Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C3-WROOM-02-N4 is a compact, general-purpose Wi-Fi and Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-C3 SoC and integrates RF components, crystal oscillator, flash memory, and PCB antenna in a single module. It is designed for a wide range of applications such as IoT devices, smart home systems, industrial automation, and consumer electronics, offering a balance of performance, low power consumption, and cost efficiency. Key Features MCU & Memory 32-bit RISC-V single-core processor up to 160 MHz 384 KB ROM 400 KB SRAM + 8 KB RTC SRAM Integrated 4 MB SPI flash (N4 variant) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Supports Station, SoftAP, and Station + SoftAP modes Bluetooth 5 (BLE) with mesh support Data rates up to 150 Mbps (Wi-Fi) Peripherals & Interfaces Up to 15 GPIOs Interfaces: SPI, UART, I2C, I2S LED PWM ADC (SAR) Timers & watchdog USB Serial/JTAG support TWAI® (CAN 2.0 compatible) #commonpartslibrary #transceiver #module #wireless #rf

Samacsys Import 400KB 22 3V~3.6V RISC-V 160MHz QFN-32-EP(5x5) Microcontroller Units (MCUs/MPUs/SOCs) ROHS QFN50P500X500X90-33N-D https://www.espressif.com/sites/default/files/documentation/esp32-c3_datasheet_en.pdf Ultra-Low-Power SoC with RISC-V Single-Core CPU 0.9 Espressif Systems ESP32-C3 356-ESP32-C3 https://www.mouser.co.uk/ProductDetail/Espressif-Systems/ESP32-C3?qs=iLbezkQI%252BsiMXe7tMG%252Bo%2FA%3D%3D #IoT #WiFi #Bluetooth #esp32 #riscv #part

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

Seeed Studio XIAO ESP32C6 is powered by the highly-integrated ESP32-C6 SoC, built on two 32-bit RISC-V processors, with a high-performance (HP) processor with running up to 160 MHz, and a low-power (LP) 32-bit RISC-V processor, which can be clocked up to 20 MHz. There are 512KB SRAM and 4 MB Flash on the chip, allowing for more programming space, and binging more possibilities to the IoT control scenarios.

Application Processor integrating a quad-core Arm Cortex-A55 64-bit CPU operating at up to 2.0 GHz, an Arm Mali-G52 2EE GPU, and a 1 TOPS INT8 NPU. Supports DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X memory, 4K H.264/H.265/VP9 video decoding, 1080p60 H.264/H.265 video encoding, and interfaces including PCIe 3.0, SATA 3.0, USB 3.0/2.0, Gigabit Ethernet, HDMI 2.0, eDP 1.3, MIPI-CSI, MIPI-DSI, CAN, SDIO/eMMC, UART, SPI, I²C, and PWM. Packaged in a FCBGA636L (19 × 19 mm) package. Hashtags: #ApplicationProcessor #SoC #Rockchip #RK3568 #CortexA55 #MaliG52 #NPU #EmbeddedProcessor #AIoT #FCBGA636 #BGA636 #DDR4 #LPDDR4X #PCIe3 #USB3 #HDMI2 #GigabitEthernet

WiFi 802.11b/g/n Transceiver Module 2.4GHz ~ 2.5GHz Integrated, Trace Surface Mount The ESP-12F is a compact WiFi module based on the ESP8266EX, widely used in IoT and embedded systems due to its low cost and built-in networking capabilities. Integrated WiFi (2.4 GHz) Supports 802.11 b/g/n Built-in TCP/IP stack (no external WiFi processor needed) Microcontroller + WiFi in one Powered by the ESP8266EX SoC Can run user applications directly (not just a WiFi modem) Flash Memory Typically 4 MB SPI flash (varies by version) GPIO Support Multiple multifunction pins: Digital I/O PWM I2C SPI UART ADC (1 channel) Size: ~16 mm × 24 mm Mounting: Castellated SMD module Antenna: Built-in PCB trace antenna (requires proper keepout zone) Power Requirements Operating Voltage: 3.0V – 3.6V (typical 3.3V) Current Consumption: Idle: ~70 mA Peak (TX): up to ~300 mA Common Interfaces UART – programming and debugging SPI – peripheral communication I2C (software-based) GPIO – general-purpose control #commonpartslibrary #transceiver #module #wireless #rf #wifi

Multiprotocol BLE/ANT/2.4 GHz/802.15.4 Cortex-M4F SoC, nRF52840 module #RF #nRF52840 #ARM #BLE #commonpartslibrary

RF System on a Chip - SoC Ultra-low power Bluetooth Multiprotocol 5.4 SoC System-on-Chip #CommonPartsLibrary #IntegratedCircuit #RF-Transceiver #NRF54L15

Multiprotocol BLE/ANT/2.4 GHz/802.15.4 Cortex-M4F SoC, nRF52840 module #RF #nRF52840 #BLE #ARM #commonpartslibrary

XIAO MG24 is an ultra-low-power wireless development board based on Silicon Labs' EFR32MG24 SoC, featuring a high-performance 78MHz ARM Cortex®-M33 core. It‘s Matter® native over Thread® and Bluetooth® Low Energy 5.3, all supported by the Arduino® Core. With 4MB Flash onboard, 19 GPIOs, LED, and charging circuit, it boasts extremely low operating current and ultra-low-power modes, making it an ideal choice for IoT applications, especially battery-powered projects utilizing Matter® protocols.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 85K Logic Cells 766MHz 400-CSPBGA (17x17) #CommonPartsLibrary #IntegratedCircuit #Embedded

Multiprotocol BLE/ANT/2.4 GHz/802.15.4 Cortex-M4F SoC, nRF52840 module BLE ANT ZigBee Thread 802.15.4 nRF52840 nordic MDBT50Q Raytac?MDBT50Q*

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 85K Logic Cells 667MHz 400-CSPBGA (17x17) #CommonPartsLibrary #IntegratedCircuit #Embedded #SoC

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

QFN-68(7x7) Power Management - Specialized ROHS The RK806-1 is a multi-channel PMIC designed to deliver and manage power for modern embedded platforms. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, and a configurable power sequencing controller in a compact QFN-68 package. It is tightly coupled with Rockchip SoCs and is responsible for generating stable voltage rails for CPU cores, GPU, DDR memory, and peripheral blocks. ⭐ Key Features ⚡ 1. High-Integration Power Architecture Multiple synchronous buck converters (high-current rails for CPU/GPU) Several LDO regulators for low-noise analog and IO domains Supports dynamic voltage scaling (DVS) for performance optimization 🔌 2. Wide Output Capability Output voltage range: ~0.5 V to 3.4 V per channel Designed for modern low-voltage SoC power domains Supports both high-current and low-noise power rails 🧠 3. Programmable Power Sequencing OTP / register-configurable power-up & power-down sequence Ensures safe startup for multi-rail SoCs Supports synchronized sequencing with multiple PMICs 📡 4. Digital Control Interface I²C and SPI interface for configuration and control Real-time voltage adjustment per processor demand Register-based control for power modes and telemetry 🛡️ 5. Protection & Reliability Features Over-voltage protection (OVP) Over-current protection (OCP) Thermal shutdown protection Soft-start for inrush current control ⚙️ 6. Efficiency & Performance Optimizations High-frequency switching (~MHz range) for smaller external components Fast transient response for CPU load changes Low standby current for power-sensitive designs 📦 7. Package & Integration QFN-68 (7×7 mm) compact package High thermal efficiency for dense PCB layouts Minimal external components required 📌 Typical Applications Single-board computers (SBCs) AI edge computing devices Tablets and industrial embedded systems Consumer electronics using Rockchip SoCs (e.g., RK3588 platforms) #commonpartslibrary #integratedcircuit #powermanagement

ARM® Cortex®-M4F System On Chip (SOC) IC Apollo3 Blue 96MHz 66-CSP (3.38x3.25) #CommonPartsLibrary #IntegratedCircuit #SOC #AMA3B1KK