
  • 59 Terminal markers.
  • 58 Net Portal labels plus GND.
  • 59 named nets total.
  • Power/ground metadata applied to primary rails.
  • Controlled-impedance metadata applied to USB 2.0, Gigabit Ethernet, and RF nets.
  • ERC currently reports expected single-pin-net warnings because this is a boundary-marker skeleton, not the final wired IC schematic.
2026-07-20 update: Added the first real library symbols requested by the user:
  • U_CM4: Raspberry Pi Compute Module 4.
  • U_USBHUB: Microchip USB2514B-I/M2 USB hub.
  • U_CHG: Texas Instruments BQ25750RRVR charger/power-path controller.
  • J_M2_LTE: Amphenol MDT320B03001 M.2 B-key LTE modem socket.
  • J_MPCIE_GNSS: TE 1759547-1 mini PCIe socket for Mosaic/simpleRTK3B.
  • J_SIM: GCT SIM8060-6-0-14-00-A nano SIM socket.
Initial boundary-level wiring completed:
  • CM4 5V, GND, USB 2.0, Ethernet pairs, I2C telemetry, watchdog, reset, LTE/Mosaic control GPIOs.
  • USB2514B upstream and downstream USB ports, 3V3 power, reset, clock/config markers, GND.
  • BQ25750 I2C, INT, power-good, charge-enable, TS, SYS, VAC, battery sense, and ground pins.
  • Mini PCIe USB_D+/D-, 3.3VAUX pins, GND, and PERST# to Mosaic reset.
  • M.2 LTE USB_D+/D-, 3V3 LTE pins, GND, W_DISABLE1#, FULL_CARD_POWER_OFF#, RESET#, and SIM pins using provisional Quectel EM05-oriented mapping.
  • Nano SIM VCC/RST/CLK/DATA/GND wired; VPP marked no-connect.
Important rail correction: mini PCIe GNSS power is now represented by a clean 3V3_GNSS rail. The earlier 5V_GNSS skeleton marker remains provisional/reserved until the Mosaic/simpleRTK3B power requirements are checked against its documentation.
Current ERC status after this step: expected open warnings remain because many CM4, BQ25750 power-stage, USB hub support, M.2 optional, and mini PCIe optional pins are not yet intentionally no-connected or supported by passives/reference circuits. The next pass should add support passives, no-connect unused pins, and clean schematic placement/routing.
2026-07-20 update: Added first support passives and no-connect cleanup for the six-symbol pass.
Support passives added:
  • CM4: 10uF bulk and 0.1uF high-frequency bypass on 5V_CM.
  • LTE M.2 socket: provisional 100uF bulk and 0.1uF high-frequency bypass on 3V3_LTE.
  • GNSS mini PCIe socket: 10uF bulk on 3V3_GNSS.
  • SIM socket: 0.1uF decoupling on SIM_VCC.
  • USB2514B: 3V3 decoupling, CRFILT and PLLFILT 0.1uF capacitors, 12k 1% RBIAS, and 10k config/I2C pull-ups.
  • BQ25750: VAC, REGN, and DRV_SUP bypass capacitors; 10k pull-ups for SDA, SCL, INT, PG, and CE; provisional ICHG and ILIM_HIZ programming resistors.
No-connect cleanup completed:
  • CM4 unused HDMI, DSI, CSI, PCIe, SD, analog, LED, sync, wireless-disable, EEPROM-ID, reserved, and spare GPIO pins were marked no-connect for this headless USB/Ethernet carrier scope.
  • USB2514B unused downstream port 4, overcurrent/power-enable placeholders, and optional status pins were marked no-connect for this pass.
  • Mini PCIe unused PCIe/SIM/LED/SMBus/COEX/reserved pins were marked no-connect; mechanical pads tied to GND.
  • M.2 LTE unused optional pins were marked no-connect; mechanical pads tied to GND.
  • BQ25750 optional STAT1, STAT2, and FSW_SYNC were marked no-connect. Power-stage pins are intentionally still open because they require the TI reference-design implementation.
ERC after cleanup:
  • Remaining floating-pin warnings are primarily BQ25750 power-stage pins: BTST1/2, HIDRV1/2, LODRV1/2, SW1/2, ACDRV, BATDRV, BATSRC, FB/FBG, ACN/ACP. These should be resolved only when the BQ25750 reference power stage is added.
  • Remaining single-pin warnings are expected skeleton/interface markers: BAT_2S, CHASSIS, 5V_GNSS provisional/reserved, DC_OV_FAULT, RF markers, PoE center taps, DC_RAW, 1V2_HUB, and POE_RAW.
  • SIM VPP remains reported as a power input by the library symbol even though it is a legacy SIM programming-voltage contact and was marked no-connect. Do not tie it to SIM_VCC unless the Quectel/SIM reference design explicitly requires it.
Next implementation step: replace/augment these terminal markers with the real CM4 connector, USB2514Bi, BQ25750, mini PCIe, M.2 B-key, SIM socket, PoE/DC protection, regulator, load-switch, watchdog, and RF connector symbols after datasheet/library validation.
  • Goal

  • Functional Sheets / Blocks

  • 1. Top-Level Rails and Signals

  • 2. CM4 Core Interface

  • 3. USB2514Bi Hub

  • 4. Mosaic/simpleRTK3B Mini PCIe Interface

  • 5. Quectel EM05 M.2 LTE Interface

  • 6. Nano SIM and ESD

  • 7. PoE, DC Input, and BQ25750 Power Path

  • 8. Regulators and Load Switches

  • 9. Ethernet and PoE Interface

  • 10. Watchdog and Reset Tree

  • Validation Gates Before Moving to Layout

  • Instantiation Status