Started: Move component H1 away from the sensor’s optical window and rotate it for proper breadboard access, ensuring no overlap with the sensor aperture..
Rotating H1 for breadboard alignment...
0:08
Started: Rotate H1 for proper breadboard access and orientation..
No changes were made; all plan tasks require manual action.
Tasks I cannot perform for you (need to be done in the PCB editor):
Reposition and rotate header H1 to clear the sensor window
Define a mechanical keepout and copper keepout over the optical sensor aperture
Sever and reroute the 3V3, OUT, and GND traces around the keepout region
Update silkscreen labels for H1 and clear silkscreen around the sensor
Run DRC and ERC to verify no violations and correct connectivity
Success criteria status:
Header repositioned: not met
Keepout region with no copper: not met
Nets rerouted around aperture: not met
Silkscreen updated and DRC/ERC passed: not met
Next step:
Use the PCB layout editor’s Move/Rotate tools to relocate H1 away from the sensor, draw the keepout regions on the mechanical and copper layers, reroute the traces using the interactive router, update silkscreen items, then run DRC/ERC to verify compliance.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant