JST XH Connector Header Through Hole 2 position 0.098" (2.50mm) B2B-XH-A(LF)(SN) is a 2-position, 2.50 mm pitch, through-hole shrouded male PCB header from the JST XH Series. It is designed for reliable wire-to-board connections in consumer electronics, industrial equipment, power supplies, battery packs, and embedded systems. The connector features a polarized shrouded housing to prevent incorrect mating and supports secure, dependable electrical connections with easy PCB assembly. Key Features: 2-position wire-to-board header 2.50 mm contact pitch Through-hole (THT) PCB mounting Straight vertical orientation Shrouded housing with polarization to prevent misalignment Rated for up to 3 A current and 250 V AC/DC Tin-plated brass contacts for reliable conductivity Operating temperature range: -25°C to +85°C Compatible with JST XH Series crimp housings and terminals Ideal for power and signal connections in compact electronic assemblies. #JST #XHSeries #PCBHeader #WireToBoard #Connector #ThroughHole #THT #ShroudedHeader #2Position #25mmPitch #Electronics #EmbeddedSystems #IndustrialElectronics #PowerConnector #PCBDesign

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A SOT-23-6 Thin, TSOT-23-6 The AP63200/AP63201/AP63203/AP63205 is a 2A, synchronous buck converter with a wide input voltage range of 3.8V to 32V and fully integrates a 125mΩ high-side power MOSFET and a 68mΩ low-side power MOSFET to provide high-efficiency step-down DC/DC conversion. The AP63200/AP63201/AP63203/AP63205 device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network. The AP63200/AP63201/AP63203/AP63205 has optimized designs for Electromagnetic Interference (EMI) reduction. The converter features Frequency Spread Spectrum (FSS) with a switching frequency jitter of ±6%, which reduces EMI by not allowing emitted energy to stay in any one frequency for a significant period of time. It also has a proprietary gate driver scheme to resist switching node ringing without sacrificing MOSFET turn-on and turn-off times, which further erases highfrequency radiated EMI noise caused by MOSFET switching. The device is available in a low-profile, TSOT26 package. • VIN 3.8V to 32V • 2A Continuous Output Current • 0.8V ±1% Reference Voltage • 22µA Ultralow Quiescent Current • Switching Frequency o 500kHz: AP63200 and AP63201 o 1.1MHz: AP63203 and AP63205 • Pulse Width Modulation (PWM) Regardless of Output Load o AP63201 • Supports Pulse Frequency Modulation (PFM) o AP63200, AP63203, and AP63205 o Up to 80% Efficiency at 1mA Light Load o Up to 88% Efficiency at 5mA Light Load • Fixed Output Voltage o 3.3V: AP63203 o 5.0V: AP63205 • Proprietary Gate Driver Design for Best EMI Reduction • Frequency Spread Spectrum (FSS) to Reduce EMI • Precision Enable Threshold to Adjust UVLO • Protection Circuitry o Overvoltage Protection o Cycle-by-Cycle Peak Current Limit o Thermal Shutdown • 12V and 24V distributed power bus supplies • Flat screen TV sets and monitors • Power tools and laser printers • White goods and small home appliances • FPGA, DSP, and ASIC supplies • Home audios • Network systems • Set top boxes • Gaming consoles • Consumer electronics #commonpartslibrary #integratedcircuit #AP63203WU7 #BuckConverter #DCDCConverter #PowerManagement #VoltageRegulator #SynchronousBuck #EmbeddedSystems #IndustrialElectronics #PowerSupply #DiodesInc #3V3Power #ElectronicsDesign

N-Channel 100 V 100A (Tc) 2.5W (Ta), 139W (Tc) Surface Mount PG-TDSON-8-7 BSC040N10NS5ATMA1 is a high-performance 100V N-Channel Power MOSFET from Infineon's OptiMOS™ 5 family. It is designed for high-efficiency switching applications such as switched-mode power supplies (SMPS), synchronous rectification, DC-DC converters, motor drives, battery-powered systems, and industrial power management. The device features extremely low on-resistance, high current capability, and excellent thermal performance, making it suitable for demanding power conversion applications. Key Features N-Channel Enhancement Mode MOSFET 100V Drain-to-Source Voltage (VDS) Ultra-low RDS(on): 4.0 mΩ max @ VGS = 10V Continuous Drain Current up to 100A (package limited) Optimized for high-performance SMPS and synchronous rectification Low gate charge for improved switching efficiency 100% avalanche tested for enhanced robustness Superior thermal resistance and power dissipation Wide operating junction temperature range: -55°C to +150°C RoHS compliant and halogen-free Compact PG-TDSON-8 / SuperSO8 package for high power density designs Typical Applications DC-DC Converters Synchronous Rectifiers Motor Control Battery Management Systems (BMS) Telecom and Industrial Power Supplies Solar Power Systems High-Current Switching Circuits #Infineon #OptiMOS5 #MOSFET #NChannelMOSFET #PowerMOSFET #100V #LowRDSon #SMPS #DCDCConverter #MotorDrive #PowerElectronics #IndustrialElectronics #BSC040N10NS5ATMA1 #HighEfficiency #SynchronousRectification

2 Position Wire to Board Terminal Block Horizontal with Board 0.150" (3.81mm) Through Hole ## Engineering Specification ## General Description The **1727010** is a Phoenix Contact **MKDS series PCB terminal block** designed for secure wire-to-board electrical connection in printed circuit board assemblies. It provides a compact screw-clamp termination interface for connecting external conductors to PCB circuitry. The component is suitable for industrial electronics, automation equipment, control modules, power interfaces, instrumentation, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1727010** Manufacturer: **Phoenix Contact** Product Name: **MKDS 1/ 2-3,81** Product Series: **MKDS** Product Line: **COMBICON Terminals** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Termination Method: **Screw Connection with Tension Sleeve** Mounting Type: **Through-Hole PCB Mount** ## Functional Description The device functions as a fixed PCB terminal block that allows external wires to connect directly to the printed circuit board. The screw-clamp mechanism provides both mechanical conductor retention and electrical continuity between the field wiring and PCB circuit. This makes the component suitable for applications where wiring must be secure, serviceable, and accessible during installation or maintenance. ## Mechanical Description The terminal block uses a compact housing with side-entry conductor access and through-hole solder pins for stable PCB attachment. Its construction supports organized wire routing and practical access for conductor insertion and screw tightening. The design is suitable for compact board layouts where reliable field wiring connection is required. ## Electrical Description The component is intended for signal and low-voltage power connection applications within the manufacturer’s specified electrical ratings. It provides stable electrical contact when used with compatible conductor sizes, correct wire preparation, and proper screw tightening torque. ## Material and Contact Description The terminal block uses an insulating housing with internal conductive contact elements that transfer current from the inserted conductor to the soldered PCB pins. The screw connection with tension sleeve helps maintain reliable contact pressure and secure conductor retention during normal operating conditions. ## Mounting and Assembly Description The **1727010** is intended for through-hole solder mounting on a printed circuit board. The PCB layout should follow the manufacturer’s recommended hole size, pad pattern, spacing, and soldering guidance. The component should be positioned to allow safe wire insertion, screwdriver access, and adequate clearance from nearby components or enclosure walls. ## Application Suitability The device is suitable for industrial control boards, automation modules, power supply interfaces, relay boards, instrumentation equipment, sensor wiring interfaces, building control systems, communication hardware, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for conductor size compatibility, current requirement, voltage rating, tightening torque, creepage and clearance spacing, solder joint strength, wire routing, and service access. The terminal block should not be used beyond the manufacturer’s specified electrical, mechanical, or environmental limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkds #combicon #wiretoboard #screwterminal #fixedterminalblock #throughholecomponent #soldermount #connector #interconnect #fieldwiring #industrialelectronics #automationequipment #controlsystems #powerinterface #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #engineeringparts #componentlibrary #electronicsengineering

2 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole ## Engineering Specification ## General Description The **1726040** is a Phoenix Contact **MKKDSN series PCB terminal block** designed for wire-to-board electrical connections in printed circuit board assemblies. It is used to provide a secure screw-clamp interface between external wiring and PCB circuitry. The component is suitable for control systems, industrial electronics, power distribution circuits, automation equipment, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1726040** Manufacturer: **Phoenix Contact** Product Series: **MKKDSN** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Mounting Type: **Through-Hole PCB Mount** Termination Method: **Screw Connection** ## Functional Description The device functions as a fixed printed circuit board terminal block that allows external conductors to be connected directly to a PCB. The screw-clamp mechanism secures the wire mechanically and electrically, providing a stable connection for signal or power circuits. The terminal block is intended for applications where field wiring must be removable, serviceable, and mechanically secure. ## Mechanical Description The component uses a compact green housing suitable for PCB-mounted assemblies. It is designed for side-entry conductor connection and horizontal board installation. The terminal block construction supports organized wire routing and convenient access for installation, maintenance, and service work. ## Electrical Description The terminal block is intended for low-voltage power and signal applications within the manufacturer’s specified current and voltage ratings. It provides reliable conductor contact when properly installed with compatible wire sizes and appropriate tightening torque. ## Material and Contact Description The connector housing is typically made from insulating material suitable for electrical safety and PCB assembly use. The internal conductive elements provide the electrical path between the inserted wire and the soldered PCB connection. Proper conductor preparation and screw tightening are required to maintain stable electrical performance. ## Mounting and Assembly Description The component is intended for through-hole solder mounting on a printed circuit board. Proper PCB hole sizing, pad layout, soldering process control, and mechanical clearance should be followed according to the manufacturer’s recommended design and assembly guidance. The terminal block should be mounted in a position that allows safe wire insertion and screw access. ## Application Suitability The **1726040** is suitable for industrial control boards, automation equipment, interface modules, power supply circuits, instrumentation, building control systems, relay boards, sensor wiring interfaces, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for wire gauge compatibility, current rating, voltage rating, tightening torque, creepage and clearance requirements, solder joint strength, and accessibility for field wiring. The terminal block should not be used beyond the manufacturer’s specified electrical, thermal, and mechanical limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkkdsn #wiretoboard #connector #interconnect #fixedterminalblock #screwterminal #throughholecomponent #pcbmount #industrialelectronics #automationequipment #controlsystems #powerdistribution #fieldwiring #electronicscomponents #electronicparts #hardwaredesign #pcbdesign #engineeringparts #componentlibrary #electronicsengineering

0.5 mOhms ±1% 5W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element # Engineering Specification ## Product Name CSS4J-4026R-L500F ## General Description CSS4J-4026R-L500F is a precision four-terminal Kelvin current sense shunt resistor designed for accurate current measurement in high-performance electronic and power management systems. The device is intended for use in applications requiring low resistance sensing, high measurement accuracy, and stable thermal performance under varying electrical loads. The component utilizes a metal element resistive structure optimized for minimal resistance drift, reduced temperature effects, and consistent long-term stability. Its four-terminal Kelvin configuration separates current flow and voltage sensing paths, enabling improved measurement accuracy by eliminating errors caused by PCB trace and connection resistance. The device is widely used in power conversion systems, battery monitoring systems, motor control circuits, and industrial power electronics where precise current feedback is essential for control, protection, and monitoring functions. Its surface-mount construction supports compact PCB layouts and automated assembly processes while maintaining robust mechanical and electrical reliability. The design emphasizes efficient heat dissipation, stable electrical characteristics, and compatibility with demanding industrial and automotive environments. It is suitable for integration into systems requiring continuous current monitoring and high measurement fidelity. ## Functional Requirements ### Current Measurement The device shall provide accurate current sensing through a low-resistance conductive path designed for minimal measurement error. ### Kelvin Sensing Operation The device shall support four-terminal Kelvin sensing to improve measurement accuracy by separating current and voltage sensing paths. ### Signal Stability The device shall maintain stable sensing characteristics under varying load and thermal conditions. ### System Integration The component shall support integration into power electronics and embedded control systems requiring precise current feedback. ## Electrical Requirements ### Low Resistance Operation The device shall exhibit very low resistance to minimize power loss and maintain measurement accuracy. ### Thermal Stability The resistor shall maintain consistent electrical behavior under elevated operating temperatures and thermal cycling conditions. ### Power Handling The device shall support operation in high-current environments typical of power conversion and motor control systems. ### Measurement Accuracy The design shall support precise voltage drop measurement proportional to current flow for control and monitoring applications. ## Mechanical Requirements ### Surface Mount Construction The device shall be provided in a surface mount package suitable for automated PCB assembly. ### Structural Integrity The component shall maintain mechanical stability during assembly, operation, and thermal cycling. ### PCB Integration The device shall support direct integration into multilayer printed circuit board designs with optimized current path layout. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under industrial and automotive environmental conditions. ### Thermal Performance The component shall maintain performance stability under continuous electrical loading and heat generation. ### Storage and Handling The device shall maintain physical and electrical integrity during storage, transport, and handling procedures. ## Quality Requirements ### Reliability The device shall provide long-term stability in resistance value and sensing accuracy under continuous operation. ### Verification Electrical, thermal, and mechanical characteristics shall be validated through appropriate testing and qualification procedures. ### Compliance The product shall conform to applicable standards for current sensing resistors used in industrial and automotive electronics. ## Documentation Requirements Technical documentation shall include application guidelines, layout recommendations for Kelvin sensing, thermal considerations, electrical characteristics, and integration practices for power electronics systems. ## Classification Tags #CSS4J4026RL500F #CurrentSenseResistor #ShuntResistor #KelvinSensing #FourTerminalResistor #PowerElectronics #BatteryManagement #MotorControl #PowerSupplyDesign #AnalogSensing #ElectricalEngineering #PCBDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #HighCurrentSensing #PrecisionMeasurement #CircuitDesign

1/1 Transceiver Half RS422, RS485 8-SOIC These devices have robust 3.3-V drivers and receivers in a small package for demanding industrial applications. The bus pins are robust to ESD events with high levels of protection to Human-Body Model and IEC Contact Discharge specifications. Each of these devices combines a differential driver and a differential receiver which operate from a single 3.3-V power supply. The driver differential outputs and the receiver differential inputs are connected internally to form a bus port suitable for half-duplex (two-wire bus) communication. These devices feature a wide common-mode voltage range making the devices suitable for multi-point applications over long cable runs. These devices are characterized from –40°C to 125°C 1• Small-size VSSOP Packages Save Board Space, or SOIC for Drop-in Compatibility • Bus I/O Protection – >±15 kV HBM Protection – >±12 kV IEC 61000-4-2 Contact Discharge – >±4 kV IEC 61000-4-4 Fast Transient Burst • Extended Industrial Temperature Range –40°C to 125°C • Large Receiver Hysteresis (80 mV) for Noise Rejection • Low Unit-Loading Allows Over 200 Connected Nodes • Low Power Consumption – Low Standby Supply Current: < 2 µA – ICC < 1 mA Quiescent During Operation • 5-V Tolerant Logic Inputs Compatible With 3.3-V or 5-V Controllers • Signaling Rate Options Optimized for: 250 kbps, 20 Mbps, 50 Mbps • Glitch Free Power-Up and Power-Down Bus Inputs and Outputs 2 Applications • Factory Automation • Telecommunications Infrastructure • Motion Control #SN65HVD75D #RS485 #RS422 #Transceiver #TexasInstruments #IndustrialCommunication #FactoryAutomation #MotionControl #TelecomInfrastructure #ESDProtection #HalfDuplex #InterfaceIC #EmbeddedSystems #IndustrialElectronics #DataCommunication

WP-BUFU REDCUBE Bush, full height: 7mm, total height: 10.5mm, thread length: 4mm, pin length: 3.5mm, raster: 2.54mm, REDCUBE Press-Fit; M5, blind 4mm 16 Pin Screw Terminal, Power Tap M5 Through Hole The 7461147 is a high-current PCB-mounted power terminal from the REDCUBE® WP-BUFU series by Würth Elektronik. It is designed to provide a robust and low-resistance connection for transferring high currents between cables, busbars, and printed circuit boards. The terminal utilizes press-fit technology, eliminating the need for soldering while ensuring a gas-tight, vibration-resistant electrical connection. It is particularly suitable for power distribution, industrial equipment, automotive electronics, battery systems, and renewable energy applications. Key Features High current rating up to 180 A M5 screw terminal for secure high-power connections Press-fit termination for solderless PCB assembly 16-pin through-hole mounting configuration Gas-tight electrical connection for long-term reliability Excellent resistance to vibration and mechanical shock Low contact resistance for efficient power transfer Simplifies manufacturing by eliminating soldering processes Suitable for high-current power distribution and battery applications RoHS compliant design Typical Applications Power supplies and power converters Battery management and energy storage systems DC-DC and DC-AC converters Industrial automation equipment Automotive power electronics Solar and wind energy systems High-current PCB power distribution networks #CommonPartsLibrary #REDCUBE #PowerTerminal #PressFit #HighCurrentConnector #PCBTerminal #WurthElektronik #IndustrialElectronics #AutomotiveElectronics #PowerDistribution #EnergyStorage #RenewableEnergy #7461147

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

Buck Regulator Positive Output Step-Down DC-DC Controller IC 24-VQFN (3.5x5.5) The LM5148RGYR specification defines the engineering requirements for a synchronous buck controller integrated circuit designed for high-efficiency DC-DC power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable voltage regulation, efficient power management, and long-term operational stability in industrial, automotive, telecommunications, and embedded electronic systems. The device is intended for use in high-performance power supply designs requiring wide input voltage capability, precise output voltage regulation, and high-current conversion efficiency. It controls external power MOSFETs to implement synchronous buck converter topologies suitable for distributed power architectures, industrial automation equipment, networking infrastructure, battery-powered systems, and embedded control applications. Engineering Requirements The controller shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure stable switching performance, low power consumption, and reliable long-term operation. The device shall maintain consistent functionality under specified operating voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate pulse-width modulation control, stable output voltage regulation, fast transient response, and reliable gate drive capability for external synchronous power MOSFETs. The controller shall maintain predictable switching performance during startup, shutdown, overload, and dynamic load conditions while supporting efficient power conversion. The integrated control architecture shall provide robust regulation, protection features, and compensation capability to ensure stable converter operation across varying input voltages and output load conditions. The device shall maintain operational integrity during power sequencing and fault recovery without compromising system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical performance and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #BuckController #DCDCConverter #PowerManagement #SynchronousBuck #PowerElectronics #EmbeddedSystems #IndustrialElectronics #QualityAssurance #EngineeringDocumentation