A microcontroller board with a camera, mic, and Coral Edge TPU. Dual-core i.MX RT1176 MCU Cortex-M7 (@800 MHz) and a Cortex-M4 (@400 MHz) 2 MB of built-in SRAM 64 MB of SDRAM More than 1 GB of flash memory Embedded Evaluation Board #coral #google #Edge #TPU #coprocessor #no3d #RT1176

MPU with Dual Arm Cortex-A35 @1.5GHz, Cortex-M33 @400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA The STM32MP257FAI3 is a high-performance microprocessor from STMicroelectronics' STM32MP2 series, integrating dual 64-bit Arm Cortex-A35 cores running at up to 1.5 GHz, a Cortex-M33 real-time core, and a Cortex-M0+ low-power management core. It is designed for advanced industrial, edge AI, machine vision, HMI, IoT gateway, and multimedia applications requiring Linux-class processing alongside deterministic real-time control. The device features AI acceleration, 3D graphics, video encoding/decoding, extensive connectivity, advanced security, and support for high-speed external memory. Key Features Dual-core 64-bit Arm Cortex-A35 CPU operating up to 1.5 GHz Arm Cortex-M33 real-time processor with TrustZone and FPU support Arm Cortex-M0+ low-power coprocessor for autonomous operation Integrated NPU (Neural Processing Unit) delivering up to 1.35 TOPS AI performance 3D GPU and hardware video encoder/decoder acceleration Supports DDR3L, DDR4, and LPDDR4 external memory up to 4 GB Multiple display interfaces including MIPI-DSI, LVDS, and parallel RGB USB 2.0 Host and USB 3.0 Dual-Role with embedded PHYs PCI Express interface with integrated 5 Gbps PHY Up to three Gigabit Ethernet interfaces with TSN and IEEE 1588 support Extensive connectivity: I2C, I3C, SPI, UART, USART, CAN FD, SDMMC, SAI, and SPDIF Hardware cryptographic accelerators including AES, SHA, RSA, ECC, PKA, and True RNG Secure boot, TrustZone security, tamper detection, and resource isolation framework Multiple low-power operating modes for energy-efficient designs Available in fine-pitch BGA packages for high-density embedded systems. #STM32MP257FAI3 #STM32MP2 #STMicroelectronics #CortexA35 #CortexM33 #EdgeAI #EmbeddedLinux #IndustrialAutomation #MachineVision #HMI #IoTGateway #MPU #PCIe #USB3 #GigabitEthernet #TrustZone #EmbeddedSystems #ArtificialIntelligence #LinuxProcessor #IndustrialIoT #CommonPartsLibrary #IntegratedCircuit #Microprocessor #STM32MP2

ARM® Cortex®-M33 RT-600 Microcontroller IC 32-Bit Dual-Core 300MHz External Program Memory 176-VFBGA (9x9) The RT600 is a family of dual-core microcontrollers for embedded applications featuring an Arm Cortex-M33 CPU combined with a Cadence Xtensa HiFi4 advanced Audio Digital Signal Processor CPU. The Cortex-M33 includes two hardware coprocessors providing enhanced performance for an array of complex algorithms. The family offers a rich set of peripherals and very low power consumption. The Arm Cortex-M33 is a next generation core based on the ARMv8-M architecture that offers system enhancements, such as ARM TrustZone® security, single-cycle digital signal processing, and a tightly-coupled coprocessor interface, combined with low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M33 CPU employs a 3-stage instruction pipe and includes an internal prefetch unit that supports speculative branching. A hardware floating-point processor is integrated into the core. On the RT600, the Cortex-M33 is augmented with two hardware coprocessors providing accelerated support for additional DSP algorithms and cryptography. The Cadence Xtensa HiFi 4 Audio DSP engine is a highly optimized audio processor designed especially for efficient execution of audio and voice codecs and pre- and post-processing modules. It supports four 32x32-bit MACs, some support for 72-bit accumulators, limited ability to support eight 32x16-bit MACs, and the ability to issue two 64-bit loads per cycle. There is a floating point unit providing up to four single-precision IEEE floating point MACs per cycle. The RT600 provides up to 4.5 MB of on-chip SRAM (plus an additional 128 KB of tightly-coupled HiFi4 ram) and several high-bandwidth interfaces to access off-chip flash. The FlexSPI flash interface supports two channels and includes an 32 KB cache and an on-the-fly decryption engine. The RT600 is designed to allow the CortexM33 to operate at frequencies of up to 300 MHz and the HiFi4 DSP to operate at frequencies of up to 600 MHz. Key Features Dual-core architecture with Arm Cortex-M33 CPU and Cadence Xtensa HiFi4 DSP Cortex-M33 operating at up to 300 MHz HiFi4 DSP operating at up to 600 MHz Up to 4.5 MB on-chip SRAM 128 KB DSP tightly coupled memory (TCM) FlexSPI interface supporting Quad/Octal SPI Flash with execute-in-place (XIP) High-speed USB 2.0 Host/Device with integrated PHY Digital microphone (DMIC) interface supporting up to 8 channels Multiple I2S, SPI, I²C, UART, SDIO, and I3C interfaces 12-bit ADC with up to 1 MSPS sampling rate Hardware cryptography acceleration (AES, SHA, RSA, ECC) Arm TrustZone® security technology Secure boot and physically unclonable function (PUF) key storage Multiple low-power operating modes for battery-powered applications Up to 147 GPIOs depending on package option 176-pin VFBGA package (9 mm × 9 mm) Typical Applications Voice-controlled smart devices Audio processing and DSP systems Smart speakers and soundbars Industrial HMI and control panels Edge AI and machine learning applications IoT gateways and connected devices Wearable and portable electronics #NXP #iMXRT685 #RT600 #CortexM33 #HiFi4DSP #Microcontroller #EmbeddedSystems #EdgeAI #VoiceRecognition #AudioProcessing #IoT #IndustrialAutomation #SecureMCU #MachineLearning #MCUDesign

Coral Dev Board is a single-board computer that contains an Edge TPU coprocessor. i.MX 8M i.MX ARM® Cortex®-A53, Cortex®-M4 MPU Embedded Evaluation Board #coral #google #Edge #TPU #coprocessor #no3d

Cryptographic Co-Processor with Secure Hardware-based 16 Key Storage, ECDSA and ECDH support, I2C, SOIC-8 Cryptographic coprocessor SOIC*8*3.9x4.9mm*P1.27mm*

OMGS3 ultra-compact ESP32-S3 board/module, based on dual-core Xtensa LX7 32-bit processor up to 240MHz with RISC-V ultra-low-power coprocessor, 2.4GHz Wi-Fi 802.11b/g/n and Bluetooth LE 5.0, 8MB QSPI Flash and 2MB QSPI PSRAM, integrated 3D high-gain antenna, RGB LED, PMIC, MAX17048G+T10 fuel gauge, 700mA 3.3V LDO regulator, LiPo battery charging, native USB and USB Serial/JTAG support, Qwiic/QT connector, 17 GPIOs, ultra-low deep sleep current, compact 25 x 10mm size. Search Keywords: OMGS3, Unexpected Maker OMGS3, ESP32-S3 module, ESP32-S3 board, ultra compact ESP32-S3, ESP32-S3 WiFi Bluetooth board, ESP32-S3 8MB flash 2MB PSRAM, ESP32-S3 LiPo charger, ESP32-S3 fuel gauge, MAX17048 fuel gauge, Qwiic ESP32-S3 board, tiny ESP32-S3 module Hashtags: #OMGS3 #UnexpectedMakerOMGS3 #ESP32S3 #ESP32S3Board #ESP32S3Module #WiFiBluetoothBoard #BLE5 #8MBFlash #2MBPSRAM #LiPoCharger #FuelGauge #MAX17048 #QwiicConnector #TinyESP32S3 #IoTModule

Authentication Chip 8-UDFN (2x3) The ATECC608B-MAHDA-S is a secure authentication and cryptographic co-processor designed for hardware-based security, device authentication, encrypted communication, and secure key storage in embedded systems and IoT applications. The device integrates advanced cryptographic functionality with protected non-volatile memory to provide a secure root of trust for connected devices. The integrated security engine supports public key cryptography, secure boot validation, message authentication, key generation, digital signatures, and encrypted data exchange. The device is optimized for low-power embedded applications requiring protection against counterfeiting, unauthorized access, firmware tampering, and network-based attacks. The ATECC608B-MAHDA-S supports industry-standard cryptographic algorithms and secure provisioning workflows, enabling secure authentication in cloud-connected systems, industrial automation, consumer electronics, and automotive embedded platforms. The compact surface-mount package and low-power operation make the device suitable for highly integrated embedded designs where hardware security and identity protection are critical requirements. Key Features Hardware-based cryptographic security device Secure key storage and management Integrated authentication engine Public key cryptography support Secure boot and firmware validation capability Digital signature generation and verification Hardware random number generator Encrypted communication support Tamper-resistant key protection Secure provisioning and device identity management Low-power operation for embedded systems I2C serial communication interface Compact surface-mount package IoT and cloud authentication support Electrical Characteristics Secure non-volatile key storage architecture Low operating power consumption Hardware cryptographic acceleration Secure internal key isolation Fast authentication processing capability Wide operating voltage support Industrial temperature operation compatibility High-reliability embedded security implementation Applications IoT device authentication Secure embedded systems Cloud-connected devices Secure boot implementations Firmware integrity verification Industrial automation systems Smart home products Medical electronics Automotive embedded security Asset tracking and identification Anti-counterfeiting systems Encrypted communication platforms Package Information Package Type: SOIC Mounting Type: Surface Mount Compact embedded security package RoHS compliant configuration available #commonpartslibrary #integratedcircuit #securityic #cryptography #iotsecurity #embeddedhardware #authentication #secureboot #hardwaresecurity #encryptedcommunication

ATECC608B-SSHDA-T SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL LCSC Part Number: C1518769 JLCPCB Part Class: Extended Part Manufactured by MICROCHIP(美国微芯) Microchip ATECC608B CryptoAuthentication secure element, hardware cryptographic co-processor with secure key storage for up to 16 keys, certificates or data, supports ECDSA, ECDH, NIST P-256, SHA-256, HMAC, AES-128, TLS 1.2/1.3 PRF/HKDF, secure boot, random number generator, unique 72-bit serial number, I2C or single-wire interface, 2.0V to 5.5V supply voltage, <150nA sleep current, available in 8-pad UDFN, 8-lead SOIC and 3-lead contact packages. Search Keywords: ATECC608B, ATECC608B secure element, Microchip ATECC608B, CryptoAuthentication ATECC608B, ATECC608B I2C, ATECC608B secure key storage, ATECC608B cryptographic co-processor, ATECC608B ECDSA, ATECC608B ECDH, ATECC608B AES-128, ATECC608B SHA-256, ATECC608B secure boot, ATECC608B UDFN, ATECC608B SOIC, ATECC608B-MAHDA, ATECC608B-SSHDA Hashtags: #ATECC608B #MicrochipATECC608B #Microchip #CryptoAuthentication #SecureElement #CryptographicCoprocessor #HardwareKeyStorage #SecureKeyStorage #ECDSA #ECDH #NISTP256 #SHA256 #HMAC #AES128 #SecureBoot #TLS13 #TLS12 #I2C #SingleWireInterface #UDFN8 #SOIC8

WiFi Modules ESP32-S3-MINI-1-N4R2 BULETM-SMD_ESP32-S3-MINI-1-N8 LCSC Part Number: C3013941 JLCPCB Part Class: Extended Part Manufactured by ESPRESSIF Espressif ESP32-S3-MINI-1/1U Wi-Fi and Bluetooth LE MCU module based on ESP32-S3, dual-core 32-bit Xtensa LX7 processor up to 240MHz, supports 2.4GHz Wi-Fi and Bluetooth LE, 8MB Quad SPI flash, optional 2MB Quad SPI PSRAM, up to 80MHz SPI flash clock, integrated low-power co-processor, -40°C to +85°C operating temperature, compact SMD module for IoT, smart home, embedded systems and wearable electronics; ESP32-S3-MINI-1 includes PCB antenna, ESP32-S3-MINI-1U supports external antenna connector. Search Keywords: ESP32-S3-MINI-1, ESP32-S3-MINI-1U, ESP32-S3-MINI-1-N8, ESP32-S3-MINI-1-N4R2, ESP32-S3-MINI-1U-N8, ESP32-S3-MINI-1U-N4R2, Espressif ESP32-S3-MINI, ESP32-S3 WiFi Bluetooth module, ESP32-S3 BLE module, ESP32-S3 MCU module, ESP32-S3-MINI 8MB flash, ESP32-S3-MINI 2MB PSRAM, ESP32-S3-MINI PCB antenna, ESP32-S3-MINI external antenna, ESP32-S3-MINI-1U antenna connector, ESP32-S3 SMD module, ESP32-S3 IoT module, ESP32-S3-MINI datasheet Hashtags: #ESP32S3MINI1 #ESP32S3MINI1U #ESP32S3MINI1N8 #ESP32S3MINI1N4R2 #ESP32S3MINI1UN8 #ESP32S3MINI1UN4R2 #Espressif #ESP32S3 #ESP32Module #WiFiModule #BluetoothLEModule #BLEModule #MCUModule #IoTModule #SMDModule #PCBantenna #ExternalAntenna #XtensaLX7 #8MBFlash #2MBPSRAM

2.4GHz Wi-Fi+Bluetooth LE SoC ESP32-S3FH4R2 is a highly integrated low-power Wi-Fi and Bluetooth LE System-on-Chip (SoC) from Espressif Systems. It is based on a dual-core Xtensa® LX7 processor running at up to 240 MHz and is designed for IoT, smart home, industrial control, AIoT, audio processing, and embedded applications. The ESP32-S3FH4R2 variant includes 4 MB of in-package Quad SPI Flash and 2 MB of in-package Quad SPI PSRAM, reducing external component count and simplifying PCB design. Key Features Dual-core Xtensa® LX7 CPU Up to 240 MHz operating frequency 32-bit architecture with floating-point unit (FPU) SIMD instructions for AI and signal-processing workloads Integrated Memory 4 MB in-package Flash 2 MB in-package PSRAM 512 KB on-chip SRAM 384 KB ROM Additional RTC memory for low-power operation Wireless Connectivity IEEE 802.11 b/g/n 2.4 GHz Wi-Fi Bluetooth® 5 Low Energy (LE) Long-range and low-power wireless communication support Rich Peripheral Set Up to 45 programmable GPIOs USB OTG and USB Serial/JTAG SPI, I²C, I²S, UART, SDIO TWAI® (CAN 2.0 compatible) Camera interface LCD interface PWM, pulse counter, RMT, DMA controller Analog Features Two 12-bit SAR ADCs Temperature sensor 14 capacitive touch sensing inputs Security Features Secure Boot Flash Encryption AES, SHA, RSA, HMAC hardware accelerators True Random Number Generator (RNG) Digital Signature peripheral Low-Power Operation Multiple power-saving modes ULP-RISC-V coprocessor ULP-FSM coprocessor Deep-sleep support with RTC memory retention

Coral Dev Board Mini, a single-board computer that accelerates machine learning models with the on-board Edge TPU. MT8167S - ARM® Cortex®-A35 MPU Embedded Evaluation Board #coral #google #Edge #TPU #coprocessor #no3d #mini #MT8167S