Determine board length (Y extents + 5 mm margin) and set PCB outline to 10 mm width
Configure a 4-layer stackup with dedicated 3.3 V and GND internal planes
Set up ground-fill on signal layers and define RF keep-out for the LTE module
Place all components per wearable constraints (HR sensor on skin side, mic at outer edge, tall-part zoning, RF keep-out)
[No tasks were marked as not doable.]
Success Criteria Review:
✅ Schematic complete with all required components, correct decoupling, ESD, and connections
❌ PCB layout not yet configured (outline, stackup, placement, routing)
Next step: Let’s configure the PCB outline and stackup (flux-agentic-workflow: Prepare PCB Layout). We’ll size the board to 10 mm × (calculated length), set up the 4-layer stackup, and assign internal planes before component placement.
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
A momentary or non-latching switch which causes a temporary change in the state of an electrical circuit only while the switch is physically actuated. SWITCH TACTILE SPST-NO 0.05A 24V