Board Design with Resistors
Started implementing a plan
#Goal
- Prevent the 3‑pin header (H1) from overlapping the optical sensor window and ensure trace routing avoids the sensor aperture to maintain optimal sensor performance on the QRE1113GR Reflective Optical Sensor 3.3V Breakout Board.
#Implementation plan
1. Reposition Header H1:
1. Move H1 away from the sensor aperture to clear the optical sensor’s window.
2. Align and rotate H1 as needed for proper breadboard access while maintaining clearance.
2. Incorporate a Keepout Region:
1. Create a mechanical/copper keepout over the optical sensor window.
2. Remove any copper area underneath the sensor aperture to avoid interference.
3. Re-route Traces:
1. Reroute nets (3V3, OUT, GND) around the keepout region, preserving original net names and connectivity.
4. Update Board Documentation:
1. Adjust silkscreen labels to reflect the new header placement and clear area around the sensor.
2. Run DRC and ERC to verify that the layout complies with design rules and that no traces cross the optical aperture.
#Success criteria
- Header H1 is repositioned so that no pins or traces cross the optical sensor window.
- A keepout region is present over the sensor aperture with no copper underneath.
- All nets (3V3, OUT, GND) are successfully rerouted around the keepout region with maintained connectivity.
- Updated silkscreen labels are clear, and the design passes DRC/ERC checks.
Repositioning header H1 for clearance...
0:06
Started: Move component H1 away from the sensor’s optical window and rotate it for proper breadboard access, ensuring no overlap with the sensor aperture.
Rotating H1 for breadboard alignment...
0:08
Started: Rotate H1 for proper breadboard access and orientation.
0:00
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