The Wio-WM1110 is a fusion positioning module for developing low-power, long-range IoT applications. It's embedded with Semtech LR1110 and Nordic nRF52840, features Semtech's LoRa technology for long-range wireless communication, GNSS, Wi-Fi, and Bluetooth for location tracking services.

802.15.4, Bluetooth, WiFi Bluetooth v5.0, Zigbee Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N8 integrates a 32-bit RISC-V single-core processor running up to 160 MHz, along with 8 MB of embedded SPI flash memory. It supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band for improved efficiency and lower latency Bluetooth Low Energy (BLE 5) for short-range communication IEEE 802.15.4 for protocols such as Thread and Zigbee The module features a built-in PCB antenna, RF circuitry, crystal oscillator, and passive components, making it a complete solution that simplifies hardware design. It provides a wide range of GPIO pins and peripheral interfaces such as UART, SPI, I2C, PWM, ADC, and more, enabling flexible integration with sensors and external devices. Designed for low power consumption, it includes multiple power-saving modes, making it suitable for battery-powered applications. Typical Applications Smart home and IoT devices Wireless sensors and control systems Industrial automation Smart lighting and energy management Matter-compatible devices (via Thread support)

Connector Header Through Hole 40 position 0.100" (2.54mm) Raspberry Pi 40 pin header The TSW-120-07-G-D is a through-hole, double-row vertical header manufactured by Samtec. It features 40 total positions (2 rows of 20 pins) with a standard 2.54 mm pitch. This connector is widely used for board-to-board connections, prototyping, and general-purpose signal routing in embedded and electronic systems. It is designed for reliable mechanical and electrical performance with gold-plated contacts for enhanced conductivity and corrosion resistance. Manufacturer Samtec Inc. Manufacturer Part Number TSW-120-07-G-D Product Type Through-Hole Pin Header Number of Positions 40 (2 × 20) Number of Rows 2 Pitch 2.54 mm (0.100") Row Spacing 2.54 mm (0.100") Mounting Type Through Hole Orientation Vertical Contact Material Phosphor Bronze Contact Plating Gold (Au) over Nickel Plating Thickness Typically 10 µin (0.25 µm) Gold Insulator Material Black Liquid Crystal Polymer (LCP) Current Rating Typically 3.0 A per contact (depending on application conditions) Voltage Rating Typically 250 VAC Operating Temperature Range -55°C to +125°C Termination Type Solder Contact Style Square Post Post Length Standard Samtec “-07” tail length (approx. 2.92 mm tail, varies slightly per datasheet) Applications Embedded systems (e.g., Raspberry Pi GPIO headers) Development boards and expansion modules Board-to-board interconnects Prototyping and test setups Compliance RoHS Compliant Lead-Free Notes Compatible with standard 2.54 mm female headers and sockets Commonly used in stacking or mezzanine configurations Available in various plating options and pin lengths under the TSW series #commonpartslibrary #connector

ARM® Cortex®-M4 STM32F4 Microcontroller IC 32-Bit Single-Core 168MHz 1MB (1M x 8) FLASH 64-LQFP (10x10) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #STM32F405

Bluetooth, WiFi 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 Transceiver Module 2.4GHz PCB Trace Surface Mount Wi-Fi + Bluetooth module designed for wireless connectivity in embedded applications, integrating the ESP32 dual-core 32-bit LX6 microprocessor with 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth v4.2 BR/EDR + BLE. It operates from a 3.0 V to 3.6 V supply, features 8 MB SPI flash and 2 MB PSRAM, and provides multiple peripheral interfaces including UART, SPI, I²C, I²S, SD/SDIO, PWM, ADC, DAC, CAN (TWAI®), and Ethernet MAC. #WiFiModule #BluetoothModule #ESP32 #Espressif #2_4GHz #BluetoothLE #BluetoothBR_EDR #DualCore #Embedded #IoT #SPIFlash #PSRAM #UART #SPI #I2C #I2S #SDIO #PWM #ADC #DAC #TWAI #EthernetMAC

The FS8205A is a dual N-channel enhancement-mode power MOSFET designed primarily for lithium-ion and lithium-polymer battery protection applications. Manufactured by several semiconductor vendors including Fortune Semiconductor, this device integrates two low on-resistance MOSFETs within a compact surface-mount package, enabling efficient bidirectional current control for battery charging and discharging systems. The device is commonly paired with single-cell battery protection controller ICs such as the DW01A to provide overcharge, overdischarge, overcurrent, and short-circuit protection in portable electronic products. Its low drain-to-source resistance minimizes conduction losses and improves overall battery efficiency while maintaining compact PCB layout requirements. The FS8205A is widely used in battery management systems, portable consumer electronics, rechargeable battery packs, USB-powered devices, IoT hardware, and embedded power management circuits requiring reliable load switching and battery protection functionality. Engineering Specification Device Type Dual N-channel power MOSFET Transistor Technology Enhancement-mode MOSFET architecture Channel Configuration Dual independent N-channel MOSFETs Switching Characteristics Low on-resistance for efficient power switching Gate Characteristics Logic-level gate drive compatibility Current Handling Optimized for battery charge and discharge current control Power Efficiency Low conduction loss for improved battery runtime Protection System Compatibility Designed for lithium battery protection controller integration Thermal Characteristics Compact thermal-efficient surface-mount structure Package Type SOP-8 surface-mount package Mounting Style Surface mount technology Reliability Features Stable switching performance and robust load handling capability Applications Lithium-ion battery protection Battery management systems Portable electronics Rechargeable battery packs USB-powered devices Power path switching Embedded systems Consumer electronics IoT hardware Load switching circuits Manufacturer Commonly manufactured by Fortune Semiconductor and compatible vendors #commonpartslibrary #mosfet #dualmosfet #nchannelmosfet #batteryprotection #batterymanagement #powermanagement #powerelectronics #embeddedhardware #consumerelectronics #surfaceountcomponents #electronicsdesign #lithiumbattery #loadswitch #portableelectronics

8 (6 + 2) Position Card Connector NANO SIM Surface Mount, Right Angle Gold SIM card holder nano SIM The 2452796-1 is a surface-mount Nano SIM card connector from TE Connectivity designed for 4FF Nano SIM applications in cellular, IoT, GPS, and wireless communication devices. It features a hinged locking mechanism for secure card retention and reliable electrical contact in compact embedded systems. The connector is optimized for PCB mounting and supports high durability for repeated SIM card insertion and removal cycles. Key Features Supports 4FF (Nano SIM) cards Hinge-type SIM holder with locking mechanism 7-position contact configuration Surface-mount (SMT) PCB termination Integrated card detection switch Compact right-angle board-mount design Contact material made from copper alloy with gold plating Durable stainless-steel shell construction Operating temperature range: -40°C to +85°C Rated durability up to 2500 mating cycles Suitable for cellular modems, LTE modules, GPS trackers, and IoT devices UL 94V-0 flammability rated housing #CommonPartsLibrary #Connector #NANO SIM

0.5 mOhms ±1% 5W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element # Engineering Specification ## Product Name CSS4J-4026R-L500F ## General Description CSS4J-4026R-L500F is a precision four-terminal Kelvin current sense shunt resistor designed for accurate current measurement in high-performance electronic and power management systems. The device is intended for use in applications requiring low resistance sensing, high measurement accuracy, and stable thermal performance under varying electrical loads. The component utilizes a metal element resistive structure optimized for minimal resistance drift, reduced temperature effects, and consistent long-term stability. Its four-terminal Kelvin configuration separates current flow and voltage sensing paths, enabling improved measurement accuracy by eliminating errors caused by PCB trace and connection resistance. The device is widely used in power conversion systems, battery monitoring systems, motor control circuits, and industrial power electronics where precise current feedback is essential for control, protection, and monitoring functions. Its surface-mount construction supports compact PCB layouts and automated assembly processes while maintaining robust mechanical and electrical reliability. The design emphasizes efficient heat dissipation, stable electrical characteristics, and compatibility with demanding industrial and automotive environments. It is suitable for integration into systems requiring continuous current monitoring and high measurement fidelity. ## Functional Requirements ### Current Measurement The device shall provide accurate current sensing through a low-resistance conductive path designed for minimal measurement error. ### Kelvin Sensing Operation The device shall support four-terminal Kelvin sensing to improve measurement accuracy by separating current and voltage sensing paths. ### Signal Stability The device shall maintain stable sensing characteristics under varying load and thermal conditions. ### System Integration The component shall support integration into power electronics and embedded control systems requiring precise current feedback. ## Electrical Requirements ### Low Resistance Operation The device shall exhibit very low resistance to minimize power loss and maintain measurement accuracy. ### Thermal Stability The resistor shall maintain consistent electrical behavior under elevated operating temperatures and thermal cycling conditions. ### Power Handling The device shall support operation in high-current environments typical of power conversion and motor control systems. ### Measurement Accuracy The design shall support precise voltage drop measurement proportional to current flow for control and monitoring applications. ## Mechanical Requirements ### Surface Mount Construction The device shall be provided in a surface mount package suitable for automated PCB assembly. ### Structural Integrity The component shall maintain mechanical stability during assembly, operation, and thermal cycling. ### PCB Integration The device shall support direct integration into multilayer printed circuit board designs with optimized current path layout. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under industrial and automotive environmental conditions. ### Thermal Performance The component shall maintain performance stability under continuous electrical loading and heat generation. ### Storage and Handling The device shall maintain physical and electrical integrity during storage, transport, and handling procedures. ## Quality Requirements ### Reliability The device shall provide long-term stability in resistance value and sensing accuracy under continuous operation. ### Verification Electrical, thermal, and mechanical characteristics shall be validated through appropriate testing and qualification procedures. ### Compliance The product shall conform to applicable standards for current sensing resistors used in industrial and automotive electronics. ## Documentation Requirements Technical documentation shall include application guidelines, layout recommendations for Kelvin sensing, thermal considerations, electrical characteristics, and integration practices for power electronics systems. ## Classification Tags #CSS4J4026RL500F #CurrentSenseResistor #ShuntResistor #KelvinSensing #FourTerminalResistor #PowerElectronics #BatteryManagement #MotorControl #PowerSupplyDesign #AnalogSensing #ElectricalEngineering #PCBDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #HighCurrentSensing #PrecisionMeasurement #CircuitDesign

The ESP32-DEVKITC-VE evaluation kit from Espressif Systems is a high-performance development platform for RF, RFID, and wireless applications. It features the ESP32-WROVER-E with embedded Xtensa dual-core 32-bit LX6 microprocessor running up to 240 MHz, with 8MB Flash and 8MB PSRAM for efficient data processing. This board supports Wi-Fi 802.11 b/g/n and Bluetooth® Smart Ready 4.x (BLE) connectivity at 2.4GHz, offering wireless communication options. With 448KB ROM, 520KB SRAM, and 16KB SRAM in RTC, it provides ample memory for complex applications. It includes up to 24 GPIOs, SD card, UART, SPI, SDIO, I2C, LED and motor PWM, I2S, IR, pulse counter, capacitive touch sensor, ADC, DAC, and TWAI® (compatible with ISO 11898-1/CAN 2.0) #commonpartslibrary #ESP32-WROVER-E #evaluationboard

Automotive Mini Blade Fuse Holder (PCB Mount) – Single-circuit PCB-mount fuse holder designed for automotive electronics, industrial equipment, power distribution boards, battery management systems, embedded controllers, and circuit protection applications. Manufactured by Keystone Electronics (Series MINI® 297), it accepts Miniature (ATM) blade fuses and is rated for 30 A and 500 V. Features a vertical through-hole PCB mounting, PC pin termination, brass contacts with tin plating for low contact resistance and reliable conductivity, and is UL recognized for safety. The compact design provides secure retention of 11.0 mm × 3.85 mm mini blade fuses, making it suitable for high-current PCB-based protection circuits in automotive and industrial environments. #KeystoneElectronics #3568 #MiniBladeFuseHolder #ATMFuseHolder #FuseHolder #CircuitProtection #PCBMount #ThroughHole #AutomotiveElectronics #IndustrialElectronics #PowerDistribution #EmbeddedSystems

RP2040 XIAO RP2040 - ARM® Cortex®-M0+ MCU 32-Bit Embedded Evaluation Board #CommonPartsLibrary #Developmentboard #MCU #Evaluationboard

1/1 Transceiver Half CANbus 8-SOIC The SN65HVD230DR is a high-speed Controller Area Network (CAN) transceiver designed to interface a CAN protocol controller with the physical two-wire CAN bus. It operates as a differential line driver and receiver, translating logic-level signals into robust bus-level signals suitable for automotive, industrial, and distributed control applications. The device is optimized for reliable communication in electrically noisy environments and supports low-power operation, making it suitable for systems requiring energy efficiency and extended operational stability. This transceiver conforms to widely adopted CAN physical layer standards and is intended for use in systems requiring high data integrity, fault tolerance, and electromagnetic compatibility. It integrates protection features and supports standby functionality to reduce system power consumption when communication is inactive. Functional Overview The device provides bidirectional signal conversion between a CAN controller and the differential CAN bus lines. It features a transmit data input and a receive data output, enabling full-duplex communication at the protocol level. The driver stage generates differential output signals on the bus, while the receiver stage detects and translates bus signals back into logic-level data. An internal control mechanism allows the device to enter a low-power standby mode, reducing current consumption when active communication is not required. The transceiver includes slope control capability to manage signal edge rates, which helps minimize electromagnetic interference and improves signal integrity across the network. Electrical Characteristics The transceiver operates from a single low-voltage supply and is designed for compatibility with modern microcontrollers and digital logic systems. It provides differential output drive capability with controlled rise and fall characteristics. The receiver is designed with high input sensitivity and noise immunity to ensure accurate signal detection under varying bus conditions. The device includes thermal protection and safeguards against bus faults, including short-circuit conditions. Its internal circuitry is designed to maintain stable operation across a wide range of environmental conditions and supply variations. Interface Requirements The logic interface is compatible with standard digital input and output levels, allowing direct connection to a CAN controller. The bus interface consists of two differential lines that connect to the CAN network. Proper termination and layout practices are required to ensure optimal communication performance and compliance with CAN network design guidelines. Operating Conditions The device is intended for operation across a broad temperature range suitable for industrial and automotive environments. It maintains functional integrity under typical voltage fluctuations and environmental stresses encountered in embedded systems. Protection and Reliability Features The transceiver incorporates protection mechanisms to guard against overcurrent, thermal overload, and electrostatic discharge. It is designed to maintain communication reliability even in the presence of transient disturbances and electrical noise. Packaging and Integration The SN65HVD230DR is provided in a compact surface-mount package suitable for automated assembly. Its pin configuration supports straightforward integration into printed circuit board designs with minimal external components. #CommonPartsLibrary #IntegratedCircuits #Interface #Drivers #Receivers #Transceivers #65HVD230

Connector Header Through Hole 12 position 0.100" (2.54mm) pin header 1x12 2.54mm The TSW-112-07-G-S is a single-row, 12-position, 2.54 mm pitch through-hole male pin header from Samtec’s TSW series. It is designed for reliable board-to-board or wire-to-board connections in prototyping and production environments. Featuring gold-plated phosphor bronze contacts and a durable PBT housing, this connector ensures excellent electrical performance, corrosion resistance, and mechanical durability. It is commonly used in embedded systems, development boards, and general-purpose PCB interconnections. Product Type Pin Header / Pin Strip Number of Positions 12 Number of Rows 1 Pitch 2.54 mm (0.1 in) Mounting Style Through Hole Mounting Angle Straight Termination Style Solder Pin Contact Type Male Pin Contact Material Phosphor Bronze Contact Plating Gold Housing Material Polybutylene Terephthalate (PBT) Housing Color Black Flammability Rating UL 94 V-0 Current Rating 4.3 A to 6.3 A (application dependent) Voltage Rating Up to 550 VAC Packaging Bulk Country of Origin Vietnam RoHS Compliance Compliant #commonpartslibrary #connector #header

GNSS Multi-Constellation Embedded Chip Antenna – Surface-mount passive GNSS chip antenna optimized for GPS, GLONASS, Galileo, BeiDou, asset tracking, navigation systems, drones, IoT devices, telematics, and embedded positioning applications. Covers the 1560 MHz to 1602 MHz GNSS frequency band with a 1.575 GHz center frequency, 50 Ω impedance, 3 W maximum input power, and VSWR ≤ 2:1 for efficient satellite signal reception. Features a compact 10 × 10 × 1 mm ceramic SMD package, linear polarization, embedded PCB mounting, and peak gain up to 3.5 dBi, making it suitable for space-constrained wireless designs. Designed for operation over a −40°C to +85°C temperature range and compatible with GPS, GLONASS, Galileo, and BeiDou satellite navigation systems. #TEConnectivity #21189001 #GNSSAntenna #ChipAntenna #GPS #GLONASS #Galileo #BeiDou #EmbeddedAntenna #Navigation #IoT #RFDesign #EmbeddedSystems

Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems

Green 568nm LED Indication - Discrete 2.2V Radial The WP483GDT is a through-hole green light-emitting diode designed for general-purpose visual indication and low-power lighting applications. It emits a visible green wavelength when forward biased and is commonly used in status indicators, signal displays, and basic illumination circuits. The device is built with a durable epoxy lens package that provides mechanical protection and enhances light output visibility. It is suitable for use in a wide range of electronic systems, including consumer electronics, control panels, and embedded designs. Device Overview The component is a standard discrete LED with a two-lead configuration consisting of an anode and a cathode. It operates by converting electrical energy into light through electroluminescence. The emitted color falls within the green spectrum, making it appropriate for applications requiring clear visual signaling without excessive brightness or power consumption. Electrical Characteristics The LED operates under forward bias conditions, with a typical forward voltage in the range expected for green LEDs. It supports low current operation while maintaining consistent luminous output. Reverse voltage tolerance is limited, and proper polarity must be observed to prevent damage. Current-limiting resistors are required in circuit integration to ensure safe operation. Optical Characteristics The device produces a green light output with a defined luminous intensity and viewing angle based on its lens shape and internal structure. The epoxy lens may be diffused or clear, affecting the spread and focus of the emitted light. Brightness is dependent on the forward current applied. Mechanical Characteristics The LED is housed in a standard round through-hole package, compatible with typical PCB mounting. Leads are spaced to fit common board layouts and can be soldered directly. The epoxy body provides insulation and environmental protection while maintaining optical clarity. Thermal Considerations The device is designed for low power dissipation but should be operated within recommended limits to avoid overheating. Adequate spacing and proper current control help maintain thermal stability and prolong device lifespan. Applications The WP483GDT is suitable for indicator lights in electronic devices, status displays in control systems, educational and hobby electronics, and general-purpose signaling applications where green illumination is required. Compliance and Handling The component should be handled using standard ESD precautions. Storage and soldering conditions should follow typical LED handling practices to maintain performance and reliability. #commonpartslibrary #led #green