Determine board length (Y extents + 5 mm margin) and set PCB outline to 10 mm width
Configure a 4-layer stackup with dedicated 3.3 V and GND internal planes
Set up ground-fill on signal layers and define RF keep-out for the LTE module
Place all components per wearable constraints (HR sensor on skin side, mic at outer edge, tall-part zoning, RF keep-out)
[No tasks were marked as not doable.]
Success Criteria Review:
✅ Schematic complete with all required components, correct decoupling, ESD, and connections
❌ PCB layout not yet configured (outline, stackup, placement, routing)
Next step: Let’s configure the PCB outline and stackup (flux-agentic-workflow: Prepare PCB Layout). We’ll size the board to 10 mm × (calculated length), set up the 4-layer stackup, and assign internal planes before component placement.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant