Seeed Studio XIAO ESP32S3 leverages 240MHz Xtensa 32-bit LX7 dual-core processor, supporting both WiFi and BLE 5.0 wireless connectivities, a 2.4GHz Rod antenna, allows for deep sleep mode with power consumption as low as 14μA while supporting lithium battery charging management. Ideal for the Internet of Things, Smart Homes, Wireless wearable devices, Robotics, etc. #SeeedStudio #xiao

MAX-M10 RF Receiver BeiDou, Galileo, GLONASS, GPS, GNSS 1.561GHz, 1.575GHz, 1.602GHz -167dBm 921.6kbps Not Included Module The MAX-M10S-00B is a professional-grade, ultra-low-power GNSS positioning module from u-blox based on the u-blox M10 platform. It is designed for battery-powered applications such as asset trackers, wearables, IoT devices, and navigation systems. The module supports simultaneous reception of multiple GNSS constellations, providing high positioning availability, fast acquisition times, and excellent sensitivity even in challenging urban or weak-signal environments. It integrates a TCXO, LNA, and SAW filter to improve RF performance while maintaining very low power consumption. Key Features Multi-constellation GNSS receiver: GPS Galileo GLONASS BeiDou QZSS SBAS support (WAAS, EGNOS, MSAS, GAGAN) Concurrent tracking of up to four GNSS constellations for improved position availability and accuracy. Ultra-low power consumption: Approximately 25 mW in continuous tracking mode, making it ideal for battery-powered devices. High RF sensitivity: Tracking sensitivity up to −167 dBm for reliable operation in weak-signal conditions. High positioning accuracy: Typical position accuracy of approximately 1.5 m CEP under suitable conditions. Navigation update rate: Up to 10 Hz for responsive tracking applications. Integrated RF front-end: Built-in LNA (Low Noise Amplifier) Built-in SAW filter Integrated TCXO for stable operation. Supports Assisted GNSS services: AssistNow Online AssistNow Offline AssistNow Autonomous CloudLocate support for low-power IoT positioning. Communication interfaces: UART I²C NMEA and UBX protocols supported. Wide operating temperature range: −40°C to +85°C. Supply voltage: 1.76 V to 3.6 V. Typical Applications Asset tracking devices Wearable electronics Fleet management systems Industrial IoT Smart meters Drone and robotics navigation Personal navigation devices Timing and synchronization systems Package Information Package Type: Surface-mount LCC module Dimensions: 9.7 mm × 10.1 mm × 2.5 mm (typical module size) #Commonpartslibrary #RF #Wireless #RFreceivers #MAXM10S #uBlox #GNSS #GPS #Galileo #GLONASS #BeiDou #QZSS #NavigationModule #GNSSModule #GPSTracking #AssetTracking #IoT #IndustrialIoT #WearableTech #FleetManagement #DroneNavigation #EmbeddedSystems #ElectronicsDesign #PCBDesign #HardwareEngineering #LowPowerDesign #LocationTracking #Geolocation #RFDesign #LNA #SMTModule

6 to 50 V, Triple half-bridge gate driver with programmable currents and SPI configuration Motor Driver NMOS SPI 48-VFQFPN (6x6) STDRIVE102BP is a highly integrated triple half-bridge gate driver designed for driving 3-phase brushless DC (BLDC) motors. It can control six external N-channel MOSFETs with programmable gate drive currents, enabling optimized switching performance and reduced EMI. The device features SPI-configurable settings, integrated charge pump circuitry for 100% high-side duty-cycle operation, built-in voltage regulators, programmable analog front-end blocks, and comprehensive protection mechanisms, making it suitable for battery-powered motor control applications such as power tools, vacuum cleaners, e-bikes, robotics, and industrial automation. Key Features Triple half-bridge gate driver for 3-phase BLDC motor control Operating supply voltage range: 6 V to 50 V Programmable gate drive capability up to: 1 A source current 2 A sink current Integrated charge pump supporting 100% high-side duty cycle Embedded 12 V LDO regulator for gate-drive circuitry Embedded 3.3 V LDO regulator for low-voltage circuitry SPI-configurable parameters and diagnostic functions Up to three programmable-gain amplifiers (PGAs) Up to three high-speed comparators VDS monitoring for MOSFET protection Thermal shutdown protection Undervoltage lockout (UVLO) protection Dual control modes (ENx/INx or INHx/INLx) TTL-compatible logic inputs up to 5 V Ultra-low standby current consumption (<50 nA) Matched propagation delay across all channels #CommonPartsLibrary #IntegratedCircuit #STDRIVE102BP #STMicroelectronics #GateDriver #BLDCMotor #MotorControl #ThreePhaseMotor #MOSFETDriver #PowerTools #Robotics #IndustrialAutomation #EBike #SPI #BrushlessMotor #EmbeddedSystems #PowerElectronics

Micro-Fit+ Right-Angle Header, 3.00mm Pitch, Dual Row, 10 Circuits, UL 94V-0, Glow-Wire Capable Connector Header Through Hole, Right Angle 10 position 0.118" (3.00mm) The 2125281000 is a Molex Micro-Fit+ right-angle PCB header connector designed for compact and reliable wire-to-board power connections in industrial, embedded, and automotive-adjacent applications. It features a 3.00 mm pitch, dual-row 10-circuit configuration (2x5), and through-hole mounting for strong mechanical retention. The connector supports high-current applications while maintaining a compact footprint. Key Features Manufacturer: Molex Series: Micro-Fit+ MPN: 2125281000 Connector Type: Right-angle PCB header Mounting Type: Through-hole Orientation: Right-angle / side-entry Pitch: 3.00 mm Positions: 10 circuits (2x5) Current Rating: Up to 12.5 A per contact Voltage Rating: 600V AC/DC Contact Plating: Matte tin Housing Material: Glass-filled Liquid Crystal Polymer (LCP) Operating Temperature: -40°C to +105°C Shrouded Design: 4-wall shrouding for secure mating Locking Feature: Locking ramp and board lock for vibration resistance Flammability Rating: UL94 V-0 Glow-Wire Capable: Suitable for safety-focused designs Application: Power and wire-to-board connections Typical Applications Power distribution boards Embedded systems Industrial control equipment Robotics Battery-powered devices Automotive support electronics High-current peripheral connections #CommonPartsLibrary #Connector

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

PCB-Mount DC Power Connector – 3-position female PCB power connector for high-current DC power distribution in RC, drones, robotics, battery-powered, and embedded systems. Features through-hole (THT) PCB mounting, 90° right-angle orientation, gold-plated brass contacts, 15 A continuous current rating, 500 V DC rated voltage, and ≤0.8 mΩ contact resistance. Constructed with a UL94 V-0 flame-retardant PA housing, supports approximately 1,000 mating cycles, and operates over a −20°C to +120°C temperature range. Designed for direct PCB mounting with secure, low-resistance power connections. #AMASS #MR30PWFB #MR30 #PowerConnector #DCConnector #PCBConnector #HighCurrentConnector #ThroughHole #RightAngle #GoldPlatedContacts #BatteryConnector #Robotics #EmbeddedSystems