Project Startup Help
Thought for 5 mins 28 sec
They’re still running. I’ll check final status once more and then give you the project links and current state so you’re not blocked waiting.
Worked for 21 sec
Created two separate PCB projects and started the split/place work in each:
- TX board: /timbochu/munkrofon-tx-pcb
- RX board: /timbochu/munkrofon-rx-pcb
Current status:
- TX clone: RX circuitry removed, board-mounted XLR replaced with compact XLR harness pads, 25 × 80 mm / 4-layer target set, placement still running.
- RX clone: TX circuitry removed, board-mounted XLR replaced with compact XLR harness pads, 25 mm width / 4-layer target set, placement still running.
- Master project remains unchanged as the system/reference design.
Open item:
- Both split-placement tasks are still running; they exceeded the wait window but are actively working on non-RF placement and verification.
Next step:
- Open each project link later to review the completed thread result, or ask me to check their status again.
Check split projects
Check TX status
Check RX status
Fix failed split tasks
Compare split BOMs
Refine this doc
Ask about this doc
Munkrofon Engineering Requirements Specification v1.0
Project: Munkrofon
Document status: Master Engineering Requirements Specification, Version 1.0
Revision basis: Prototype Revision A schematic and Phase 2 engineering handoff
Supersedes: Earlier informal design briefs wherever conflicts exist
Important status: Prototype Revision A remains Not Production Validated.
Document status: Master Engineering Requirements Specification, Version 1.0
Revision basis: Prototype Revision A schematic and Phase 2 engineering handoff
Supersedes: Earlier informal design briefs wherever conflicts exist
Important status: Prototype Revision A remains Not Production Validated.
1. Purpose and Authority
This Engineering Requirements Specification (ERS) is the controlling requirements document for Munkrofon. Future schematic revisions, PCB layout, firmware, mechanical design, testing, compliance work, and manufacturing preparation shall be checked against this document.
Requirement status definitions:
- Confirmed requirement: A design constraint or product need accepted as binding.
- Engineering assumption: A working assumption used for Rev A until confirmed by test or vendor documentation.
- Open decision: A required decision not yet finalized.
- Optimization opportunity: A candidate improvement that must not block Rev A unless promoted to a requirement.
Verification method definitions:
- Inspection: Review of schematic, PCB, BOM, layout, or documentation.
- Simulation: Circuit, power, thermal, or signal simulation.
- Bench test: Measurement on prototype hardware.
- Measurement: Instrumented quantitative test such as audio analyzer, oscilloscope, RF test set, or power analyzer.
- Regulatory test: Accredited or pre-compliance EMC/RF/safety testing.
- Vendor evidence: Datasheet, integration guide, reference design, SDK/license document, or written vendor confirmation.
2. Product Overview
Munkrofon is a compact professional wireless microphone transmitter/receiver PCB set for live audio. It is not a Bluetooth consumer-audio device. The target architecture is a low-latency DECT-class digital wireless link, balanced microphone input at the transmitter, true balanced XLR output at the receiver, and rechargeable single-cell Li-ion/LiPo power per unit.
3. System Architecture
3.1 Audio Block Diagram
Diagram
3.2 Power Block Diagram
Diagram
4. Requirements
4.1 Product and Use Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-SYS-001 | Confirmed | The product shall consist of a separate transmitter PCB and receiver PCB or clearly separable transmitter/receiver functional groups during prototype development. | Schematic and BOM identify TX and RX functional groups. | Enables independent optimization of mic input and line output units. | Inspection |
| REQ-SYS-002 | Confirmed | The system shall be intended for professional live sound reinforcement, not consumer Bluetooth audio. | Architecture uses DECT-class/pro-audio RF; Bluetooth audio modules are not used. | Live audio requires lower latency and stronger RF robustness than consumer Bluetooth. | Inspection |
| REQ-SYS-003 | Confirmed | Prototype Revision A shall be labeled Not Production Validated until all production-readiness dependencies are closed. | Project files and review reports include this label. | Prevents accidental use of exploratory design as release hardware. | Inspection |
| REQ-SYS-004 | Confirmed | Reliability, audio performance, RF performance, manufacturability, serviceability, and battery runtime shall be optimized in that priority order unless explicitly re-ranked. | Engineering review trade studies use this priority order. | Establishes decision hierarchy for design tradeoffs. | Inspection |
| REQ-SYS-005 | Confirmed | The design shall not be restarted from scratch during Phase 2. | Phase 2 changes are review/refinement changes against the Rev A baseline. | Preserves useful Rev A work and avoids churn. | Inspection |
| REQ-SYS-006 | Confirmed | PCB placement and routing shall not begin until Phase 2 engineering review deliverables are complete, unless a review identifies a necessary schematic correction. | Review plan completed before layout tasks begin. | Prevents layout work on unvalidated architecture. | Inspection |
4.2 Mechanical Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-MECH-001 | Confirmed | Each PCB shall target a maximum width of 25 mm. | Board outline width ≤25 mm unless documented exception is approved. | Matches original compact microphone form-factor target. | Inspection |
| REQ-MECH-002 | Engineering assumption | Preferred board length shall be approximately 60 mm, flexible if required by RF or connector constraints. | Length target documented during layout; exceptions justified. | Allows compact design while preserving RF and connector integrity. | Inspection |
| REQ-MECH-003 | Confirmed | RF module and antenna region shall be placed at a board end wherever practical. | Layout review confirms antenna/RF block near board edge. | Improves antenna clearance and RF performance. | Inspection |
| REQ-MECH-004 | Confirmed | Antenna keepout shall be free of copper, vias, ground pour, components, and nearby metal according to official RF vendor guidance. | Final layout passes antenna keepout review against vendor data. | Antenna detuning directly affects range and compliance. | Inspection / Vendor evidence |
| REQ-MECH-005 | Open decision | Final enclosure material, battery size, connector access, and antenna clearance shall be defined before production-intent PCB layout. | Mechanical interface control drawing or enclosure spec exists. | RF and audio connector placement depend on enclosure. | Inspection |
4.3 Electrical Architecture Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-ELEC-001 | Confirmed | All IC power and ground pins shall be connected or explicitly documented as unused/vendor-defined outputs. | ERC has no unexplained floating power pins. | Prevents silent nonfunctional hardware. | Inspection / ERC |
| REQ-ELEC-002 | Confirmed | Every active IC shall have local decoupling consistent with its datasheet. | Schematic/layout review confirms required caps near pins. | Reduces noise and improves stability. | Inspection |
| REQ-ELEC-003 | Confirmed | Generated rails shall have explicit bulk and high-frequency decoupling. | Rail capacitors present at charger, LDO, split-rail converter, codec, RF module, and audio ICs. | Supports load transients and reduces conducted noise. | Inspection / Bench test |
| REQ-ELEC-004 | Confirmed | Exposed external connectors shall include appropriate ESD/RFI protection or documented rationale for omission. | USB ESD present; XLR RFI/ESD/phantom-abuse protection reviewed before layout. | Stage equipment is exposed to ESD, cable transients, and RF ingress. | Inspection / EMC test |
| REQ-ELEC-005 | Open decision | Whether board-level battery protection is required shall be resolved before production. | Protected-cell requirement or board-level protection circuit is selected. | Prevents unsafe Li-ion abuse conditions. | Inspection / Vendor evidence |
4.4 RF System Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-RF-001 | Confirmed | The wireless link shall use a DECT-class professional audio RF platform unless a demonstrably equal or superior non-Bluetooth alternative is approved. | RF review documents chosen platform and rejects Bluetooth audio. | DECT-class links are better aligned with live low-latency reliability targets. | Engineering review |
| REQ-RF-002 | Engineering assumption | RTX1090/R1 with Sheerlink/Sheersound shall remain the leading RF candidate for Phase 2. | RF review maintains RTX1090/R1 as lead unless lifecycle, support, or integration data invalidates it. | Public evidence points to best pro-audio latency fit. | Vendor evidence / Engineering review |
| REQ-RF-003 | Confirmed | RTX1090/R1 shall not be treated as permanently selected until lifecycle, pricing, availability, SDK, licensing, and integration documentation are confirmed. | Production-readiness checklist marks these items closed before release. | Avoids lock-in to an unsupported RF platform. | Vendor evidence |
| REQ-RF-004 | Confirmed | The RF module shall remain a replaceable interface boundary. | RF module nets and schematic grouping are isolated; later swap affects minimal non-RF circuitry. | Reduces redesign risk if RF platform changes. | Inspection |
| REQ-RF-005 | Confirmed | The official RF hardware integration guide and reference layout shall be obtained before production-intent RF layout. | RTX/RMED schematic, layout/Gerbers, stackup, antenna guide, and BOM are archived. | RF layout cannot be validated from public snippets alone. | Vendor evidence |
| REQ-RF-006 | Confirmed | Antenna design shall follow approved RTX/RMED antenna geometry, matching, keepout, spacing, and diversity guidance. | Final antenna layout matches vendor guide or has written approval. | Antenna deviations can invalidate modular approval and range. | Inspection / Regulatory test |
| REQ-RF-007 | Engineering assumption | Rev A antenna components are placeholders only. | BOM and layout notes mark AE1–AE4 as non-production antenna placeholders. | Prevents compliance assumptions based on placeholder antennas. | Inspection |
| REQ-RF-008 | Open decision | Final RF transmit power, regional band configuration, pairing method, and RF test mode access shall be defined by firmware/integration documentation. | Firmware/RF integration file defines these parameters. | Needed for compliance and production test. | Vendor evidence / Bench test |
4.5 Audio Performance Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-AUD-001 | Confirmed | The transmitter shall accept a passive balanced dynamic microphone input through XLR. | XLR input uses pin 1 shield/ground, pin 2 hot, pin 3 cold. | Matches initial Sennheiser e604-class use case. | Inspection / Bench test |
| REQ-AUD-002 | Confirmed | The design shall not assume phantom-powered condenser microphones for Rev A. | No phantom-power supply is required for normal operation. | Simplifies prototype and matches dynamic mic target. | Inspection |
| REQ-AUD-003 | Confirmed | The receiver shall provide a true balanced professional XLR output, not pseudo-balanced output. | Balanced output driver or equivalent active differential line driver is present. | Professional mixers expect balanced outputs and CMRR. | Inspection / Measurement |
| REQ-AUD-004 | Engineering assumption | The target audio bandwidth shall be 20 Hz to 20 kHz minimum for the end-to-end system. | Audio analyzer confirms response within future tolerance limits to be defined. | Professional audio requires full-bandwidth performance. | Measurement |
| REQ-AUD-005 | Open decision | Final audio frequency-response tolerance shall be defined before production. | Example future criterion: 20 Hz–20 kHz within ±1 dB, or documented alternative. | Acceptance criteria must be measurable. | Engineering review |
| REQ-AUD-006 | Open decision | Final THD+N, SNR, dynamic range, and noise-floor targets shall be numerically defined before production. | Audio test plan contains limits and pass/fail thresholds. | Rev A has architecture but not validated audio metrics. | Measurement |
| REQ-AUD-007 | Confirmed | The microphone preamp shall be reviewed against THAT1580, THAT1512, INA217-class, INA333, and other suitable pro-audio alternatives. | Phase 2 component comparison matrix includes these options. | Preamp choice strongly affects noise and headroom. | Engineering review |
| REQ-AUD-008 | Engineering assumption | THAT1580 remains a high-performance Rev A mic preamp candidate. | Review confirms or recommends replacement before next schematic revision. | THAT1580 supports low-noise differential mic preamp operation. | Engineering review |
| REQ-AUD-009 | Confirmed | The balanced line driver shall be reviewed for output level, headroom, noise, supply voltage, and ability to drive mixer inputs. | THAT1646 review includes quantitative output/headroom analysis. | Output stage must be compatible with professional mixers. | Engineering review / Measurement |
| REQ-AUD-010 | Open decision | Final output nominal level and maximum level shall be defined. | Documented targets such as +4 dBu nominal and defined maximum headroom. | Supply rails and driver selection depend on output level. | Engineering review / Measurement |
| REQ-AUD-011 | Confirmed | The audio codec shall be reviewed against TI, Cirrus Logic, Analog Devices, AKM, and ESS alternatives where appropriate. | Codec comparison matrix exists. | Codec choice affects latency, SNR, firmware, and pin count. | Engineering review |
| REQ-AUD-012 | Engineering assumption | TLV320AIC3204 remains a Rev A codec candidate pending formal review. | Review confirms best fit or recommends replacement. | Current schematic uses this codec but RF audio mapping is provisional. | Engineering review |
4.6 Latency Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-LAT-001 | Confirmed | End-to-end audio latency shall be low enough for professional live performance. | Numeric latency target finalized before production. | Live performers are sensitive to latency. | Measurement |
| REQ-LAT-002 | Engineering assumption | The target architecture shall aim for analog-to-analog latency in the low single-digit millisecond class if using RTX Sheerlink/Sheersound. | Vendor evidence or prototype measurement supports configured latency. | Public RTX/RMED materials cite 2–7 ms depending configuration. | Vendor evidence / Measurement |
| REQ-LAT-003 | Open decision | The project shall define typical and worst-case latency targets, including RF interference and buffering conditions. | Latency test plan includes test conditions and pass/fail thresholds. | Typical-only latency is insufficient for live audio confidence. | Measurement |
4.7 Power System Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-PWR-001 | Confirmed | Each unit shall use a single-cell Li-ion/LiPo battery architecture unless a later review approves a different battery system. | Power tree shows 1S battery input. | Compact rechargeable handheld/wireless form factor. | Inspection |
| REQ-PWR-002 | Confirmed | Each unit shall support USB-C charging. | USB-C connector, CC pull-downs, and charger input path present. | User-friendly rechargeable power. | Inspection / Bench test |
| REQ-PWR-003 | Confirmed | USB-C sink implementation shall include independent CC1 and CC2 pull-down resistors. | 5.1 kΩ pulldown present on CC1 and CC2 per unit. | Required for USB-C sink power advertisement. | Inspection |
| REQ-PWR-004 | Engineering assumption | Default charge current shall be approximately 500 mA for Rev A. | Charger programming resistor calculated for ~500 mA. | Balances charge time with thermal limits on compact PCB. | Inspection / Bench test |
| REQ-PWR-005 | Confirmed | Charger and power-path architecture shall be reviewed for heat, noise, power-state behavior, and operation while charging. | Phase 2 power review includes these topics. | Charger noise and heat may affect audio/RF performance. | Engineering review / Bench test |
| REQ-PWR-006 | Open decision | Battery capacity shall be selected from approximately 800, 1000, or 1200 mAh after runtime/mechanical review. | Selected cell documented with dimensions and discharge/charge ratings. | Runtime and enclosure size tradeoff. | Inspection / Bench test |
| REQ-PWR-007 | Confirmed | Runtime shall be estimated for 800 mAh, 1000 mAh, and 1200 mAh cells. | Power-state report includes runtime table. | Allows product/mechanical tradeoff. | Analysis |
| REQ-PWR-008 | Engineering assumption | 3.3 V regulated rails are required for digital/RF I/O and codec support circuitry. | 3.3 V rails exist and are sized for load. | Common rail for RF module I/O, codec I/O, and support devices. | Inspection / Bench test |
| REQ-PWR-009 | Engineering assumption | ±5 V analog rails are used in Rev A for THAT1580/THAT1646 support. | TPS65131 split-rail supplies exist in schematic. | Selected audio ICs require dual analog rails for proper operation/headroom. | Inspection / Measurement |
| REQ-PWR-010 | Open decision | The split-rail analog supply shall be reviewed for necessity, noise, size, efficiency, and alternatives. | Phase 2 power review recommends keep/remove/replace. | Split rails add component count and current draw. | Engineering review / Measurement |
| REQ-PWR-011 | Open decision | MAX17048 fuel gauge shall be justified or removed. | Review states whether battery SOC reporting is needed. | Fuel gauge adds cost, I²C dependency, and BOM complexity. | Engineering review |
4.8 Power-State Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-STATE-001 | Confirmed | Phase 2 shall define operating states: Off, USB connected, Charging, Idle, Paired, Streaming, Low Battery, Sleep, and Shutdown. | Power-state diagram exists. | Required for power, firmware, and user behavior design. | Inspection |
| REQ-STATE-002 | Confirmed | Each power state shall identify active rails, estimated current draw, and wake sources. | Power-state table contains these fields. | Supports runtime and firmware planning. | Analysis |
| REQ-STATE-003 | Open decision | The wake mechanism from sleep/shutdown shall be selected. | Wake sources are assigned to RF, button, USB, charger, or other event. | Impacts standby current and UX. | Engineering review / Bench test |
4.9 USB and External Interface Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-USB-001 | Confirmed | USB-C shall be used for charging input. | USB-C connector in schematic and layout. | Modern connector and user convenience. | Inspection |
| REQ-USB-002 | Engineering assumption | USB data lines are unused but ESD-protected in Rev A. | D+/D− are connected to ESD protection and marked unused/protected. | Allows future debug/data option while keeping Rev A charging-focused. | Inspection |
| REQ-USB-003 | Open decision | Final USB data role shall be decided before production. | Firmware/hardware spec states charging-only, device, debug, or update role. | Affects routing, ESD, firmware, and compliance. | Engineering review |
| REQ-USB-004 | Confirmed | USB shield/chassis grounding strategy shall be defined before PCB layout. | Layout notes define direct, RC, capacitive, or chassis strategy. | Shield grounding affects EMC and audio hum. | Inspection / EMC test |
4.10 Firmware Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-FW-001 | Open decision | RF firmware/SDK ownership shall be established before production. | RTX/RMED SDK/license/programming documents obtained. | RF module behavior depends on vendor firmware. | Vendor evidence |
| REQ-FW-002 | Open decision | Pairing, provisioning, and regional configuration process shall be defined. | Firmware spec describes pairing/user flow and regional locks. | Required for usability and compliance. | Inspection / Bench test |
| REQ-FW-003 | Open decision | Codec initialization, clocking, sample rate, bit depth, and audio routing shall be defined. | Firmware spec includes codec register configuration. | Audio path cannot be validated without initialization details. | Bench test |
| REQ-FW-004 | Engineering assumption | 24-bit / 48 kHz audio remains the target digital-audio format until RF/codec review confirms. | Review either confirms or replaces target. | Public Sheerlink materials cite 24-bit/48 kHz. | Engineering review / Measurement |
4.11 Clocking Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-CLK-001 | Open decision | The RF module/codec clock-master relationship shall be defined by vendor integration evidence or engineering review. | Clock tree identifies master/slave roles for MCLK/BCLK/WCLK. | Audio stability and latency depend on clocking. | Vendor evidence / Bench test |
| REQ-CLK-002 | Confirmed | Audio clock nets shall be treated as layout-sensitive digital signals. | PCB layout applies short routes, controlled return paths, and separation from analog inputs. | Prevents jitter/noise coupling. | Inspection |
4.12 EMC, ESD, and Grounding Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-EMC-001 | Confirmed | Analog, RF, digital, and power-switching sections shall be physically separated in PCB layout. | Placement review shows separation and controlled return paths. | Reduces noise coupling. | Inspection |
| REQ-EMC-002 | Confirmed | A continuous low-impedance ground reference shall be maintained under high-speed/RF/digital return paths unless vendor RF guidance requires otherwise. | Layout review confirms no problematic return-path splits. | Return-path disruption causes EMI and signal integrity issues. | Inspection |
| REQ-EMC-003 | Confirmed | Switching regulator loops shall be minimized and kept away from sensitive mic preamp and antenna regions. | TPS65131 layout review follows datasheet loop guidance. | Split rails can inject noise into audio/RF. | Inspection / Measurement |
| REQ-EMC-004 | Confirmed | XLR input and output shall include RFI/ESD/abuse protection review before layout. | Protection strategy documented for pin 1, hot/cold, chassis, and phantom-power abuse. | Stage cables are hostile EMC paths. | Engineering review / EMC test |
| REQ-EMC-005 | Confirmed | USB data and VBUS shall include ESD protection. | ESD protection present in schematic and placed near connector in layout. | USB connector is user-accessible. | Inspection |
4.13 Regulatory Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-REG-001 | Confirmed | The project shall maintain a Technical Construction File for wireless/regulatory evidence. | Regulatory file exists and is kept current. | Wireless product certification requires traceable evidence. | Inspection |
| REQ-REG-002 | Open decision | Applicability of RTX1090R1 modular approval shall be confirmed for the final antenna, enclosure, layout, firmware, and region. | Vendor evidence or compliance plan documents conditions. | Deviations can invalidate modular approval. | Vendor evidence / Regulatory test |
| REQ-REG-003 | Confirmed | Final product shall meet applicable FCC/CE/ISED/MIC/UKCA requirements for target markets. | Compliance test reports or accepted modular-approval evidence exist. | Required for legal sale/use. | Regulatory test |
| REQ-REG-004 | Confirmed | Battery-powered safety and USB charging shall be reviewed against applicable safety expectations. | Safety analysis and charger thermal tests completed. | Li-ion charging introduces safety risk. | Inspection / Bench test |
4.14 Environmental and Reliability Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-ENV-001 | Engineering assumption | Prototype operating environment is indoor/outdoor live performance with non-condensing humidity. | Final environmental range documented before production. | Live audio use may include heat, sweat, transport, and vibration. | Inspection |
| REQ-ENV-002 | Open decision | Operating temperature range shall be defined before production. | Temperature range appears in final requirements and BOM review. | Part selection and battery behavior depend on environment. | Engineering review |
| REQ-REL-001 | Confirmed | Connectors and mechanically stressed parts shall be placed to reduce solder-joint strain, especially near RF module LGA parts. | Layout/mechanical review checks stress points. | RTX public datasheet warns about mechanical forces near module. | Inspection |
| REQ-REL-002 | Confirmed | Serviceability shall be considered for battery connector, USB-C, XLR connectors, programming/test access, and RF module replacement risk. | Phase 2 manufacturability/serviceability review includes these items. | Improves prototype debugging and repair. | Engineering review |
4.15 Manufacturability and Production Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-MFG-001 | Confirmed | Design shall use standard commercially available components where possible. | BOM review flags obsolete/NRND/custom/high-risk parts. | Improves buildability and supply chain. | Inspection |
| REQ-MFG-002 | Confirmed | Preferred distributors shall include DigiKey, Mouser, and LCSC where practical. | BOM sourcing review includes distributor availability. | Matches sourcing preference and prototype accessibility. | Inspection |
| REQ-MFG-003 | Confirmed | Component count and PCB area shall be reviewed for reduction before layout. | Phase 2 manufacturability review contains prioritized simplification list. | Current Rev A may be over-complex due to exploratory design. | Engineering review |
| REQ-MFG-004 | Engineering assumption | 4-layer PCB is preferred for RF/audio prototype unless review proves 2-layer is adequate. | Stackup decision documented before placement. | RF/audio return paths benefit from solid reference planes. | Engineering review |
| REQ-MFG-005 | Confirmed | All generic passives shall receive production package/value/rating review before manufacturing export. | BOM has package, voltage/current/power ratings populated. | Generic components are placeholders until package/rating locked. | Inspection |
| REQ-MFG-006 | Open decision | Production programming/test process for RF modules shall be defined. | Test pads, UART/SWD/USB access, and firmware loading flow documented. | Required for manufacturing. | Vendor evidence / Bench test |
4.16 Testability Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-TEST-001 | Confirmed | Prototype shall expose practical test access for power rails, charger status, RF/debug interface, audio input/output, and battery. | Test-point plan exists before layout. | Simplifies bring-up and failure analysis. | Inspection |
| REQ-TEST-002 | Confirmed | Bring-up shall verify rails before installing/activating sensitive RF/audio functions. | Bring-up plan includes rail-by-rail checklist. | Prevents damaging ICs and helps isolate faults. | Bench test |
| REQ-TEST-003 | Confirmed | Audio test plan shall include gain, clipping, frequency response, noise, THD+N, and balanced-output behavior. | Audio test procedure exists with pass/fail limits. | Audio quality is a primary product objective. | Measurement |
| REQ-TEST-004 | Confirmed | RF test plan shall include pairing, range, dropout behavior, coexistence/interference, TX power, antenna behavior, and latency. | RF test procedure exists. | RF performance is a primary product objective. | Measurement / Regulatory test |
| REQ-TEST-005 | Confirmed | Power test plan shall include current draw per state, runtime estimate validation, charger temperature, and low-battery behavior. | Power-state measurements are recorded. | Battery runtime is a priority. | Measurement |
4.17 Serviceability Requirements
Table
| ID | Status | Requirement | Acceptance criteria | Rationale | Verification |
|---|---|---|---|---|---|
| REQ-SVC-001 | Confirmed | Battery connection shall be accessible enough for prototype replacement/service unless enclosure constraints prohibit it. | Mechanical/layout review confirms battery access concept. | Batteries are likely service/replacement items. | Inspection |
| REQ-SVC-002 | Confirmed | Critical connectors shall be mechanically robust and replaceability considered during layout. | Connector footprint/strain relief reviewed. | USB-C and XLR see repeated use. | Inspection |
| REQ-SVC-003 | Open decision | Field firmware update path shall be defined or explicitly rejected. | Firmware requirements document states update method. | RF/audio firmware may need updates during development. | Engineering review |
5. Verification Matrix Summary
Table
| Verification type | Applies to | Required deliverables |
|---|---|---|
| Inspection | Schematic, BOM, layout, stackup, test points, grounding, mechanical constraints | Design review report, layout review checklist |
| Simulation | Regulators, analog rails, audio filters/gain where practical | Simulation files/results or documented rationale for omission |
| Bench test | Rails, charger, runtime, audio path, RF bring-up, latency | Bring-up report and measurement logs |
| Measurement | Audio THD+N/SNR/frequency response/noise, latency, current draw | Audio/RF/power measurement reports |
| Regulatory test | RF/EMC/safety | Pre-scan reports and final certified reports |
| Vendor evidence | RF module, SDK, reference layout, modular approval | Archived RTX/RMED documents and written confirmations |
6. Outstanding Risks and Assumptions
Table
| ID | Risk / assumption | Impact | Mitigation |
|---|---|---|---|
| RISK-001 | RTX1090/R1 integration package is not yet available. | RF/audio interface, layout, antenna, and firmware may change. | Obtain official RTX/RMED package before production layout. |
| RISK-002 | Current RF-to-codec pin mapping is provisional. | Prototype may not run Sheerlink firmware as wired. | Confirm codec/interface mapping with RTX/RMED. |
| RISK-003 | Antenna placeholders are not production antennas. | Range/compliance claims are invalid until antenna design is replaced. | Use official RTX1x90EVK antenna layout or approved antenna design. |
| RISK-004 | ±5 V split rails add size, current draw, and switching noise. | Battery runtime and audio noise may suffer. | Phase 2 power/audio review alternatives. |
| RISK-005 | MAX17048 may be unnecessary. | Adds BOM and firmware complexity. | Battery optimization review may remove it. |
| RISK-006 | USB data role unresolved. | Layout/firmware/test access may change. | Decide charging-only vs debug/update before layout. |
| RISK-007 | Current ERC has missing-power warnings around generated/internal/provisional rails. | Could hide real power mistakes if not reviewed carefully. | Resolve or explicitly justify each before next schematic revision. |
| RISK-008 | XLR phantom-power abuse and RFI protection are incomplete. | Stage use could damage input/output or inject noise. | Add/review protection before layout. |
7. Change Control
- Future AI or human changes shall cite affected requirement IDs.
- New requirements shall receive unique IDs and be added here.
- Conflicts between earlier documents and this ERS shall be resolved in favor of this ERS unless the user explicitly approves an ERS revision.
1. Purpose and Authority
2. Product Overview
3. System Architecture
3.1 Audio Block Diagram
3.2 Power Block Diagram
4. Requirements
4.1 Product and Use Requirements
4.2 Mechanical Requirements
4.3 Electrical Architecture Requirements
4.4 RF System Requirements
4.5 Audio Performance Requirements
4.6 Latency Requirements
4.7 Power System Requirements
4.8 Power-State Requirements
4.9 USB and External Interface Requirements
4.10 Firmware Requirements
4.11 Clocking Requirements
4.12 EMC, ESD, and Grounding Requirements
4.13 Regulatory Requirements
4.14 Environmental and Reliability Requirements
4.15 Manufacturability and Production Requirements
4.16 Testability Requirements
4.17 Serviceability Requirements
5. Verification Matrix Summary
6. Outstanding Risks and Assumptions
7. Change Control
