Dip Switch SPST 2 Position Surface Mount Slide (Standard) Actuator 25mA 24VDC The 218-2LPSTJ is a two-position pluggable terminal block connector designed for secure wire-to-board connections in industrial and commercial electronic applications. It features a screw-clamp termination mechanism, allowing reliable and reusable connections for solid or stranded wires. The connector is typically used in power distribution, control systems, and signal wiring where ease of maintenance and field wiring is required. Key Features Pluggable terminal block, two positions Screw-clamp wire termination for secure connection Standard pitch suitable for common PCB layouts Removable plug for easy installation and maintenance Designed for solid and stranded wire compatibility High reliability for industrial environments Mechanical Specifications Number of Positions: 2 Pitch: 5.08 mm Mounting Type: Through-hole (header) with mating plug Wire Entry: Side entry Wire Gauge Range: Typically 24 AWG to 12 AWG (manufacturer dependent) Housing Material: High-temperature thermoplastic Color: Typically green Electrical Specifications Rated Voltage: Up to 300 V (UL rating typical) Rated Current: Up to 10–15 A (depending on wire size and conditions) Contact Resistance: Low resistance, suitable for power and signal transmission Insulation Resistance: High insulation resistance under standard conditions Environmental Specifications Operating Temperature Range: −40°C to +105°C (typical) Flammability Rating: UL94 V-0 RoHS Compliant: Yes Applications Power supply connections Industrial control systems HVAC equipment Automation and instrumentation PCB-based terminal interfaces Mating / Compatibility Compatible with corresponding 2-position pluggable terminal block headers with 5.08 mm pitch Designed for repeated mating cycles without degradation #commonpartslibrary #switch #dip #spst

USB-C (USB TYPE-C) Receptacle Connector 24 Position Panel Mount, Through Hole, Right Angle The MUSBRM1C1M0 is a ruggedized USB Type-C receptacle connector designed for high-reliability data and power connectivity in industrial, embedded, transportation, and harsh-environment applications. The connector features a reversible USB Type-C interface that supports modern high-speed communication protocols while providing robust mechanical durability and secure board-level attachment. Its reinforced construction helps withstand vibration, shock, and repeated mating cycles, making it suitable for demanding applications where reliability and long service life are critical. The device is commonly used in industrial controllers, communication equipment, medical devices, consumer electronics, and next-generation embedded systems requiring compact and versatile connectivity. Engineering Specifications Manufacturer: Amphenol Communications Solutions Part Number: MUSBRM1C1M0 Connector Type: USB Type-C Receptacle Interface Standard: Universal Serial Bus Type-C Connector Gender: Receptacle Mounting Style: Surface Mount Orientation: Right Angle Contact Configuration: USB Type-C Multi-Function Interface Data Support: High-Speed Data Transmission Power Delivery Support: Compatible with USB Power Delivery Architectures Shielding: Integrated EMI Shielding Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Strength Metal Shield Construction Durability: High Mating Cycle Life Environmental Performance: Designed for Industrial Applications Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Automation, Consumer Electronics, Communication Equipment, Medical Devices, IoT Products, Portable Electronics, Data Acquisition Systems Key Features Reversible USB Type-C connection interface Ruggedized mechanical construction High-speed data communication capability Secure PCB mounting design Enhanced resistance to vibration and mechanical stress Integrated shielding for improved electromagnetic compatibility Compact footprint for space-constrained designs Supports modern USB power and data architectures Long operational lifespan with high insertion cycle durability Suitable for industrial and commercial electronic systems #MUSBRM1C1M0 #Amphenol #USBTypeC #USBConnector #TypeCReceptacle #HighSpeedConnectivity #PowerDelivery #IndustrialElectronics #EmbeddedSystems #CommunicationEquipment #IoTDevices #ConsumerElectronics #PCBDesign #ElectronicComponents #SurfaceMount #DataTransmission #USBPD #IndustrialAutomation #MedicalElectronics #ConnectorTechnology

15 µH Shielded Drum Core, Wirewound Inductor 3.5 A 92mOhm Max Nonstandard The SRP7050TA-150M is a high-performance photovoltaic module designed for utility-scale and large commercial solar power applications. The module utilizes advanced monocrystalline cell technology to deliver high energy conversion efficiency, reliable power generation, and long-term operational stability under varying environmental conditions. Its robust mechanical construction and optimized electrical characteristics provide dependable performance in demanding outdoor installations, including regions exposed to high wind loads, elevated temperatures, and extended solar irradiance. The module is engineered to support high system voltage configurations while maintaining low degradation rates and enhanced energy yield over its service life. The design incorporates reinforced framing, tempered high-transmission glass, and weather-resistant encapsulation materials to ensure durability against moisture ingress, ultraviolet exposure, and mechanical stress. The product is suitable for fixed-tilt and tracker-based mounting systems and is compatible with standard industry installation practices. Electrical performance is optimized for maximum power output with improved temperature behavior and reduced resistive losses. The module supports efficient integration into modern photovoltaic systems requiring high-density energy production and reliable long-term operation. Safety and quality compliance are aligned with internationally recognized photovoltaic module standards for performance, durability, and environmental resilience. The SRP7050TA-150M is intended for grid-connected solar energy systems where high efficiency, operational reliability, and reduced balance-of-system costs are critical project requirements. #commonpartslibrary #inductor

The TGS2611-C00 specification defines the engineering requirements for a semiconductor gas sensor designed for the detection of combustible gases in industrial, commercial, and embedded monitoring systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate gas detection, stable sensing characteristics, and long-term operational reliability. The sensor is intended for use in gas leak detection equipment, safety monitoring systems, residential and commercial appliances, industrial automation, and environmental monitoring applications. It utilizes semiconductor sensing technology to detect target combustible gases with high sensitivity and repeatable performance, enabling reliable monitoring and early warning in safety-critical environments. Engineering Requirements The gas sensor shall be manufactured using qualified semiconductor sensing materials and controlled production processes to ensure consistent sensitivity, repeatability, and long-term stability. The sensing element shall maintain reliable performance under specified operating voltage, temperature, humidity, and environmental conditions. Electrical characteristics shall provide stable output response, repeatable detection performance, and predictable recovery behavior following gas exposure. The sensor shall maintain reliable operation during continuous monitoring while minimizing drift and preserving measurement consistency throughout its service life. The sensing element shall provide dependable detection of the intended combustible gases while maintaining resistance to environmental influences and normal operational contaminants. The sensor shall exhibit stable response characteristics suitable for integration with embedded control systems and gas monitoring electronics. Mechanical construction shall provide adequate protection for the sensing element while allowing sufficient exposure to the surrounding atmosphere for effective gas diffusion. The package shall withstand handling, vibration, thermal cycling, and standard assembly processes without degradation of sensing performance or structural integrity. Workmanship shall be free from defects including contamination, mechanical damage, corrosion, package deformation, or structural inconsistencies that could adversely affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, gas sensitivity characteristics, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #GasSensor #CombustibleGasSensor #SemiconductorSensor #GasDetection #IndustrialSafety #EmbeddedSystems #EnvironmentalMonitoring #QualityAssurance #EngineeringDocumentation

Slide Switch, SPDT, On-On, Through Hole, OS Series, 100mA # OS102011MS2QN1 ## General Description The OS102011MS2QN1 is a miniature slide switch manufactured by C&K, designed for low-power signal switching and control applications in electronic equipment. The switch features a compact mechanical design, reliable contact performance, and through-hole mounting configuration, making it suitable for embedded systems, industrial controls, instrumentation, telecommunications equipment, consumer electronics, and portable devices. Its robust construction ensures dependable operation throughout repeated switching cycles while maintaining stable electrical performance. The device is commonly utilized for mode selection, power control, configuration settings, and user-interface functions within electronic assemblies. ## Key Features ### Mechanical Characteristics * Miniature slide switch construction * Through-hole PCB mounting * Compact form factor * Durable actuator mechanism * Positive switching action * Designed for repeated mechanical operation ### Switching Characteristics * Maintained-contact operation * Reliable position retention * Low-force actuation * Stable contact engagement * Suitable for signal and control switching applications ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Stable switching performance * Suitable for low-current and low-voltage circuits * Consistent electrical operation throughout service life ### Contact System * High-reliability contact materials * Corrosion-resistant contact surfaces * Long operational durability * Dependable electrical continuity ### Material Construction * High-strength thermoplastic housing * Industrial-grade metallic contacts * Durable actuator assembly * RoHS-compliant materials ### Environmental Characteristics * Suitable for commercial and industrial electronic equipment * Resistant to mechanical wear * Reliable performance under normal operating environments * Designed for long-term service reliability ### Application Areas * Embedded Systems * Industrial Control Equipment * Consumer Electronics * Test and Measurement Instruments * Communication Devices * Medical Electronics * Power Control Circuits * User Interface Controls * Configuration and Mode Selection Functions * Electronic Development Platforms ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Switching Component ## Manufacturer C&K ## Product Family OS Series Miniature Slide Switches #OS102011MS2QN1 #CKSwitches #SlideSwitch #MiniatureSwitch #ElectronicSwitch #PCBSwitch #EmbeddedSystems #IndustrialElectronics #ControlSystems #ConsumerElectronics #HardwareDesign #ElectronicsEngineering #SignalSwitching #PCBAssembly #ElectronicComponents #commonpartslibrary #switch #slide #spdt

Temperature Sensor Digital, Local -55°C ~ 150°C 16 b 6-WSON (2x2) The TMP117AIDRVR is a high-precision digital temperature sensor manufactured by Texas Instruments. The device provides accurate temperature measurements through an I²C-compatible digital interface and is optimized for applications requiring medical-grade accuracy, low power consumption, and compact PCB footprint. The sensor integrates a precision temperature sensing element, analog-to-digital converter, calibration memory, and digital interface into a single compact package. The device supports continuous conversion and shutdown operating modes, enabling efficient thermal monitoring in battery-powered and always-on systems. Internal calibration minimizes external component requirements while providing highly linear and repeatable temperature measurements across an extended operating range. The TMP117AIDRVR is commonly used in industrial controls, wearable electronics, healthcare equipment, environmental monitoring systems, battery management systems, consumer electronics, and precision instrumentation. Electrical Characteristics Supply voltage supports low-voltage digital systems and portable electronics applications. Ultra-low operating current enables long battery life in energy-sensitive designs. Integrated EEPROM allows programmable offset correction and configuration storage. Digital output eliminates the need for external ADC circuitry. High measurement resolution supports precision thermal monitoring applications. Low self-heating characteristics improve measurement stability and accuracy. Functional Features High-accuracy digital temperature sensing. I²C and SMBus compatible communication interface. Programmable alert functionality for thermal threshold monitoring. Continuous conversion and low-power shutdown operating modes. Integrated non-volatile memory for user configuration storage. Wide operating temperature range for industrial and commercial environments. Fast conversion timing suitable for real-time monitoring systems. Factory-calibrated performance requiring minimal external calibration. Package Information Package type is WSON with compact surface-mount footprint suitable for dense PCB layouts. Moisture-sensitive package designed for automated assembly processes. Lead-free and RoHS-compliant construction. Typical Applications Medical thermometers and patient monitoring systems. Industrial temperature monitoring equipment. Battery-powered portable electronics. HVAC and environmental sensing systems. Data acquisition and instrumentation systems. Server and embedded thermal management applications. Consumer electronics requiring precision thermal sensing. #commonpartslibrary #integratedcircuit #temperaturesensor

Red, Green, Blue (RGB) 624nm Red, 525nm Green, 470nm Blue LED Indication - Discrete 2V Red, 3.3V Green, 3.3V Blue 4-SMD, No Lead # 150080M153000 ## General Description The 150080M153000 is a compact surface-mount full-color RGB LED manufactured by Würth Elektronik as part of the WL-SFCD series. The device integrates red, green, and blue light-emitting elements within a single package, enabling the generation of a wide spectrum of colors for status indication, user interfaces, backlighting, visual notifications, and decorative lighting applications. Its diffused lens design provides uniform light distribution and wide viewing visibility, making it suitable for industrial equipment, consumer electronics, communication devices, instrumentation systems, control panels, and embedded electronic products. The component is optimized for automated assembly processes and offers reliable optical performance, low power consumption, and long operational life. ## Key Features ### Optical Characteristics * Full-color RGB light output * Integrated red, green, and blue emitters * Diffused lens design for uniform illumination * Wide viewing angle * High-visibility indication capability * Consistent color performance ### Electrical Characteristics * Low-power operation * Stable optical output * Suitable for indicator and backlighting applications * Reliable performance across operating conditions * Optimized for embedded electronic systems ### Mechanical Characteristics * Surface-mount package construction * Compact footprint * Low-profile package design * Compatible with automated assembly processes * Reflow-soldering compatible ### Package Construction * Common-anode configuration * Integrated multi-die LED architecture * Rectangular lens geometry * Lead-free package design * Industrial-grade construction ### Material Characteristics * High-quality encapsulation materials * Diffused optical lens * RoHS-compliant construction * Environmentally compliant materials ### Environmental Characteristics * Suitable for commercial and industrial applications * Long operational service life * Reliable operation under standard environmental conditions * Resistant to normal assembly and handling processes ### Application Areas * Status Indicators * User Interface Displays * Industrial Control Panels * Consumer Electronics * Home Appliances * Telecommunications Equipment * Instrumentation Systems * Backlighting Applications * Smart Devices * Embedded Electronic Products * Safety and Security Equipment * Human-Machine Interface Systems ### Compliance * RoHS Compliant * REACH Compliant * Lead-Free Compatible * Industry-Standard Surface-Mount Technology ## Manufacturer Würth Elektronik ## Product Family WL-SFCD SMD Full-Color Chip LED Series #150080M153000 #WurthElektronik #RGBLED #SMDLED #WLSFCD #FullColorLED #LEDIndicator #Backlighting #Optoelectronics #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #PCBDesign #ElectronicsEngineering #SMTAssembly #commonpartslibrary #optoelectronic #ledindication

PCB-Mount Mini Blade Fuse Holder – Single-circuit through-hole fuse holder for Mini (ATM/FK1) automotive blade fuses used in automotive, commercial vehicle, industrial, and power distribution applications. Features a 32 V operating voltage (125 VDC maximum per manufacturer datasheet), 30 A maximum current rating, vertical PCB mounting, and PC pin through-hole termination. Constructed with tin-plated copper alloy spring contacts and a heat-resistant UL94 V-0 thermoplastic housing, supporting 7.62 mm terminal pitch for easy PCB layout. Designed for Mini (ATM/FK1) blade fuses and suitable for modular row mounting. #Littelfuse #17867640001 #FL1 #FuseHolder #MiniBladeFuse #ATMFuse #PCBMount #ThroughHole #Automotive #CircuitProtection #PowerDistribution #EmbeddedSystems

555 Type, Timer/Oscillator (Single) IC 2.1MHz 8-SOIC The TLC555IDR is a low-power CMOS timer device designed as a functional replacement for the standard bipolar 555 timer while providing significantly reduced supply current and improved operating efficiency. The device supports both astable and monostable operating modes and is commonly used for timing generation, pulse shaping, oscillation, PWM generation, delay circuits, and frequency generation applications. The CMOS architecture enables low power consumption, rail-to-rail output capability, and stable timing performance over a wide operating voltage range. The device is suitable for battery-powered systems, portable electronics, industrial controls, instrumentation, consumer products, and embedded electronic designs. The TLC555IDR is supplied in a compact SOIC surface-mount package intended for automated PCB assembly and space-constrained applications. Electrical Characteristics CMOS low-power timer architecture Functional equivalent to standard 555 timer devices Wide operating supply voltage range Low quiescent supply current High input impedance Rail-to-rail output swing capability Stable threshold and trigger levels Compatible with TTL and CMOS logic levels Capable of astable and monostable operation Adjustable duty cycle and frequency operation High output drive capability for direct interfacing Low noise and improved switching performance compared to bipolar 555 timers Functional Features Precision timing generation Oscillator and clock generation Pulse-width modulation support One-shot pulse generation Delay timer implementation Missing pulse detection Frequency divider implementation Sequential timing control LED flashing and tone generation PWM motor and power control applications Package Information Surface-mount SOIC package Standard tape-and-reel packaging format Compact footprint for automated assembly RoHS compliant device construction Environmental and Operating Conditions Industrial operating temperature range ESD protection handling required Suitable for commercial and industrial embedded systems Designed for low-power electronic applications Typical Applications Timer circuits Pulse generators Oscillators PWM controllers LED flashers Alarm and tone generators Frequency generators Power management timing Embedded control systems Portable battery-powered electronics #commonpartslibrary #integratedcircuit #timer #oscillator

67 Position Female Connector M.2 (NGFF) Mini Card Gold 0.020" (0.50mm) Black # Engineering Specification ## Product Name 2199230-4 ## General Description 2199230-4 is a surface mount board-edge connector designed to support standardized M.2 module interfaces, specifically configured for Key E applications used in wireless communication, embedded computing, and high-speed peripheral expansion systems. The component provides a reliable mechanical and electrical interface between a host printed circuit board and a removable or fixed M.2 module. The connector is engineered to accept gold-finger edge contacts from an M.2 module, enabling secure signal transmission for high-speed data communication, power delivery, and control signaling. Its design supports stable mechanical retention, precise alignment, and consistent electrical contact performance under repeated mating cycles. This component is widely used in industrial computing platforms, telecommunications equipment, IoT devices, and embedded system architectures where modular expansion and standardized connectivity are required. It enables flexible system design by allowing interchangeable M.2 modules for wireless communication, storage, and specialized processing functions. The design emphasizes signal integrity, mechanical durability, and compatibility with high-density PCB layouts. It is suitable for applications requiring robust high-frequency performance and reliable long-term mechanical stability. ## Functional Requirements ### Module Interface The connector shall provide a standardized interface for M.2 Key E module insertion and electrical connection. ### Signal Transmission The connector shall support high-speed electrical signal routing between host systems and M.2 modules. ### Mechanical Retention The connector shall securely retain inserted modules under vibration and operational stress conditions. ### System Modularity The connector shall enable modular expansion and replacement of functional M.2 devices within host systems. ## Electrical Requirements ### Contact Performance The connector shall provide stable electrical contact between gold-finger module pads and host PCB terminals. ### Signal Integrity The design shall support high-frequency signal transmission with minimal loss and interference. ### Power Delivery The connector shall support regulated power distribution to installed M.2 modules. ### Low Resistance Path The electrical interface shall maintain low contact resistance for reliable long-term operation. ## Mechanical Requirements ### Board Edge Mounting The connector shall be mounted on a printed circuit board to accept edge-insertion M.2 modules. ### Alignment and Fit The design shall ensure precise alignment between module contacts and connector terminals. ### Durability The connector shall withstand repeated module insertion and removal cycles without performance degradation. ### Structural Stability The assembly shall maintain mechanical integrity under vibration and operational stress conditions. ## Environmental Requirements ### Operating Conditions The connector shall operate reliably in industrial, commercial, and embedded system environments. ### Thermal Performance The device shall maintain mechanical and electrical stability under elevated operating temperatures. ### Storage and Handling The component shall retain structural and functional integrity during storage, transportation, and assembly processes. ## Quality Requirements ### Reliability The connector shall provide consistent electrical and mechanical performance throughout its operational lifetime. ### Verification Mechanical retention, contact resistance, and signal integrity shall be validated through appropriate qualification testing. ### Compliance The product shall conform to applicable standards governing M.2 interface connectors and high-speed board-edge interconnect systems. ## Documentation Requirements Technical documentation shall include footprint layout guidance, mating interface specifications, signal routing recommendations, mechanical keep-out regions, and application guidelines for M.2 system integration. ## Classification Tags #21992304 #M2Connector #M2KeyE #EdgeCardConnector #GoldFingerInterface #HighSpeedConnector #BoardEdgeConnector #WirelessModuleConnector #PCIeInterface #NGFF #EmbeddedSystems #IoTHardware #TelecomHardware #PCBDesign #MechanicalConnector #SignalIntegrity #HighFrequencyDesign #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #SystemIntegration #HardwareDesign #TEConnectivity #ModuleInterface #BoardToModule

LED Lighting WL-SWTP White, Warm 2700K 3V 20mA 120° 1206 (3216 Metric) The 158301227 is a surface-mount white LED manufactured by Würth Elektronik, belonging to the WL-SWTP series of top-view PLCC-packaged light-emitting diodes designed for general illumination, backlighting, and signal indication applications in compact electronics. It is built on a gallium nitride semiconductor chip, the standard chip technology used in high-efficiency white LED production, which achieves white light emission by combining a blue GaN die with a phosphor conversion layer that down-converts a portion of the blue photons into broader-spectrum yellow light, with the combined blue and yellow output perceived by the human eye as white light. This particular variant is characterized by a warm white Sunrise color temperature, placing it in the lowest color temperature tier of the WL-SWTP family. Warm white light at this color temperature produces a yellowish, incandescent-like appearance that is widely preferred in residential, hospitality, and ambient lighting applications where a soft, comfortable visual environment is desired. This makes the device a natural fit for LED-based replacements for incandescent and halogen light sources in T5 and T8 fluorescent tube form factor products, as well as indoor display backlights, decorative architectural lighting, and other applications where a warm light quality is specified or preferred by end users. The WL-SWTP series features fast switching, no infrared radiation, high color rendering index, slim and miniature size, low power consumption, suitability for all SMT assembly methods, a top-view emission direction, and a wide viewing angle. The high color rendering index characteristic of this device means that objects illuminated by it appear with colors close to how they would look under natural daylight illumination, which is an important quality metric in retail, museum, medical examination, and other environments where accurate color representation enhances user experience or functional accuracy. Texas Instruments The PLCC package style used in this device is a molded plastic leaded chip carrier format that provides a well-defined, mechanically stable footprint for surface-mount assembly, with the optical emitting surface oriented perpendicular to the PCB plane in the top-view configuration. This top-view orientation makes the device suitable for direct illumination of surfaces positioned above the PCB, such as diffusers, light guides, or display panels mounted parallel to the LED board. The compact 3014 package footprint allows high-density LED arrays to be assembled on narrow PCB strips or modules, which is typical in LED tube light and edge-lit backlight designs. The device is supplied on tape-and-reel packaging suitable for automated high-speed pick-and-place assembly at production volumes. Spec Sheet Identification Part Number: 158301227 Series: WL-SWTP — SMD White Top View PLCC LED Manufacturer: Würth Elektronik GmbH & Co. KG Functional Classification Device Type: Surface-mount white LED Chip Technology: Gallium Nitride (GaN) with phosphor conversion Emission Type: White light via blue die plus phosphor down-conversion View Direction: Top view — perpendicular to PCB surface Optical Characteristics Emitting Color: Sunrise warm white Color Temperature: Warm white class, lowest CCT tier in WL-SWTP family Color Rendering Index: High CRI class, suitable for color-critical applications Viewing Angle: Wide angle, broad spatial distribution Infrared Radiation: None — no IR emission Electrical Characteristics Operating Current: Standard signal LED drive current class Forward Voltage: Standard GaN white LED forward voltage class Switching Speed: Fast switching capable Thermal Characteristics Thermal Resistance, Junction to Solder Point: Defined per series specification Maximum LED Junction Temperature: Rated to elevated junction temperature class Package & Mechanical Package Type: PLCC (Plastic Leaded Chip Carrier), PLCC-2 style Package Size: 3014 SMD footprint Mounting Method: Surface mount technology (SMT) Assembly Compatibility: Suitable for all standard SMT assembly methods including reflow soldering Target Applications Signal indication and pilot lights Indoor display backlighting General illumination and commercial lighting Replacement for PLCC 3528 devices in T8 and T5 LED tube designs Architectural and ambient lighting systems Environmental & Qualification RoHS Compliance: Yes REACH Compliance: Yes Packaging Supply Format: Tape-and-reel Standard Reel Quantity: Standard volume reel per Würth packaging convention #WuerthElektronik #WuerthElectronic #WLSWTP #WhiteLED #WarmWhiteLED #SunriseLED #PLCCLED #SMDLed #3014LED #TopViewLED #GaNLED #HighCRI #LEDBacklight #GeneralIllumination #IndoorLighting #SignalLED #LightingDesign #OptoelectronicComponent #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #REACHCompliant

Connector Header Through Hole, Right Angle 3 position 0.200" (5.08mm) #CommonPartsLibrary #Connector #Header #Male-Pins #Commercial MATE-N-LOK

Connector Header Through Hole 22 position 0.100" (2.54mm) PinHeader_1x22_P2.54mm_Vertical General Description The TSW-122-07-G-S is a through-hole vertical pin header manufactured by Samtec. It is part of the TSW series, designed for board-to-board or wire-to-board interconnections. This component features a single-row configuration with standard 2.54 mm pitch spacing, making it widely compatible with common prototyping and production PCB designs. It is commonly used in embedded systems, development boards, and general-purpose electronic assemblies requiring reliable and cost-effective connectivity. Key Features Single-row vertical pin header Through-hole mounting style Standard 2.54 mm pitch spacing Tin-plated contacts for reliable electrical connection Black thermoplastic insulator housing Designed for board-to-board or cable interfacing Compatible with standard mating connectors and sockets Electrical Characteristics Current rating suitable for signal-level and low-power applications Contact resistance designed for stable electrical performance Insulation resistance suitable for typical PCB environments Mechanical Characteristics Number of positions: twenty-two Row configuration: single row Mounting type: through-hole Orientation: vertical Contact material: copper alloy Contact plating: tin Housing material: high-temperature thermoplastic Environmental Characteristics Operating temperature range suitable for industrial and commercial electronics RoHS compliant Designed for durability under normal handling and soldering conditions Applications Microcontroller and development boards Prototyping platforms Board-to-board interconnections Embedded systems General electronic assemblies #commonpartslibrary #connector #header

4 Position Wire to Board Terminal Block Vertical with Board 0.197" (5.00mm) Through Hole The WAGO 2604-3104 is a through-hole PCB terminal block designed for secure wire-to-board power and signal connections in industrial and commercial electronic equipment. It features WAGO Push-in CAGE CLAMP® spring connection technology with integrated lever actuation, allowing fast, tool-free wire insertion and removal. The connector is intended for reliable field wiring applications where vibration resistance, ease of maintenance, and compact PCB integration are required. Engineering Specification Manufacturer: WAGO Manufacturer Part Number: 2604-3104 Product Family: PCB Terminal Block Series: 2604 Connector Type: Wire-to-Board Terminal Block Mounting Style: Through-Hole PCB Mount Orientation: Vertical / Top Entry Number of Positions: 4 Pitch Spacing: 5.00 mm Connection Technology: Push-in CAGE CLAMP® Actuation Method: Lever Operated Wire Size Range: 24 AWG to 12 AWG Supported Conductors: Solid, stranded, and ferruled wires Rated Voltage: Up to 400 V IEC, 300 V UL Rated Current: Up to 32 A IEC, 20 A UL Operating Temperature Range: -60°C to +105°C Insulation Material: Polyamide PA66 Contact Material: Electrolytic Copper Contact Plating: Tin-Plated Spring Material: Chrome Nickel Spring Steel Flammability Rating: UL94 V-0 Color: Gray housing with orange lever PCB Contact Type: THT solder pins Application Areas: Industrial controls, power distribution, automation systems, instrumentation, and general PCB power interconnects. #commonpartslibrary #connector #terminalblock

2 Position Wire to Board Terminal Block Horizontal with Board 0.375" (9.53mm) Through Hole # 1714971 ## General Description The 1714971 is a high-current printed circuit board terminal block manufactured by Phoenix Contact and designed for secure power and signal connections in industrial and commercial electronic equipment. The component utilizes a screw-clamp termination mechanism that provides reliable wire retention, low contact resistance, and long-term electrical stability. Its robust construction and through-hole mounting design make it suitable for applications requiring dependable field wiring, high-current handling capability, and resistance to mechanical stress. The terminal block is commonly used in power supplies, industrial automation systems, motor controllers, battery management systems, energy distribution equipment, instrumentation, and other applications requiring secure PCB-mounted power connections. ## Key Features ### Mechanical Characteristics * Through-hole PCB mounting * Screw-clamp wire termination * Side-entry wire connection * High-strength housing construction * Secure field-wire installation * Designed for repeated maintenance and servicing operations ### Electrical Characteristics * High-current carrying capability * Low contact resistance * Reliable electrical conductivity * Stable performance under demanding operating conditions * Suitable for power distribution and control applications ### Contact System * Corrosion-resistant conductive contacts * Screw-actuated clamping mechanism * Secure conductor retention * Reliable electrical connection during vibration and mechanical stress ### Material Construction * Industrial-grade thermoplastic housing * High-conductivity metal contacts * Flame-resistant insulation materials * RoHS-compliant construction ### Environmental Characteristics * Suitable for industrial environments * Resistant to mechanical wear * Durable under continuous operation * Designed for long service life ### Application Areas * Industrial Automation Equipment * Power Supply Systems * Motor Control Circuits * Battery Management Systems * Renewable Energy Equipment * Electrical Distribution Panels * Instrumentation Systems * Process Control Equipment * Embedded Power Electronics * Industrial Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade PCB Interconnect Solution ## Manufacturer Phoenix Contact ## Product Family COMBICON PCB Terminal Blocks #PhoenixContact #1714971 #COMBICON #TerminalBlock #PCBTerminalBlock #ScrewTerminal #PowerConnector #IndustrialElectronics #PowerDistribution #IndustrialAutomation #EmbeddedSystems #ControlSystems #ElectronicsDesign #PCBAssembly #ElectricalEngineering

22 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold The SSW-122-02-G-S is a surface-mount, single-row socket strip designed for reliable board-to-board or component interconnection in electronic assemblies. It is part of a standardized connector series intended for applications requiring compact form factor, consistent electrical performance, and ease of automated placement. The component features a low-profile design suitable for dense PCB layouts and is commonly used in prototyping, embedded systems, and production-level electronics. Design and Construction The connector is manufactured with precision-aligned contacts housed in a high-temperature thermoplastic body, enabling compatibility with standard reflow soldering processes. The contact system is engineered to ensure stable mechanical retention and consistent electrical conductivity, supporting repeated mating cycles without significant degradation. The materials used provide durability, resistance to thermal stress, and compliance with common industry standards for electronic components. Electrical Characteristics The device is intended to provide reliable signal transmission with minimal contact resistance. It supports low to moderate current applications typical of signal-level interconnections. The contact plating is designed to reduce oxidation and maintain stable electrical performance over time. Mechanical Features The connector is configured as a single-row socket with a defined pitch spacing suitable for standard header interfaces. Its surface-mount termination allows for secure attachment to printed circuit boards while minimizing required board space. The structure supports proper alignment during assembly and ensures consistent engagement with corresponding mating connectors. Applications This component is widely used in applications such as microcontroller boards, communication modules, sensor interfaces, and general-purpose electronic systems. It is suitable for both development environments and final product integration where dependable and space-efficient connectivity is required. Compliance and Reliability The SSW-122-02-G-S is designed to meet common industry requirements for environmental and mechanical reliability. It is typically compliant with RoHS standards and suitable for use in a variety of operating conditions encountered in commercial and industrial electronics. #commonpartslibrary #connector #header

SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32

Mini-LS, commercial temperature, single-port 10/100 Mb/s PHYTER Ethernet physical layer transceiver 1/1 Transceiver Ethernet 40-WQFN (6x6) #CommonPartsLibrary #IntegratedCircuit #interface #Driver #Receiver #Transceiver #DP83848

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect

Connector Header Through Hole 13 position 0.100" (2.54mm) pin header 1x13 2.54mm The TSW-113-07-F-S is a surface-mount, dual-row header designed for reliable board-to-board or board-to-wire connections in compact electronic assemblies. It is commonly used in applications where space efficiency, mechanical stability, and consistent electrical performance are required. The component features a low-profile design suited for automated assembly processes and is compatible with standard reflow soldering techniques. Configuration and Design This connector is configured as a dual-row header with a fine pitch layout, enabling high-density interconnections while maintaining signal integrity. The surface-mount termination style allows for direct placement onto printed circuit boards without the need for through-hole mounting, supporting modern manufacturing practices and reducing assembly time. Material and Construction The housing is typically constructed from a high-temperature thermoplastic material suitable for reflow soldering environments. Contacts are manufactured from a conductive alloy and are plated to enhance durability, corrosion resistance, and electrical conductivity. The plating material is selected to ensure long-term reliability under normal operating conditions. Electrical Characteristics The connector supports low-voltage signal transmission and is designed to maintain consistent contact resistance throughout its service life. It is suitable for general-purpose electronic applications where stable electrical connections are essential. Mechanical Properties The component is engineered to provide secure mating retention and resistance to mechanical stress during handling and operation. Its surface-mount design contributes to improved alignment and stability on the PCB, especially in high-vibration environments when properly soldered. Environmental Considerations The device is capable of operating within standard commercial temperature ranges and is designed to withstand typical environmental conditions encountered in electronic assemblies. Materials used are compliant with common industry standards for environmental safety and manufacturing. #commonpartslibrary #connector #header

Isolated Module DC DC Converter 1 Output 12V 2.5A 9V - 36V Input The PDQ30-Q24-S12-D is a compact isolated DC-DC converter module from CUI Inc. (also associated with Bel Power Solutions product lines). It is designed to convert a wide input voltage range (9–36 VDC) into a regulated 12 VDC output. This module delivers up to 30 watts of power and is packaged in a through-hole 6-DIP form factor, making it suitable for PCB mounting in industrial and embedded applications. It integrates isolation, regulation, and protection features, providing a reliable power solution for sensitive electronic systems. Key Features Power & Electrical Output power: 30 W Output voltage: 12 VDC Output current: up to 2.5 A Input voltage range: 9 – 36 VDC (wide range) Efficiency: up to ~89% Isolation & Protection 1.5 kV isolation voltage Built-in protections: Overcurrent (OCP) Overvoltage (OVP) Overtemperature (OTP) Short circuit protection (SCP) Undervoltage lockout (UVLO) Design & Integration Through-hole 6-DIP package (easy PCB mounting) Compact size: ~25.4 × 25.4 mm Single output design Remote On/Off control (Enable pin) Environmental Operating temperature: –40°C to +105°C Designed for industrial and commercial (ITE) applications Typical Applications Industrial automation systems Telecom and networking equipment Embedded control systems Robotics and process control Power distribution in PCB designs #CommonPartsLibrary #power-supply #DCDC-Converter #PDQ30-D (30W)

ARM® Cortex®-M33 RA6E1 Microcontroller IC 32-Bit 200MHz 1MB (1M x 8) FLASH 64-LFQFP (10x10) ## Engineering Specification ## General Description The **R7FA6E10F2CFM#AA0** is a Renesas Electronics **RA6E1 series microcontroller** designed for embedded control, industrial electronics, IoT edge devices, automation systems, and general-purpose connected applications. It is built around an **Arm Cortex-M33 processor with TrustZone support**, providing high performance, secure execution capability, and flexible integration for modern embedded designs. ## Device Identification Manufacturer Part Number: **R7FA6E10F2CFM#AA0** Manufacturer: **Renesas Electronics** Product Family: **RA Family** Series: **RA6 Series** Group: **RA6E1 Group** Device Category: **Integrated Circuit** Device Type: **Microcontroller Unit** ## Core and Processing The device uses an **Arm Cortex-M33 core** and is intended for high-performance embedded processing. It supports secure application development through TrustZone technology and is suitable for systems requiring reliable control, fast response, and efficient software execution. ## Memory Configuration The microcontroller includes program flash memory, data flash memory, and SRAM resources suitable for embedded firmware, application code, configuration storage, and runtime processing requirements. ## Package and Mechanical Description The component is supplied in an **LQFP surface-mount package**, making it suitable for compact printed circuit board layouts and standard automated assembly processes. ## Electrical and Operating Description The device is designed for low-voltage embedded systems and supports operation across an industrial temperature range. It is suitable for products requiring stable performance in controlled, commercial, or industrial operating environments. ## Communication and Interface Support The device supports common embedded communication interfaces such as USB, UART, SPI, I²C, QSPI, and CAN, allowing integration with sensors, displays, external memory, communication modules, and other peripheral devices. ## Analog and Control Features The microcontroller includes analog conversion capability, timer functions, PWM support, watchdog protection, reset monitoring, and low-voltage detection features. These functions make it suitable for control systems, monitoring equipment, and mixed-signal embedded applications. ## Security and Debug Features The device supports embedded security functions including TrustZone, unique device identification, and true random number generation. Debug and development access is supported through standard JTAG and SWD interfaces. ## Application Suitability This device is suitable for embedded controllers, IoT devices, industrial automation, metering equipment, appliance control, USB-connected products, sensor-based systems, and general electronic control applications requiring a compact and secure microcontroller solution. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #renesas #renesaselectronics #ra6e1 #ra6series #armcortexm33 #embeddedsystems #electronicscomponents #semiconductor #mcu #iotdevices #industrialautomation #pcbdesign #electronicparts #componentlibrary #engineeringparts #hardwaredesign #electronicsengineering

1000 pF ±10% 2000V (2kV) Ceramic Capacitor X7R 1808 (4520 Metric) ## Engineering Specification ## General Description The **C4520X7R3D102K130KE** is a TDK multilayer ceramic chip capacitor designed for high-voltage surface-mount applications. It uses X7R dielectric material and is suitable for circuits requiring stable ceramic capacitance, compact PCB mounting, and reliable high-voltage performance. The component is commonly used in power supplies, filtering circuits, coupling circuits, snubber networks, voltage multiplier circuits, and general electronic assemblies requiring a high-voltage MLCC solution. ## Device Identification Manufacturer Part Number: **C4520X7R3D102K130KE** Manufacturer: **TDK Corporation** Product Series: **C Series** Device Category: **Passive Electronic Component** Device Type: **Multilayer Ceramic Chip Capacitor** Capacitor Type: **Surface-Mount MLCC** Application Grade: **Commercial Grade** ## Functional Description The device functions as a fixed-value ceramic capacitor for energy storage, noise suppression, coupling, decoupling, and filtering applications. It is designed to provide capacitance in a compact surface-mount package while supporting high-voltage operation. The X7R dielectric provides usable capacitance stability across a wide operating temperature range, making the component suitable for many general-purpose and power-related electronic designs. ## Electrical Description The capacitor has a nominal capacitance of **1000 pF** with **±10% tolerance** and a rated voltage of **2000 V DC**. It uses **X7R dielectric characteristics**, making it suitable for applications where moderate capacitance stability and high-voltage capability are required. The device should be operated within the manufacturer’s specified electrical limits to maintain reliability and performance. ## Mechanical Description The component is supplied in a **C4520 metric package**, equivalent to **EIA 1808** chip size. It is designed for surface-mount PCB installation using reflow soldering. The package includes soft termination construction, which helps reduce mechanical stress on the ceramic body and solder joints during board flexing or thermal cycling. ## Material and Construction Description The device is constructed as a multilayer ceramic capacitor using ceramic dielectric layers and internal electrode structures. The soft termination design improves board-level reliability by helping absorb mechanical strain between the PCB and capacitor body. This construction is useful in applications where vibration, thermal expansion, or board bending may affect component reliability. ## Mounting and Assembly Description The capacitor is intended for surface-mount assembly using reflow soldering. PCB land pattern, solder paste volume, component placement, and reflow profile should follow TDK recommendations. Proper spacing, voltage clearance, and creepage considerations should be applied because the component is used in high-voltage circuits. ## Application Suitability The **C4520X7R3D102K130KE** is suitable for high-voltage filtering, DC blocking, coupling, decoupling, power supply circuits, snubber circuits, inverter circuits, lighting equipment, industrial electronics, measurement equipment, and general PCB assemblies requiring a compact high-voltage ceramic capacitor. ## Design Considerations The design should account for rated voltage, capacitance tolerance, DC bias behavior, temperature characteristics, insulation resistance, soldering conditions, mechanical stress, board flex, creepage distance, and clearance distance. For high-voltage applications, PCB layout should provide adequate spacing and avoid contamination paths that may reduce insulation performance. The capacitor should not be used beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #capacitor #ceramiccapacitor #mlcc #tdk #tdkcapacitor #cseries #c4520 #x7r #highvoltagecapacitor #smdcapacitor #surfacemount #passivecomponent #electronicparts #electronicscomponents #pcbdesign #hardwaredesign #powersupply #filteringcircuit #snubbercircuit #decouplingcapacitor #industrialelectronics #componentlibrary #engineeringparts #electronicsengineering