I’ll implement dual 5V inputs with ideal‑diode ORing, separate 3.3 V rails for MCU and sensors, and brownout immunity within the 40×30 mm, 4‑layer constraints.
Planned steps:
Inputs/ORing, then two regulated rails (+3V3_MCU, +3V3_SENS) with beads/decoupling, then UVLO + reset supervisor, test points, and layout constraints.
Click Start on the plan bar to execute.
Quick confirmations:
Expected max/typ current for +3V3_MCU and +3V3_SENS?
PWR1/PWR2 source and connector types (USB‑C, JST, header) and need for TVS?
Preference: low‑noise LDO for sensors vs high‑efficiency buck (or buck->LDO)?
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant