Automotive OBD2 data logger based on ESP32-S3-WROOM-2 with robust 12–24V input protection, USB-C, CAN transceiver, microSD storage, RTC, and expansion ports.

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Right Angle; Through Hole The USB4105-GF-A is a USB Type-C receptacle connector designed for USB 2.0 applications, commonly used in embedded systems, IoT devices, and consumer electronics. It features a 24-position (16 active + 8 dummy) contact design that supports reversible plug orientation, making it user-friendly and compliant with USB Type-C standards. This connector is a right-angle, surface-mount (SMT) device with through-hole retention tabs, providing both compact PCB integration and strong mechanical stability. Key Features USB Type-C Interface Reversible plug orientation (no wrong insertion) Standard USB Type-C receptacle Supports USB 2.0 signaling Contact Configuration 24 pins total (16 active + 8 dummy pins) Includes: Power (VBUS) Ground (GND) USB 2.0 data (D+, D−) Configuration channel (CC) Electrical Capability Supports multiple current levels (up to 5A depending on design) Rated voltage up to 48V DC Mechanical Design Right-angle (horizontal) mounting Surface-mount + through-hole hybrid Includes: Board guide Solder retention tabs (strong anchoring) Durability & Materials Shielded metal shell (EMI protection) Contact finish: Gold plating Housing: UL94 V-0 flame rated Mating cycles: ~20,000 insertions Environmental Specs Operating temperature: -40°C to +85°C RoHS compliant (lead-free) Typical Applications Microcontroller boards (ESP32, Arduino, etc.) Charging + data interface for embedded devices Power + USB communication ports Consumer electronics (gadgets, accessories) #CommonPartsLibrary #Connector #USB #DVI #USB4105 #USB-C

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Right Angle; Through Hole USB Type-C receptacle 16 pin USB2.0 The USB4215-03-A is a USB Type-C receptacle connector designed for USB 2.0 applications. It features a 16-pin configuration supporting reversible plug orientation with standard USB 2.0 differential data lines and configuration channel (CC) pins. The connector is intended for surface-mount PCB assembly with through-hole shell stakes for enhanced mechanical strength. It is widely used in compact embedded systems for power delivery, charging interfaces, and basic data communication. Key Features USB Type-C receptacle (USB 2.0 compliant) 16 functional pins (no SuperSpeed support) Reversible plug orientation Surface-mount contacts with through-hole shell tabs Compact, low-profile design High insertion cycle durability Suitable for automated assembly Electrical Characteristics Rated Current: VBUS: up to 5.0 A (depending on PCB design and cable) Signal pins: 0.25 A max Rated Voltage: 20 V DC max Contact Resistance: ≤ 40 mΩ Insulation Resistance: ≥ 100 MΩ Dielectric Withstanding Voltage: 100 V AC Mechanical Characteristics Mounting Type: Surface Mount (SMT) with Through-Hole Shield Tabs Number of Positions: 16 Mating Cycles: 10,000 cycles (typical) Insertion Force: 5–20 N Extraction Force: 8–20 N Material Specifications Contacts: Copper Alloy Contact Plating: Gold over Nickel Housing: High-temperature thermoplastic (UL94V-0) Shell: Stainless Steel Environmental Characteristics Operating Temperature Range: -25°C to +85°C Storage Temperature Range: -40°C to +85°C RoHS Compliant: Yes Halogen Free: Yes Pin Configuration (USB 2.0 Type-C) VBUS (Power) GND (Ground) D+ / D− (USB 2.0 differential pair) CC1 / CC2 (Configuration channel) SBU pins (optional/unused in USB 2.0 designs) Applications USB power input (5 V / USB-C PD trigger designs) Embedded systems and development boards Consumer electronics Charging interfaces Low-speed USB communication devices Packaging Tape & Reel for automated pick-and-place assembly Compliance & Standards USB Type-C Specification (USB 2.0 interface) RoHS / REACH compliant UL recognized materials #CommonPartsLibrary #Connector #USB-C

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Right Angle; Through Hole, USB Type-C receptacle 16 pin power only The UJ20-C-H-G-SMT-2-P16-TR is a USB Type-C receptacle connector designed for USB 2.0 applications. It features a right-angle, surface-mount (SMT) configuration with additional through-hole retention tabs for improved mechanical strength on the PCB. This connector supports reversible USB-C plug insertion, making it suitable for modern embedded systems, consumer electronics, and charging/data interfaces. It is optimized for compact designs while maintaining reliable electrical and mechanical performance. Key Features Electrical Characteristics USB Standard: USB 2.0 (up to 480 Mbps data rate) Rated Current: up to 5 A (VBUS) Rated Voltage: 48 VDC max Mechanical / Physical Connector Type: USB Type-C receptacle Mounting: Surface Mount (SMT) + through-hole stakes Orientation: Right-angle (horizontal) Number of Contacts: 24 positions (16 active + 8 dummy) Contact Plating: Gold (≈3 µin) for durability Mating Cycles: ~10,000 insertions Materials & Build Shielding: Fully shielded (metal shell, SUS304) Insulator Material: UL94 V-0 rated (flame-retardant) Operating Temperature: -25°C to +85°C Packaging: Tape & Reel (TR) for automated assembly Series: UJ20 (Same Sky / former CUI Devices) Typical Applications Embedded systems (e.g., MCU/SoC boards) Power + data interface for IoT devices Consumer electronics (chargers, hubs, accessories) Development boards and custom PCB designs Quick Insight (Design Tip) Even though it’s a USB-C connector, this specific part is USB 2.0 only—so: No SuperSpeed (TX/RX) lines Only VBUS, GND, CC1/CC2, D+ / D- are typically used #CommonPartsLibrary #Connector #USB

Humidity, Temperature 0 ~ 100% RH I2C ±2% RH 8 s Surface Mount The SHTC3-TR-2.5KS is a digital humidity and temperature sensor from Sensirion, designed for high accuracy, low power consumption, and compact integration. It utilizes a fully calibrated capacitive humidity sensor and bandgap temperature sensor, providing precise environmental measurements via an I²C interface. The device is optimized for battery-powered and space-constrained applications, featuring ultra-low power consumption and sleep modes, making it ideal for IoT, wearable, and mobile devices. Key Features Relative humidity and temperature sensing in a single package Fully calibrated and linearized digital output I²C interface (up to 1 MHz fast mode) Ultra-low power consumption with sleep mode High accuracy and fast response time Small DFN package for compact designs Factory calibrated, no external calibration required Mechanical Characteristics Package Type: DFN (Dual Flat No-Lead) Package Size: ~2.0 mm × 2.0 mm × 0.75 mm Mounting Type: Surface mount (SMT) Terminals: Bottom pads Electrical Characteristics Supply Voltage (VDD): 1.62 V to 3.6 V Average Supply Current: Measurement: ~170 µA Sleep Mode: ~0.3 µA Interface: I²C (address selectable) Output: Digital (temperature and relative humidity) Sensing Performance Humidity Range: 0 to 100 %RH Humidity Accuracy: ±2 %RH (typical) Temperature Range: -40°C to +125°C Temperature Accuracy: ±0.2°C (typical) Response Time (τ63%): ~8 seconds (humidity) Functional Features Low-power measurement modes (normal and low power) Sleep mode for minimal energy consumption CRC checksum for data integrity Clock stretching support (optional) Environmental Specifications Operating Temperature Range: -40°C to +125°C Storage Temperature Range: -40°C to +125°C Packaging Information Packaging Type: Tape & Reel (TR) Reel Quantity: 2,500 units (2.5KS) Lead-Free / RoHS compliant Typical Applications Wearable devices Smartphones and mobile electronics IoT sensors and nodes Smart home devices (thermostats, air quality monitors) HVAC systems Environmental monitoring #CommonPartsLibrary #Sensor #Transducer #Humidity #Moisture-Sensor

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C3-WROOM-02-N4 is a compact, general-purpose Wi-Fi and Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-C3 SoC and integrates RF components, crystal oscillator, flash memory, and PCB antenna in a single module. It is designed for a wide range of applications such as IoT devices, smart home systems, industrial automation, and consumer electronics, offering a balance of performance, low power consumption, and cost efficiency. Key Features MCU & Memory 32-bit RISC-V single-core processor up to 160 MHz 384 KB ROM 400 KB SRAM + 8 KB RTC SRAM Integrated 4 MB SPI flash (N4 variant) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Supports Station, SoftAP, and Station + SoftAP modes Bluetooth 5 (BLE) with mesh support Data rates up to 150 Mbps (Wi-Fi) Peripherals & Interfaces Up to 15 GPIOs Interfaces: SPI, UART, I2C, I2S LED PWM ADC (SAR) Timers & watchdog USB Serial/JTAG support TWAI® (CAN 2.0 compatible) #commonpartslibrary #transceiver #module #wireless #rf

MAX98357A Series 5.5V 3.2W PCM Input Class D Audio Power Amplifier - TQFN-16 The MAX98357A/MAX98357B is an easy-to-use, low-cost, digital pulse-code modulation (PCM) input Class D amplifier that provides industry-leading Class AB audio performance with Class D efficiency. The digital audio interface automatically recognizes up to 35 different PCM and TDM clocking schemes which eliminates the need for I2C programming. Operation is further simplified by eliminating the need for an external MCLK signal that is typically used for PCM communication. Simply supply power, LRCLK, BCLK, and digital audio to generate audio! Furthermore, a novel pinout allows customers to use the cost-effective WLP package with no need for expensive vias (refer to Application Note 6643: Optimize Cost, Size, and Performance with MAX98357 WLP for more information). The digital audio interface is highly flexible with the MAX98357A supporting I2S data and the MAX98357B supporting left-justified data. Both ICs support 8 channel time division multiplexed (TDM) data. The digital audio interface accepts specified sample rates between 8kHz and 96kHz for all supported data formats. The ICs can be configured to produce a left channel, right channel, or (left/2 + right/2) output from the stereo input data. The ICs operate using 16/24/32-bit data for I2S and left-justified modes as well as 16-bit or 32-bit data using TDM mode. The ICs eliminate the need for the external MCLK signal that is typically used for PCM communication. This reduces EMI and possible board coupling issues in addition to reducing the size and pin count of the ICs. The ICs also feature a very high wideband jitter tolerance (12ns typ) on BCLK and LRCLK to provide robust operation. Active emissions-limiting, edge-rate limiting, and overshoot control circuitry greatly reduce EMI. A filterless spread-spectrum modulation scheme eliminates the need for output filtering found in traditional Class D devices and reduces the component count of the solution. The ICs are available in 9-pin WLP (1.345mm x 1.435mm x 0.64mm) and 16-pin TQFN (3mm x 3mm x 0.75mm) packages and are specified over the -40°C to +85°C temperature range. ● Single-Supply Operation (2.5V to 5.5V) ● 3.2W Output Power into 4Ω at 5V ● 2.4mA Quiescent Current ● 92% Efficiency (RL = 8Ω, POUT = 1W) ● 22.8μVRMS Output Noise (AV = 15dB) ● Low 0.013% THD+N at 1kHz ● No MCLK Required ● Sample Rates of 8kHz to 96kHz ● Supports Left, Right, or (Left/2 + Right/2) Output ● Sophisticated Edge Rate Control Enables Filterless Class D Outputs ● 77dB PSRR at 1kHz ● Low RF Susceptibility Rejects TDMA Noise from GSM Radios ● Extensive Click-and-Pop Reduction Circuitry ● Robust Short-Circuit and Thermal Protection ● Available in Space-Saving Packages: 1.345mm x 1.435mm WLP (0.4mm Pitch) and 3mm x 3mm TQFN ● Solution Size with Single Bypass Capacitor is 4.32mm2 Applications ● Single Li-ion Cell/5V Devices ● Smart Speakers ● Notebook Computers ● IoT Devices ● Gaming Devices (Audio and Haptics) ● Smartphones ● Tablets ● Cameras #commonpartslibrary #integratedcircuit #linearamplifier #mono

TPD3E001 Low-Capacitance 3-Channel ESD-Protection for High-Speed Data Interfaces ESD-Protection SOT?553*

PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 14KB (8K x 14) FLASH 40-PDIP The PIC16F877A-I/P is a high-performance 8-bit microcontroller from Microchip Technology, based on a Harvard architecture with separate program and data memory buses. It is designed for a wide range of embedded applications requiring reliable processing, multiple communication interfaces, and analog capability. The device integrates Flash program memory, EEPROM data storage, and numerous peripherals including ADC, timers, serial communication modules, and PWM functions. Packaged in a 40-pin PDIP form factor, it is widely used in industrial automation, consumer electronics, and educational development systems. Core Features 8-bit PIC microcontroller architecture Harvard architecture with RISC instruction set Operating frequency up to 20 MHz Single-cycle instruction execution (except branches) Memory Program Memory: 8K words (Flash) Data Memory (RAM): 368 bytes EEPROM Data Memory: 256 bytes I/O Features Up to 33 programmable I/O pins Multiple input/output ports (PORTA, PORTB, PORTC, PORTD, PORTE) High current sink/source capability on selected pins Analog Features 10-bit Analog-to-Digital Converter (ADC) Up to 8 analog input channels Programmable voltage reference Timers and Control Three timers (Timer0, Timer1, Timer2) Capture/Compare/PWM (CCP) modules Watchdog Timer (WDT) Power-on Reset (POR) and Brown-out Reset (BOR) Communication Interfaces USART (Universal Synchronous/Asynchronous Receiver/Transmitter) SPI (Serial Peripheral Interface) I²C (Inter-Integrated Circuit) via MSSP module Electrical Characteristics Operating Voltage: 4.0V to 5.5V Operating Temperature Range: -40°C to +85°C (Industrial grade) Low power consumption modes available Package Information Package Type: PDIP (Plastic Dual Inline Package) Pin Count: 40 pins Mounting Type: Through-hole Applications Industrial control systems Embedded automation Consumer electronics Sensor interfacing and data acquisition Educational and prototyping platforms #commonpartslibrary #integratedcircuit #microcontroller

Board Mount Humidity Sensors Intermediate Humidity and Temperature Sensor Humidity, Temperature 0 ~ 100% RH I2C ±1.8% RH 4 s Surface Mount The SHT41-AD1B-R2 is a fully calibrated, low-power environmental sensor that measures relative humidity (RH) and temperature. It integrates sensing elements, signal processing, and a digital interface into a small surface-mount package, making it ideal for space-constrained designs. Key Features Sensor Type: Digital humidity and temperature sensor Interface: I²C (easy MCU integration) Supply Voltage: ~1.08 V to 3.6 V Humidity Accuracy: up to ±1.8% RH (typical) Temperature Accuracy: up to ±0.2 °C (typical) Response Time: Fast measurement and low latency Power Consumption: Ultra-low, suitable for battery devices Package: DFN (compact, ~1.5 × 1.5 mm) Factory Calibration: No external calibration required Functional Overview The sensor uses capacitive humidity sensing combined with a bandgap temperature sensor. Internal electronics convert these measurements into digital data via I²C, eliminating the need for external ADCs or complex signal conditioning. Design Advantages Small footprint for compact PCBs Low power consumption for IoT and portable devices High reliability with long-term stability Fast response time for real-time monitoring Simple integration with microcontrollers Typical Applications IoT and smart home devices HVAC and climate control systems Wearables and portable electronics Industrial monitoring systems Environmental data logging #CommonPartsLibrary #Sensors,-Transducer #Humidity #Moisture-Sensor #SHT4x

Voltage Level Translator Bidirectional 1 Circuit 8 Channel 60Mbps 20-TSSOP This device is an 8-bit non-inverting level translator which uses two separate configurable power-supply rails. The A port tracks the VCCA pin supply voltage. The VCCA pin accepts any supply voltage between 1.4V and 3.6V. The B port tracks the VCCB pin supply voltage. The VCCB pin accepts any supply voltage between 1.65V and 5.5V. Two input supply pins allows for low Voltage bidirectional translation between any of the 1.5V, 1.8V, 2.5V, 3.3V, and 5V voltage nodes. When the output-enable (OE) input is low, all outputs are placed in the high-impedance (Hi-Z) state. To put the device in the Hi-Z state during power-up or power-down periods, tie OE to GND through a pulldown resistor. The current-sourcing capability of the driver determines the minimum value of the resistor. • No direction-control signal needed • Maximum data rates: – 110Mbps (push pull) – 1.2Mbps (open drain) • 1.4V to 3.6V on A port and 1.65V to 5.5V on B port (VCCA ≤ VCCB) • No power-supply sequencing required – either VCCA or VCCB can be ramped first • Latch-up performance exceeds 100mA per JESD 78, class II • ESD protection exceeds JESD 22 (A port): – 2000 V Human Body Model (A114-B) – 150 V Machine Model (A115-A) – 1000 V Charged-Device Model (C101) • IEC 61000-4-2 ESD (B-port): – ± 8kV Contact Discharge – ± 6kV Air Discharge #commonpartslibrary #integratedcircuit #logic #translator #levelshifter

Temperature Sensor Digital, Local -55°C ~ 150°C 16 b 6-WSON (2x2) The TMP117AIDRVR is a high-precision digital temperature sensor manufactured by Texas Instruments. The device provides accurate temperature measurements through an I²C-compatible digital interface and is optimized for applications requiring medical-grade accuracy, low power consumption, and compact PCB footprint. The sensor integrates a precision temperature sensing element, analog-to-digital converter, calibration memory, and digital interface into a single compact package. The device supports continuous conversion and shutdown operating modes, enabling efficient thermal monitoring in battery-powered and always-on systems. Internal calibration minimizes external component requirements while providing highly linear and repeatable temperature measurements across an extended operating range. The TMP117AIDRVR is commonly used in industrial controls, wearable electronics, healthcare equipment, environmental monitoring systems, battery management systems, consumer electronics, and precision instrumentation. Electrical Characteristics Supply voltage supports low-voltage digital systems and portable electronics applications. Ultra-low operating current enables long battery life in energy-sensitive designs. Integrated EEPROM allows programmable offset correction and configuration storage. Digital output eliminates the need for external ADC circuitry. High measurement resolution supports precision thermal monitoring applications. Low self-heating characteristics improve measurement stability and accuracy. Functional Features High-accuracy digital temperature sensing. I²C and SMBus compatible communication interface. Programmable alert functionality for thermal threshold monitoring. Continuous conversion and low-power shutdown operating modes. Integrated non-volatile memory for user configuration storage. Wide operating temperature range for industrial and commercial environments. Fast conversion timing suitable for real-time monitoring systems. Factory-calibrated performance requiring minimal external calibration. Package Information Package type is WSON with compact surface-mount footprint suitable for dense PCB layouts. Moisture-sensitive package designed for automated assembly processes. Lead-free and RoHS-compliant construction. Typical Applications Medical thermometers and patient monitoring systems. Industrial temperature monitoring equipment. Battery-powered portable electronics. HVAC and environmental sensing systems. Data acquisition and instrumentation systems. Server and embedded thermal management applications. Consumer electronics requiring precision thermal sensing. #commonpartslibrary #integratedcircuit #temperaturesensor

Cellular EDGE, GPRS, GSM, HSPA+, LTE, UMTS Transceiver Module 900MHz, 1.8GHz Antenna Not Included Surface Mount The SIM7600E-H is a multi-mode LTE module that supports: LTE (4G) Cat-4 with up to 150 Mbps download / 50 Mbps upload 3G (UMTS/HSPA+) 2G (GSM/GPRS/EDGE) fallback for global network compatibility It is built in a compact SMT/LCC package (about 30 × 30 mm) and is widely used for embedded devices that need mobile internet and GNSS positioning Key Features Network support LTE-FDD / LTE-TDD (global bands depending on variant) UMTS/HSPA+ GSM/GPRS/EDGE fallback Data speed LTE Cat-4: up to 150 Mbps downlink 3G/2G fallback for lower-speed connectivity GNSS built-in GPS / GLONASS / other satellite positioning support Interfaces USB 2.0 UART GPIO I2C ADC PCM (audio support) SIM card interface Software / protocols AT command control TCP/IP, UDP, HTTP, HTTPS, FTP, DNS Driver support for Windows, Linux, Android Power supply ~3.4V to 4.2V typical operating range Operating temperature -40°C to +85°C (industrial grade) Typical Applications IoT devices GPS trackers Smart metering Industrial routers / gateways Remote monitoring systems Vehicle telematics Point-of-sale terminals #commonpartslibrary #rf #wireless #transceiver #module

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2C digital interface. The ADXL345 is well suited for mobile device applications. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Free-fall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, plastic package. ► Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) ► Power consumption scales automatically with bandwidth ► User-selectable resolution ► Fixed 10-bit resolution ► Full resolution, where resolution increases with g range, up to 13-bit resolution at ±16 g (maintaining 4 mg/LSB scale factor in all g ranges) ► Embedded memory management system with FIFO technology minimizes host processor load ► Single tap/double tap detection ► Activity/inactivity monitoring ► Free-fall detection ► Supply voltage range: 2.0 V to 3.6 V ► I/O voltage range: 1.7 V to VS ► SPI (3- and 4-wire) and I2C digital interfaces ► Flexible interrupt modes mappable to either interrupt pin ► Measurement ranges selectable via serial command ► Bandwidth selectable via serial command ► Wide temperature range (−40°C to +85°C) ► 10,000 g shock survival ► Pb free/RoHS compliant #commonpartslibrary #sensor #transducer #accelerometer

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-2-N32R16V is a powerful dual-core microcontroller module that integrates wireless connectivity, large memory, and hardware acceleration for AI and signal processing tasks. It is particularly suited for applications requiring edge AI, voice recognition, and high-speed data processing, while still maintaining low power consumption. Dual-core Xtensa LX7 CPU Up to 240 MHz Includes vector instructions for AI and DSP workloads Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE) N32 → 32 MB external Flash R16 → 16 MB PSRAM Built for memory-intensive applications #commonpartslibrary #transceiver #wireless #rf

SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) 4-SOP (0.179", 4.55mm) The G3VM-61VY3(TR05) is a single-pole, single-throw normally open (SPST-NO) solid-state relay that uses an LED input and MOSFET output to switch AC or DC loads without mechanical contacts. It provides fast, silent, and highly reliable switching in a very small surface-mount package. Key Characteristics Relay Type: Solid State Relay (Photorelay) Contact Form: SPST-NO (1 Form A) Output Type: MOSFET Load Voltage: Up to 60 V AC/DC Load Current: Up to 700 mA On-Resistance: ~2 Ω max Input Control: LED-driven (low current DC input) Isolation Voltage: ~3.75 kV (input to output) Package: SOP-4 surface-mount (compact form factor) Packaging Option: TR = Tape & Reel for automated assembly How It Works The input LED is energized with a small DC current. It activates an internal photo-coupler. This drives a pair of MOSFETs, turning the load ON or OFF. No mechanical movement → no arcing or contact wear. Key Advantages Silent operation (no clicking sound) Very long life (no mechanical parts) Fast switching speed Compact size for dense PCB layouts Low leakage and stable performance Typical Applications Semiconductor test equipment Industrial control systems Battery-powered devices Data acquisition systems Communication and measurement circuits General-purpose signal switching #CommonPartsLibrary #Relay #SSR #G3VM

The ESP32-DEVKITC-VE evaluation kit from Espressif Systems is a high-performance development platform for RF, RFID, and wireless applications. It features the ESP32-WROVER-E with embedded Xtensa dual-core 32-bit LX6 microprocessor running up to 240 MHz, with 8MB Flash and 8MB PSRAM for efficient data processing. This board supports Wi-Fi 802.11 b/g/n and Bluetooth® Smart Ready 4.x (BLE) connectivity at 2.4GHz, offering wireless communication options. With 448KB ROM, 520KB SRAM, and 16KB SRAM in RTC, it provides ample memory for complex applications. It includes up to 24 GPIOs, SD card, UART, SPI, SDIO, I2C, LED and motor PWM, I2S, IR, pulse counter, capacitive touch sensor, ADC, DAC, and TWAI® (compatible with ISO 11898-1/CAN 2.0) #commonpartslibrary #ESP32-WROVER-E #evaluationboard

1/1 Transceiver Half CANbus 8-SOIC The SN65HVD230DR is a high-speed Controller Area Network (CAN) transceiver designed to interface a CAN protocol controller with the physical two-wire CAN bus. It operates as a differential line driver and receiver, translating logic-level signals into robust bus-level signals suitable for automotive, industrial, and distributed control applications. The device is optimized for reliable communication in electrically noisy environments and supports low-power operation, making it suitable for systems requiring energy efficiency and extended operational stability. This transceiver conforms to widely adopted CAN physical layer standards and is intended for use in systems requiring high data integrity, fault tolerance, and electromagnetic compatibility. It integrates protection features and supports standby functionality to reduce system power consumption when communication is inactive. Functional Overview The device provides bidirectional signal conversion between a CAN controller and the differential CAN bus lines. It features a transmit data input and a receive data output, enabling full-duplex communication at the protocol level. The driver stage generates differential output signals on the bus, while the receiver stage detects and translates bus signals back into logic-level data. An internal control mechanism allows the device to enter a low-power standby mode, reducing current consumption when active communication is not required. The transceiver includes slope control capability to manage signal edge rates, which helps minimize electromagnetic interference and improves signal integrity across the network. Electrical Characteristics The transceiver operates from a single low-voltage supply and is designed for compatibility with modern microcontrollers and digital logic systems. It provides differential output drive capability with controlled rise and fall characteristics. The receiver is designed with high input sensitivity and noise immunity to ensure accurate signal detection under varying bus conditions. The device includes thermal protection and safeguards against bus faults, including short-circuit conditions. Its internal circuitry is designed to maintain stable operation across a wide range of environmental conditions and supply variations. Interface Requirements The logic interface is compatible with standard digital input and output levels, allowing direct connection to a CAN controller. The bus interface consists of two differential lines that connect to the CAN network. Proper termination and layout practices are required to ensure optimal communication performance and compliance with CAN network design guidelines. Operating Conditions The device is intended for operation across a broad temperature range suitable for industrial and automotive environments. It maintains functional integrity under typical voltage fluctuations and environmental stresses encountered in embedded systems. Protection and Reliability Features The transceiver incorporates protection mechanisms to guard against overcurrent, thermal overload, and electrostatic discharge. It is designed to maintain communication reliability even in the presence of transient disturbances and electrical noise. Packaging and Integration The SN65HVD230DR is provided in a compact surface-mount package suitable for automated assembly. Its pin configuration supports straightforward integration into printed circuit board designs with minimal external components. #CommonPartsLibrary #IntegratedCircuits #Interface #Drivers #Receivers #Transceivers #65HVD230

4.5V~5.5V 1 1 5.5ns@5V,15pF 10uA SOT-23-5 Buffers, Drivers, Receivers, Transceivers RoHS The SN74AHCT1G125 device is a single bus buffer gate/line driver with 3-state output. The output is disabled when the output-enable (OE) input is high. When OE is low, data is passed from the A input to the Y output. • Operating Range of 4.5 V to 5.5 V • Max tpd of 6 ns at 5 V • Low Power Consumption, 10-µA Max ICC • ±8-mA Output Drive at 5 V • Inputs are TTL-Voltage Compatible • Latch-Up Performance Exceeds 250 mA Per JESD 17 2 Applications • Wireless Infrastructure • Servers • Power Infrastructure • PCs/Notebooks • Programmable Logic Controllers • Tests and Measurements #CommonPartsLibrary #IntegratedCircuit

Isolation and Data Interface (Encapsulated) Pulse Transformer 1:1 Transmitter, 1:1 Receiver Surface Mount #commonpartslibrary #transformer

Wio-E5 Dev Kit embedded with Wio-E5 STM32WLE5JC LoRa module that supports Long Range protocol on the global frequency band. It provides full GPIOs, which support various data protocols and interfaces such as RS485, Grove, male/female headers, etc. This makes it user-friendly because it allows for easy and flexible connections to other devices or components. It would be a perfect choice for fast testing and rapid prototyping of your Long Range IoT projects.

ARM® Cortex®-M4 series Microcontroller IC 32-Bit Single-Core 168MHz 1MB (1M x 8) FLASH 64-LQFP (10x10) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces, and camera Includes ST state-of-the-art patented technology • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting CompactFlash™, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset, and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop, and Standby modes –VBAT supply for RTC, 20×32-bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #commonpartslibrary #integratedcircuit #microcontroller

33V (Typ) Clamp 2.7A (8/20µs) Ipp Tvs Diode Surface Mount 2-X1SON (1x0.6) The ESD601-Q1 is a bidirectional ESD protection diode. The ESD601-Q1 is offered in the industry standard 0402 (DPY) package, and offers an IEC 61000-4-2 protection level of 15kV. The device can clamp 8/20μs surges with peak pulse currents up to 2.7A in accordance with the IEC 61000-4-5 standard. The low capacitance and low leakage current provide protection against transient events in a variety of systems and applications. This protection is key for many applications, such as smaller form factors and faster data speeds, which are becoming more popular over time. Features • IEC 61000-4-2 ESD Protection: – ±15kV contact discharge – ±15kV air gap discharge • ISO 10605 (330pF, 330Ω) ESD Protection: – ±12kV contact discharge – ±15kV air-gap discharge • IEC 61000-4-5 surge protection: – 2.7A (8/20µs) • I/O capacitance: 0.3pF (typical) • Ultra low leakage current: 1nA (typical) • Low dynamic resistance 0.9Ω (typical) • Industry standard 0402 package 2 Applications • Automotive Antenna ESD Protection • RF Signal ESD Protection • Near Field Communications (NFC) • Automotive SerDes w/Power over Coax • USB Type-C (short-to-Vbus tolerant) #CommonPartsLibrary #Diode #TVS