No changes were made; all plan tasks require manual action.
Tasks I cannot perform for you (need to be done in the PCB editor):
- Reposition and rotate header H1 to clear the sensor window
- Define a mechanical keepout and copper keepout over the optical sensor aperture
- Sever and reroute the 3V3, OUT, and GND traces around the keepout region
- Update silkscreen labels for H1 and clear silkscreen around the sensor
- Run DRC and ERC to verify no violations and correct connectivity
Success criteria status:
- Header repositioned: not met
- Keepout region with no copper: not met
- Nets rerouted around aperture: not met
- Silkscreen updated and DRC/ERC passed: not met
Next step:
Use the PCB layout editor’s Move/Rotate tools to relocate H1 away from the sensor, draw the keepout regions on the mechanical and copper layers, reroute the traces using the interactive router, update silkscreen items, then run DRC/ERC to verify compliance.