Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems

2.4 GHz Wi-Fi® + Bluetooth® 5 SoC – High-performance dual-core Xtensa® LX7 wireless System-on-Chip (SoC) for IoT devices, smart home products, industrial automation, AIoT, wearable electronics, HMI systems, and embedded wireless applications. Operates at up to 240 MHz with 512 KB on-chip SRAM and supports external SPI Flash and PSRAM. Integrates Wi-Fi 802.11 b/g/n (2.4 GHz) and Bluetooth® 5 (LE) with Long Range and 2 Mbps PHY, delivering up to +21 dBm transmit power and 150 Mbps maximum Wi-Fi data rate. Features native USB 2.0 OTG, AI vector instructions for machine learning acceleration, 30 GPIOs, SPI, I²C, I²S, UART, RMT, LCD/Camera interface, TWAI® (CAN-compatible), PWM, ADC, capacitive touch sensing, AES-128/256, SHA, RSA, ECC, HMAC, Flash encryption, Secure Boot, and a True Random Number Generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +105°C temperature range, and is housed in a 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3 #WirelessSoC #WiFi #Bluetooth5 #DualCore #XtensaLX7 #USBOTG #AIoT #IoT #SecureBoot #FlashEncryption #EmbeddedSystems

ESP32-C3FN4 QFN-32_L5.0-W5.0-P0.50-BL-EP3.7 LCSC Part Number: C2848860 JLCPCB Part Class: Extended Part Manufactured by ESPRESSIF(乐鑫) Espressif ESP32-C3FN4 2.4GHz Wi-Fi 802.11b/g/n and Bluetooth 5.0 LE wireless SoC, RISC-V single-core microcontroller, integrated 4MB flash memory, 2.402GHz to 2.48GHz RF transceiver, antenna not included, surface-mount package, suitable for IoT devices, wireless sensors, smart home, BLE and Wi-Fi embedded applications. Search Keywords: ESP32-C3FN4, Espressif ESP32-C3FN4, ESP32 C3FN4, ESP32-C3 4MB flash, ESP32-C3 WiFi Bluetooth SoC, ESP32-C3FN4 RF transceiver, ESP32-C3FN4 Bluetooth 5.0, ESP32-C3FN4 WiFi 802.11bgn, ESP32-C3FN4 SMD, ESP32-C3FN4 DigiKey, ESP32-C3FN4 datasheet, 1904-ESP32-C3FN4TR-ND, 1904-ESP32-C3FN4CT-ND, ESP32-C3 RISC-V SoC Hashtags: #ESP32C3FN4 #ESP32C3 #EspressifESP32C3 #EspressifSystems #WiFiBluetoothSoC #WiFiSoC #BluetoothLESoC #BLE5 #80211bgn #RISCVMicrocontroller #4MBFlash #RFTransceiver #24GHzWiFi #IoTSoC #WirelessMCU