100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 100-pin surface-mount receptacle connector used to connect two PCBs in a stacked configuration. The DF40HC series is known for ultra-fine pitch and high-speed signal capability, making it suitable for modern embedded and communication systems. Connector type: Board-to-board (mezzanine), receptacle Number of contacts: 100 positions (2-row layout) Pitch: 0.4 mm (very fine pitch for high-density routing) Stacking height: 3.0 mm (fixed mated height) Mounting: Surface-mount (SMT) Orientation: Straight Contact plating: Gold (for reliable conductivity and corrosion resistance) Rated current: 0.3 A per contact Rated voltage: 50 V AC/DC Contact resistance: ≤ 90 mΩ Withstanding voltage: 150 V max High-speed capability: up to 20 Gbps, supports interfaces like: USB 3.1 / USB 3.0 PCIe SATA MIPI Connector size: Length: ~22.6 mm Width: ~3.38 mm Height: ~2.9 mm Mating durability: ~30 cycles Operating temperature: -55°C to +85°C #CommonPartsLibrary #Connector #Mezzanine-connector #DF40

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40C-100DS-0.4V(51) is a board-to-board and board-to-FPC receptacle connector manufactured by Hirose Electric. It belongs to the DF40 series, a family of fine-pitch stacking connectors intended for compact, high-density interconnect applications such as mobile devices, cameras, wearables, and other space-constrained electronics. The connector functions as the receptacle (socket) half of a mating pair, designed to stack with a corresponding DF40 plug header to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile vertical arrangement. This particular part number represents the full-position, low-profile variant within the series, configured without a reinforcing metal fitting and without a locating boss or mechanical holddown feature, meaning it relies on the contact array itself rather than additional structural hardware for mechanical retention during reflow and handling. The connector is supplied in straight, surface-mount form and is non-polarized, so it can be inserted in either orientation relative to its mating counterpart. Contacts are arranged in parallel rows along the connector body, with gold plating in the contact mating area to ensure reliable signal continuity and resistance to oxidation over repeated use. The series is positioned by Hirose as a general-purpose, high-speed-capable interconnect, suitable for a range of differential and single-ended signaling standards used in consumer and industrial electronics, with the broader DF40 family supporting interfaces such as USB, MIPI, SATA, and PCIe. Its low stacking height and fine contact pitch make it well suited to applications where board-to-board spacing must be minimized, such as camera modules, display modules, or stacked daughterboard architectures in handheld and wearable products. The connector is packaged on embossed carrier tape for automated pick-and-place assembly, and its construction is compliant with RoHS material restrictions. Mechanically, the connector body is built to support repeated mating cycles typical of consumer electronics assembly and rework, while maintaining stable electrical contact under vibration and thermal cycling across its rated environmental range. As a stacking-style connector rather than a card-edge or cable-mount type, it is intended to be soldered directly to a host PCB pad pattern, with the mating plug soldered to the corresponding board or FPC, allowing the two assemblies to be joined and separated as needed during manufacturing, test, or service operations. Spec Sheet Identification Part Number: DF40C-100DS-0.4V(51) Series: DF40 Variant: "C" type — without reinforcing metal fitting Connector Type / Configuration Type: Receptacle (socket), board-to-board / board-to-FPC Gender: Female Orientation: Straight Row Arrangement: Dual row Polarization: Non-polarized Locking/Retention Feature: None (no metal holddown or locating boss) Electrical Ratings Current Rating: Low-current signal class Voltage Rating: Standard signal-level rating typical of fine-pitch board-to-board connectors Applicable High-Speed Protocols: USB, MIPI, SATA, PCIe (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Stacking/Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics rework Contact & Material Properties Contact Material: Phosphor bronze Contact Plating (Mating Area): Gold Insulator Color: Black Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings Operating Temperature Range: Extended consumer/industrial range RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding DF40 series plug/header connector Application Note: Intended for mezzanine-style stacking between two PCBs or between a PCB and FPC #DF40 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #StackingConnector #CommonPartsLibrary #Connector #SMTConnector #FinePitchConnector #MezzanineConnector #ElectronicComponents #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #ConsumerElectronics #HighSpeedConnector #RoHSCompliant #ComponentLibrary

20 Position Connector Header, Center Strip Contacts Surface Mount Gold DF30FC-20DP-0.4V(81) is a 20-position, 0.4 mm pitch, surface-mount (SMT) board-to-board mezzanine connector from the Hirose DF30 series. It is the plug/header (DP) side of the connector pair and is designed for ultra-low-profile, high-density PCB stacking applications commonly found in compact embedded systems, cameras, wireless modules, industrial electronics, and portable devices. The connector features gold-plated contacts for reliable electrical performance and supports a mating height of approximately 0.9 mm when paired with the corresponding receptacle. 20 contacts / positions 0.4 mm fine pitch for high-density designs Board-to-board (mezzanine) connector Surface-mount (SMT) mounting Ultra-low mating height (~0.9 mm) Gold-plated contacts for improved reliability Straight orientation Compact footprint for space-constrained applications Rated for approximately 50 mating cycles Operating temperature range: -35°C to +85°C RoHS compliant Typical Applications Embedded computing modules Camera and imaging systems Industrial control equipment IoT devices Portable electronics Wireless communication modules #Hirose #DF30Series #BoardToBoardConnector #MezzanineConnector #SMTConnector #HighDensityConnector #0p4mmPitch #EmbeddedSystems #IoT #ElectronicsDesign #PCBDesign #CompactElectronics #ConnectorSolutions

24 Position Connector Header, Center Strip Contacts Surface Mount Gold The AXT424124 is a Panasonic P4S series 0.4 mm pitch board-to-board / board-to-FPC connector, specifically a 24-position surface-mount header designed for compact, high-density electronic assemblies. It is commonly used in mobile devices and industrial equipment where space saving and reliable fine-pitch interconnection are required. This connector belongs to Panasonic’s P4S narrow-pitch interconnect family, optimized for very small pitch stacking (0.4 mm) and low-profile designs. It supports mating with a corresponding socket connector to form a mezzanine-style board connection. Key Features Ultra-fine pitch: 0.4 mm for high-density PCB layouts 24-pin dual-row header configuration Board-to-board / board-to-FPC compatibility Low profile design with ~1.5 mm mating height option Space-saving construction for compact electronics High reliability “TOUGH CONTACT” design for stable electrical connection Gold-plated contacts for improved conductivity and corrosion resistance Current rating: ~0.3 A per pin (total limited) Dielectric strength: 150 V AC Insulation resistance: ≥ 1000 MΩ Insertion life: ~50 mating cycles Surface-mount (SMD) termination for automated PCB assembly Typical Applications Smartphones and portable consumer electronics Industrial control modules Compact embedded systems Wearable devices and space-constrained PCBs #Panasonic #AXT424124 #P4SSeries #BoardToBoardConnector #FPCConnector #0.4mmPitch #SMDConnector #MezzanineConnector #HighDensityPCB #ElectronicComponents

Amphenol COM-HPC 400-position board-to-board mezzanine connector with 0.635 mm pitch, open-pin-field contact array, outer shroud, gold-plated contacts, and surface-mount termination. Keywords / Hashtags: 10163479-14340T1LF, Amphenol COM-HPC, 400-pin connector, 0.635mm pitch, board-to-board connector, mezzanine connector, SMT connector, open-pin-field, #COMHPC #Amphenol #BoardToBoard #MezzanineConnector #400Pin #0635mm #SMTConnector

10 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold The SFM-105-02-X-D-A is a high-reliability dual-row socket connector designed for board-to-board and mezzanine interconnection applications. Manufactured by Samtec, this connector provides a compact and durable solution for connecting printed circuit boards in embedded systems, industrial electronics, communications equipment, test instruments, and high-performance computing platforms. The connector features precision-machined contacts that ensure consistent electrical performance, excellent mating reliability, and long operational life. Its low-profile design and high-density contact arrangement make it suitable for applications requiring space-efficient interconnect solutions while maintaining signal integrity and mechanical robustness. Engineering Specifications Manufacturer: Samtec Part Number: SFM-105-02-X-D-A Series: SFM Series Connector Type: Board-to-Board Socket Connector Contact System: Precision Socket Contacts Row Configuration: Dual Row Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Temperature Thermoplastic Mating Compatibility: Standard Samtec Header Systems Electrical Performance: High-Reliability Signal Interconnection Mechanical Durability: High Mating Cycle Life Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Control Equipment, Communication Systems, Data Acquisition Platforms, Instrumentation, Test Equipment, Computing Hardware, PCB Interconnect Solutions Key Features High-density dual-row socket configuration Precision-machined contacts for reliable electrical performance Gold-plated contact interface for enhanced conductivity and durability Compact footprint for space-constrained designs Excellent mating alignment and retention characteristics High mechanical durability for repeated insertion cycles Suitable for board stacking and mezzanine interconnections Compatible with a wide range of Samtec header connectors Designed for industrial and commercial electronic systems Supports reliable signal transmission in high-performance applications #SFM10502XDA #Samtec #BoardToBoardConnector #SocketConnector #DualRowConnector #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #CommunicationSystems #Instrumentation #DataAcquisition #MezzanineConnector #ThroughHoleConnector #ElectronicComponents #PCBDesign #SignalIntegrity #HighReliability #ConnectorTechnology #EmbeddedHardware

Board-to-Board Mezzanine Connector – 40-position board-to-board mezzanine connector for compact embedded systems, industrial electronics, consumer devices, communication modules, and high-density PCB interconnect applications. Features a 0.4 mm pitch, 2-row, vertical (180°) surface-mount configuration, and supports 300 mA maximum current per contact with a 60 V voltage rating. Constructed with gold-plated phosphor bronze contacts for excellent conductivity and long-term reliability, the connector is designed for high-density PCB stacking in space-constrained applications. Specified for operation over a −55°C to +85°C temperature range and supplied in an SMT package. #TXGA #FBB04004F40S1003K6M #BoardToBoardConnector #MezzanineConnector #40PinConnector #040mmPitch #SMTConnector #PCBInterconnect #HighDensityConnector #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector