Connector Header Through Hole 10 position 0.100" (2.54mm) 104128-1 is a 10-position, dual-row, vertical through-hole PCB header from the AMP-LATCH series by TE Connectivity. It is designed for reliable board-to-board and ribbon cable interconnections in signal applications. The connector features a low-profile, shrouded housing with an integrated ejection latch and polarization to ensure secure mating and prevent incorrect insertion. It is commonly used in industrial equipment, embedded systems, instrumentation, telecommunications, and computer peripherals where dependable IDC ribbon cable connections are required. 10-position, 2-row connector 2.54 mm (0.100 in) pitch Vertical through-hole PCB mounting Low-profile shrouded header Integrated ejection latch for secure cable retention Polarized design to prevent mismating Gold-plated mating contacts for reliable signal transmission Tin-lead solder tails for through-hole soldering Maximum current rating: 1 A per contact Operating temperature: -65°C to +105°C UL 94V-0 flame-retardant nylon housing Suitable for board-to-board and ribbon cable signal applications #TEConnectivity #AMPLATCH #RibbonCableConnector #PCBHeader #ThroughHole #BoardToBoard #IDCConnector #VerticalHeader #SignalConnector #EmbeddedSystems #IndustrialElectronics #ElectronicComponents

Isolated Module DC DC Converter 2 Output 12 ~ 15V -12 ~ -15V 125mA, 125mA 18V - 36V Input The CC3-2412DF-E is an isolated DC-DC converter module designed to provide efficient and reliable power conversion in industrial, telecommunications, instrumentation, and embedded electronic systems. The module converts a regulated DC input voltage into isolated dual-output DC supplies while maintaining electrical isolation between the input and output stages. Its compact encapsulated design simplifies PCB integration and enhances system reliability by reducing the need for external conversion circuitry. The device is optimized for applications requiring isolated power rails, noise reduction, and protection against ground loop interference. Engineering Specifications Manufacturer: TDK-Lambda Part Number: CC3-2412DF-E Device Type: Isolated DC-DC Converter Module Conversion Topology: Isolated Power Conversion Input Voltage: Nominal DC Input Operation Output Configuration: Dual Output Output Regulation: Regulated DC Output Isolation Type: Galvanic Isolation Efficiency: High-Efficiency Power Conversion Protection Features: Short Circuit Protection and Overload Tolerance Package Type: Encapsulated Through-Hole Module Mounting Style: Through-Hole Operating Temperature Range: Industrial Grade Reliability: Designed for Continuous Operation RoHS Compliant: Yes Applications: Industrial Automation, Telecommunications Equipment, Embedded Systems, Instrumentation, Data Acquisition Systems, Process Control Equipment, Power Distribution Circuits, Isolated Interface Designs Key Features Isolated input-to-output power conversion Dual regulated output architecture Compact PCB-mount package High efficiency operation Reduced electrical noise and ground loop interference Reliable performance in industrial environments Simplified power supply design integration Robust protection against abnormal operating conditions Suitable for mixed-signal and sensitive analog systems Long operational lifespan and stable output characteristics #CC32412DFE #TDKLambda #DCDCConverter #IsolatedPowerSupply #PowerModule #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerConversion #GalvanicIsolation #Telecommunications #Instrumentation #AutomationSystems #PCBDesign #ElectronicComponents #DualOutput #PowerManagement #IndustrialAutomation #ElectricalEngineering #PowerSupplyDesign

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) LVDS Digital Isolator 5700Vrms 4 Channel 2.5Gbps 40kV/µs CMTI 28-BSSOP (0.295", 7.50mm Width) The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates Analog Devices, Inc., iCoupler® technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 kVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation). FEATURES ► 5.7 kV rms and 1.5 kV rms LVDS isolators ► Complies with TIA/EIA-644-A LVDS signal levels ► Quad-channel configuration ► Any data rate up to 2.5 Gbps switching with low jitter ► 10 Gbps total bandwidth across four channels ► 2.15 ns typical propagation delay ► Typical jitter: 0.82 ps rms random, 40 ps total peak ► Lower power 1.8 V supplies ► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier ► High common-mode transient immunity: 100 kV/μs typical ► Safety and regulatory approvals (28-lead SOIC_W_FP package) ► UL (pending): 5700 V rms for 1 minute per UL 1577 ► CSA Component Acceptance Notice 5A (pending) ► VDE certificate of conformity (pending) ► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 ► VIORM = 849 VPEAK (working voltage) ► Enable or disable refresh (low speed output correctness check) ► Operating temperature range: −40°C to +125°C ► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance APPLICATIONS ► Isolated video and imaging data ► Analog front-end isolation ► Data plane isolation ► Isolated high speed clock and data links ► Multi-gigabit serialization/deserialization (SERDES) ► Board-to-board optical replacement (for example, short reach fiber) #CommonPartsLibrary #ADN4624BRNZ #DigitalIsolator #LVDS #AnalogDevices #HighSpeedInterface #GalvanicIsolation #LVDSIsolator #DigitalIsolation #IndustrialElectronics #HighSpeedData #SERDES #SignalIntegrity #EmbeddedSystems #ElectronicsDesign #InterfaceICs

Ultra-Low-Power Voltage Supervisor (Reset IC) – Single-channel voltage supervisor designed for microcontrollers, processors, IoT devices, industrial control systems, automotive electronics, battery-powered equipment, and embedded systems requiring reliable power-on reset and brownout detection. The Texas Instruments TLV803EA30DBZR monitors a 3.0 V supply rail with a 3.08 V reset threshold, providing an active-low open-drain RESET output to ensure proper system initialization and recovery during undervoltage conditions. Features 250 nA typical quiescent current, 130 ms minimum reset timeout, supply voltage operation from 0.7 V to 6 V, and open-drain output for easy interfacing with multiple voltage domains. Includes power-on reset, brownout protection, and low-power operation, making it ideal for energy-efficient embedded applications. Operates over a −40°C to +125°C temperature range and is housed in a compact 3-pin SOT-23 (DBZ) package for surface-mount designs. #TexasInstruments #TLV803EA30DBZR #TLV803E #VoltageSupervisor #ResetIC #PowerOnReset #BrownoutDetection #LowPower #OpenDrain #PowerManagement #EmbeddedSystems #IndustrialElectronics

Supervisor Open Drain or Open Collector 1 Channel 8-SOIC The MC34164D-5R2G is a high-speed, dual operational amplifier designed for precise analog signal processing in industrial, instrumentation, and consumer electronic applications. It features low offset voltage, low input bias current, and wide bandwidth for accurate and reliable performance across various analog signal conditions. Its robust design provides stable operation under high-speed switching and varying temperature conditions, making it suitable for data acquisition systems, sensor interfaces, audio signal conditioning, control circuits, and measurement instrumentation. The device comes in a compact dual-in-line package for easy PCB integration and versatility in mixed-signal designs. Engineering Specifications Manufacturer: ON Semiconductor Part Number: MC34164D-5R2G Device Type: Dual Operational Amplifier Amplifier Configuration: Dual Op-Amp Input Offset Voltage: Low for Precision Applications Input Bias Current: Low Supply Voltage Range: Wide Operating Range Gain Bandwidth Product: High for Fast Signal Processing Slew Rate: Optimized for High-Speed Applications Output Type: Rail-to-Rail Compatible Noise Performance: Low Noise Analog Operation Package Type: Small Outline Integrated Circuit (SOIC) Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Sensor Signal Conditioning, Data Acquisition, Control Systems, Audio Processing, Industrial Instrumentation, Embedded Analog Circuits, Measurement and Monitoring Equipment, General-Purpose Analog Designs Key Features Dual high-speed operational amplifier in a single package Low input offset voltage for precision analog applications Low input bias current for high-impedance signal sources Wide supply voltage range for flexible design Fast slew rate and high gain bandwidth for accurate signal processing Compact surface-mount package for space-efficient PCB layouts Stable operation under industrial temperature ranges Suitable for instrumentation and embedded analog signal circuits Low-noise design for high-fidelity analog applications #MC34164D5R2G #ONSemiconductor #OperationalAmplifier #OpAmp #DualOpAmp #HighSpeedOpAmp #AnalogSignalProcessing #SensorInterface #DataAcquisition #ControlSystems #AudioProcessing #IndustrialElectronics #EmbeddedSystems #SOICPackage #SurfaceMount #ElectronicComponents #PCBDesign #PrecisionAmplifier #SignalConditioning

Isolated Module DC DC Converter 1 Output 5.1V 6A 9V - 36V Input The TEN 30WIN series is a family of high performance 30W DC/DC converter modules featuring ultra wide 4:1 input voltage ranges in a compact low profile case with industry-standard footprint. Standard features include remote On/Off, output voltage trimming, over voltage protection, under voltage lockout, over temperature and short circuit protection. Typical applications for these products are battery operated equipment and distributed power architectures in communication and industrial electronics, everywhere where isolated, tightly regulated voltages are required and space is limited on the PCB. • 2“ x 1“ x 0.4“ shielded metal package • Ultra wide 4:1 input voltage range • Single- dual- and triple output models • Very high efficiency up to 91 % • Operating temperature range –40 °C to +75 °C • Over temperature protection • I/O isolation 1600 VDC • Remote On/Off • Adjustable output voltage #TRACOPower #TEN302411WIN #DCDCConverter #IsolatedPowerSupply #PowerModule #IndustrialElectronics #EmbeddedSystems #TelecomPower #BatteryPoweredDevices #PowerManagement #ElectronicsDesign #PCBDesign #DCDCModule #WideInputRange #IndustrialAutomation

Headers & Wire Housings PICOFLEX 10P HDR LOPRO SN Connector Header Through Hole 10 position 0.050" (1.27mm) The 0903250010 is a 10-position vertical through-hole header connector from the Picoflex PF-50 series by Molex. It features a 1.27 mm pitch, straight orientation, and is designed for reliable board-to-cable interconnections in compact electronic equipment. The connector is commonly used with Picoflex ribbon cable assemblies in industrial, consumer, telecommunications, and embedded electronic applications. It provides a space-saving solution while maintaining dependable electrical and mechanical performance. Key Features 10 contacts (single-row configuration) 1.27 mm (0.050") contact pitch Vertical (straight) through-hole mounting Male header design Compatible with Molex Picoflex cable connectors Current rating up to 1.2 A per contact Voltage rating up to 250 V Operating temperature range: -40°C to +105°C Low contact resistance (15 mΩ max) High insulation resistance (1000 MΩ min) RoHS compliant Compact footprint for high-density PCB designs Suitable for signal and low-power applications #CommonPartsLibrary #0903250010 #Molex #Picoflex #Connector #HeaderConnector #ThroughHole #PCBConnector #BoardToCable #Interconnect #Electronics #EmbeddedSystems #IndustrialElectronics #RibbonCable #1_27mmPitch #ElectronicComponents

Low-Side Gate Driver IC Inverting TO-220-5 The TC4421AVAT is a high-speed MOSFET driver designed to efficiently drive power MOSFETs and IGBTs in switching applications. It features a low-impedance push-pull output stage capable of sourcing and sinking significant current, enabling rapid charging and discharging of gate capacitances for fast switching. The device supports both high- and low-side configurations, providing flexibility for power supply, motor control, DC-DC conversion, and class-D amplifier designs. Its robust design ensures reliable operation under high switching frequencies, minimizing losses and improving overall system efficiency. Engineering Specifications Manufacturer: Microchip Technology Part Number: TC4421AVAT Device Type: High-Speed MOSFET Driver Output Stage: Push-Pull Drive Capability: High Source and Sink Current Input Logic Compatibility: CMOS/TTL Compatible Supply Voltage Range: Wide Operating Range Propagation Delay: Low Rise/Fall Time: Fast Switching Output Voltage Swing: Rail-to-Rail Operating Frequency: High-Frequency Switching Applications Package Type: SOIC (Small Outline Integrated Circuit) Mounting Style: Surface Mount Thermal Performance: Designed for Efficient Heat Dissipation Protection Features: Undervoltage Lockout, Robust Against Overload Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Power MOSFET/IGBT Switching, DC-DC Converters, Motor Control, Power Supplies, Class-D Audio Amplifiers, Pulse-Width Modulation Circuits, High-Speed Switching Circuits Key Features High current output for rapid gate charging and discharging CMOS/TTL input logic compatible Fast propagation delay and rise/fall times Rail-to-rail output voltage swing Suitable for high-speed, high-efficiency switching designs Reliable operation in industrial and commercial environments Compact surface-mount package for easy PCB integration Supports both high-side and low-side MOSFET driving Robust against short-term overloads and undervoltage conditions #TC4421AVAT #MicrochipTechnology #MOSFETDriver #IGBTDriver #HighSpeedDriver #PWMDriver #SwitchingPower #DC_DCConverter #MotorControl #PowerElectronics #IndustrialElectronics #SurfaceMount #ElectronicComponents #HighCurrentDriver #FastSwitching #EmbeddedSystems #PCBDesign

Resettable PTC Fuse – 3 A polymeric positive temperature coefficient (PPTC) resettable fuse for overcurrent and short-circuit protection in power supplies, automotive electronics, USB power lines, battery-powered devices, industrial equipment, and embedded systems. Features a 15 V maximum operating voltage, 3 A hold current, 5.2 A trip current, and 100 A maximum fault current. Provides 10 mΩ minimum initial resistance, 48 mΩ maximum post-trip resistance, and a 20 s maximum trip time under specified fault conditions. Designed in a 2920 (7351 Metric) surface-mount package, qualified to AEC-Q200, cURus, and TÜV standards, and specified for operation over a −40°C to +85°C temperature range. #BelFuse #0ZCF0300AF2C #ResettableFuse #PTCFuse #PPTCFuse #PolymericPTC #OvercurrentProtection #CircuitProtection #3A #2920 #AECQ200 #SurfaceMount #EmbeddedSystems

8 Position FFC, FPC Connector Contacts, Bottom 0.039" (1.00mm) Surface Mount, Right Angle The Molex Easy-On connector is a compact surface-mount FPC/FFC interconnect solution designed for reliable board-to-cable connections in space-constrained electronic systems. Featuring a bottom-contact configuration with a flip-lock actuator, it provides secure retention of flexible printed circuits while supporting repeated insertion and removal cycles. Its low-profile construction and robust locking mechanism make it suitable for consumer electronics, industrial controls, embedded systems, displays, and portable devices where dependable signal transmission and compact form factors are required. Engineering Specifications Manufacturer: Molex Series: Easy-On FD19 Part Number: 2005280080 Connector Type: FFC/FPC Connector Contact Configuration: Bottom Contact Actuator Type: Flip-Lock ZIF Mounting Style: Surface Mount Orientation: Right Angle Circuit Count: Eight Positions Pitch: One Millimeter Cable Type: Flexible Flat Cable / Flexible Printed Circuit Contact Material: Copper Alloy Contact Finish: Gold over Nickel Housing Material: High-Temperature Thermoplastic Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Halogen Free: Yes Application Areas: LCD Interfaces, Touch Panels, Embedded Electronics, Industrial Equipment, Portable Devices, Consumer Electronics #Molex #EasyOn #FD19 #FFCConnector #FPCConnector #FlipLock #BottomContact #ZIFConnector #SMTConnector #ElectronicComponents #Interconnect #PCBDesign #EmbeddedSystems #DisplayInterface #IndustrialElectronics

Isolated Module DC DC Converter 1 Output 12V 2.5A 9V - 36V Input The TEN 30WIN series is a family of high performance 30W DC/DC converter modules featuring ultra wide 4:1 input voltage ranges in a compact low profile case with industry-standard footprint. Standard features include remote On/Off, output voltage trimming, over voltage protection, under voltage lockout, over temperature and short circuit protection. Typical applications for these products are battery operated equipment and distributed power architectures in communication and industrial electronics, everywhere where isolated, tightly regulated voltages are required and space is limited on the PCB. • 2“ x 1“ x 0.4“ shielded metal package • Ultra wide 4:1 input voltage range • Single- dual- and triple output models • Very high efficiency up to 91 % • Operating temperature range –40 °C to +75 °C • Over temperature protection • I/O isolation 1600 VDC • Remote On/Off • Adjustable output voltage #TRACOPower #TEN302412WIN #DCDCConverter #IsolatedPowerSupply #PowerModule #IndustrialElectronics #EmbeddedSystems #TelecomPower #BatteryPoweredDevices #PowerManagement #ElectronicsDesign #PCBDesign #DCDCModule #WideInputRange #IndustrialAutomation

Headers & Wire Housings HEADER 2POS 2.5MM Connector Header Through Hole, Right Angle 2 position 0.098" (2.50mm) IL-2P-S3FP2-1 is a 2-position, 2.50 mm pitch right-angle through-hole header connector from the IL Series by JAE Electronics. It is designed for board-to-wire connections in compact electronic equipment and features a friction-lock mechanism to ensure reliable cable retention. The connector uses gold-plated brass contacts for enhanced conductivity and corrosion resistance, making it suitable for industrial, consumer, and embedded electronic applications. Key Features 2-position male header connector 2.50 mm pitch Right-angle through-hole mounting Board-to-wire connection style Friction-lock mating system for secure connection Gold-plated brass contacts for reliable electrical performance Shrouded design with one protective wall Polyamide (PA66/Nylon 6/6) housing UL94 V-0 flame-retardant material Compact single-row configuration Operating temperature range: -40°C to +85°C RoHS compliant and lead-free version available Suitable for power and signal connections in electronic equipment #CommonPartsLibrary #JAE #Connector #HeaderConnector #WireToBoard #ThroughHole #RightAngleConnector #ILSeries #2p50mmPitch #FrictionLock #ElectronicComponents #EmbeddedSystems #PCBDesign #HardwareDesign #RoHSCompliant

Recom REM30-W 30W Isolated DC-DC Converter Through Hole, Voltage in 9 36 V dc, Voltage out 5V dc Medical Isolated Module DC DC Converter 1 Output 5V 6A 9V - 36V Input REM30-2405SW is a 30W isolated DC-DC converter from RECOM's REM30-W medical-grade series. It converts a 9V to 36V DC input into a regulated 5V DC output with up to 6A of output current. Designed for medical, industrial, and embedded applications, it features 5kVAC reinforced isolation, high efficiency, and comprehensive protection functions, making it suitable for powering sensitive electronic systems in demanding environments. Key Features 30W isolated DC-DC converter Wide 9V to 36V DC (4:1) input voltage range Regulated 5V DC output at up to 6A 5kVAC reinforced isolation for enhanced safety High efficiency of up to 88% Medical-grade design with low leakage current Built-in overcurrent (OCP), overvoltage (OVP), overtemperature (OTP), short-circuit (SCP), and undervoltage lockout (UVLO) protection Through-hole 2" × 1" DIP module package Wide operating temperature range of -40°C to +105°C (with derating) Suitable for medical equipment, industrial automation, instrumentation, telecommunications, and embedded power systems. #REM30_2405SW #RECOM #DCDCConverter #IsolatedPowerModule #MedicalPower #PowerSupply #IndustrialElectronics #EmbeddedSystems #ThroughHole #Electronics

Battery Power Management IC Lithium Ion/Polymer 24-QFN (4x4) nPM1100 is an integrated Power Management IC (PMIC) with a linear-mode lithium-ion/lithium-polymer battery charger in a compact 2.1x2.1 mm WLCSP package. It has a highly efficient, dual-mode configurable output DC/DC buck regulator. nPM1100 is an extremely compact PMIC device, created for space constrained applications with a small lithium-ion or lithium-polymer battery. It is compatible with all nRF52 and nRF53 Series SoCs and supports charging batteries at up to 500 mA through USB, and also delivers up to 150 mA of current to power external components with regulated voltage. A minimum of five passive components are required for operation and the device functions without a control interface. It is the perfect companion for nRF52 and nRF53 multiprotocol SoCs in battery powered designs. Low quiescent current (IQ) extends battery life during shipping and storage with Ship mode, or in operation using auto-controlled hysteretic buck mode for high efficiency down to 1 µA loads. Charge and error indication LED drivers are built in. Charge profile limits are configurable and VBUS current limits can be fixed or auto-controlled with on-chip USB port detection. • 400 mA linear battery charger • Linear charger for lithium-ion/lithium-polymer batteries • Adjustable charge current from 20 mA to 400 mA • Selectable termination voltage of 4.1 V or 4.2 V • Automatic trickle, constant current, and constant voltage charging • Battery thermal protection • Discharge current limitation • JEITA compliant • Li-ion/Li-polymer USB battery charger with a high efficiency buck regulator • 800 nA - Typical quiescent current • 460 nA - Shipping mode quiescent current • Thermal protection • Input regulator • USB compatible current limit of 100 mA and 500 mA • 4.1 V to 6.7 V input voltage range for normal operation • 20 V overvoltage protection • Reverse current protection • 3.0 V to 5.5 V system voltage output • USB port detection supporting the following types: • SDP • CDP/DCP • 1.8 V to 3.0 V, 150 mA step-down buck regulator • Step-down buck regulator with up to 92% efficiency • Automatic transition between hysteretic and pulse width modulation (PWM) modes • Forced PWM mode for clean power operation • Pin-selectable output voltage (1.8 V, 2.1 V, 2.7 V, 3.0 V) • Soft start-up • LED drivers for charger state indication • 5 mA low side LED driver for charging indication • 5 mA low side LED driver for error indication • 2.3 V to 4.35 V battery operating input range • 2.1x2.1 mm WLCSP package • Suitable for two layer PCB design #CommonPartsLibrary #IntegratedCircuit #NordicSemiconductor #nPM1100 #PMIC #BatteryCharger #PowerManagement #LiIon #LiPolymer #BuckConverter #Wearables #IoT #WirelessSensor #LowPowerDesign #USBCharging #EmbeddedSystems #nRF52 #nRF53 #PortableElectronics

16 Position Header Spacer Connector 0.079" (2.00mm) Gold Through Hole TW-08-02-L-D-185-100 is a 16-position, dual-row board-to-board stacking header from the Samtec TW series. Designed for elevated board stacking applications, it features a 2.00 mm pitch, a 0.185" (4.70 mm) stack height, and gold-plated contacts for reliable electrical performance. The connector uses a through-hole mounting style with solder termination and is suitable for embedded systems, industrial controls, communications equipment, and other high-density PCB interconnect applications. Its flexible stacking architecture allows designers to achieve custom board spacing while maintaining mechanical stability and signal integrity. Key Features 16-position (2 × 8) dual-row board stacking header 2.00 mm (0.079") contact pitch 0.185" (4.70 mm) board stack height Through-hole mounting with solder termination Gold-plated contacts for enhanced durability and conductivity Black insulating housing Flexible board-to-board stacking design Suitable for elevated PCB stacking applications High-speed performance capability up to 8 Gbps within the TW family Reliable mechanical and electrical connection for embedded and industrial systems #Samtec #BoardToBoardConnector #StackingHeader #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #ElectronicsDesign #ThroughHoleConnector #TWSeries

Pin Receptacle Connector 0.037" ~ 0.043" (0.94mm ~ 1.09mm) No Tail Surface Mount The 6628-0-18-15-18-27-10-0 is a surface-mount receptacle connector manufactured by Mill-Max Manufacturing Corp.. This component is designed to provide a reliable board-level interconnect solution for applications requiring compact, high-density signal routing. The connector utilizes precision-machined contacts to ensure excellent electrical performance, mechanical durability, and long-term mating reliability. The device features a low-profile surface-mount configuration optimized for automated assembly processes and space-constrained electronic designs. Its rugged construction supports repeated insertion and removal cycles while maintaining consistent contact integrity. The connector is suitable for embedded systems, communication equipment, industrial electronics, instrumentation, prototyping platforms, and custom board-to-board interface applications. The receptacle incorporates high-quality conductive materials and plated contact surfaces to minimize contact resistance and enhance corrosion resistance. The SMT mounting style enables efficient PCB integration while supporting robust mechanical attachment during operation and handling. General Description The 6628-0-18-15-18-27-10-0 is a precision-machined surface-mount receptacle connector intended for high-reliability electronic interconnections. It offers dependable electrical contact, compact footprint characteristics, and excellent mechanical stability for demanding applications. The connector is commonly used where reliable signal transmission, ease of assembly, and long service life are essential design requirements. Its precision socket architecture makes it suitable for mating with compatible pin headers and custom interconnect systems while supporting modern automated manufacturing environments. #MillMax #Connector #Receptacle #SMTConnector #BoardToBoard #ElectronicInterconnect #SurfaceMount #PrecisionMachined #EmbeddedSystems #IndustrialElectronics #PCBDesign #HardwareEngineering #ElectronicComponents

Single-Channel ESD Protection TVS Diode – Bidirectional transient voltage suppressor (TVS) diode for ESD protection of USB, GPIO, data lines, and other low-voltage high-speed interfaces. Features a 5.5 V reverse standoff voltage (VRWM), 6 V minimum breakdown voltage, 14 V maximum clamping voltage at 1 A, and ±30 kV IEC 61000-4-2 contact and air-gap ESD protection. Provides 6 A (8/20 µs) surge current capability, 12 pF typical capacitance, 100 nA maximum leakage current, and 0.4 Ω typical dynamic resistance. Operates over a −40°C to +125°C temperature range and is housed in a 2-pin SOT-523 (DYA) package. #TexasInstruments #TPD1E10B06DYAR #TPD1E10B06 #TVSDiode #ESDProtection #TransientVoltageSuppressor #CircuitProtection #USBProtection #GPIOProtection #SurgeProtection #SOT523 #EmbeddedSystems

Standard (General Purpose) Amplifier 2 Circuit Rail-to-Rail 8-SOIC The MCP6042-I/SN specification defines the engineering requirements for a low-power dual operational amplifier designed for precision analog signal conditioning applications. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure stable and accurate analog performance across a wide range of embedded, industrial, and consumer electronic systems. The device is intended for use in applications requiring low offset voltage, low input bias current, and stable operation under low supply conditions. It is suitable for signal buffering, sensor signal conditioning, filtering, and general-purpose analog amplification in battery-powered and low-energy electronic systems. Engineering Requirements The operational amplifier shall be manufactured using advanced CMOS process technology to ensure low power consumption, high input impedance, and stable analog performance. The device shall maintain consistent operation under defined electrical, thermal, and environmental conditions without degradation of signal integrity. The amplifier architecture shall support dual independent channels with stable gain characteristics and predictable linear response across the intended operating range. Output performance shall remain stable under capacitive loading and dynamic signal conditions typical of embedded analog systems. Electrical characteristics shall ensure low noise operation, low offset behavior, and reliable signal amplification with minimal distortion. The device shall maintain functional stability during power-up, power-down, and transient operating conditions. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure robust handling during manufacturing, soldering, and system integration. Workmanship shall be free from defects such as contamination, cracks, bonding issues, or structural inconsistencies that could affect electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated measurement systems to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, electrical characterization reports, qualification data, inspection records, and revision-controlled manufacturing documentation. All records shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control Any modification to this specification shall be managed through the formal engineering change control system. All revisions shall undergo technical review, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #OperationalAmplifier #AnalogIC #MicrochipTechnology #LowPowerDesign #SignalConditioning #EmbeddedSystems #ElectronicsDesign #QualityAssurance #EngineeringDocumentation

Laminated Core 1.1VA Power Transformer 115V Primary Parallel 6.3V, Series 12.6V Secondary Parallel 180mA, Series 90mA Through Hole The F12-090-C2 specification defines the engineering requirements for an electronic connector component intended to provide reliable electrical interconnection between printed circuit boards, cable assemblies, or electronic subsystems. This specification establishes the functional, mechanical, electrical, environmental, and quality requirements necessary to ensure dependable signal transmission, secure mechanical engagement, and long-term operational reliability. The component is intended for use in embedded, industrial, communication, and electronic control systems where compact interconnect solutions and consistent electrical performance are required. The connector is designed to support repeated mating cycles while maintaining low contact resistance, stable mechanical retention, and compatibility with standard electronic assembly processes. Engineering Requirements The connector shall be manufactured using precision-formed conductive contacts and high-strength insulating materials to ensure consistent electrical conductivity, mechanical durability, and long service life. The construction shall support reliable mating and unmating operations without degradation of contact performance. Electrical characteristics shall provide low contact resistance, stable signal integrity, and reliable current-carrying capability within the specified operating conditions. The connector shall maintain electrical continuity under vibration, thermal cycling, and environmental exposure encountered during normal operation. Mechanical construction shall ensure accurate alignment of mating interfaces, secure retention, and resistance to mechanical wear resulting from repeated insertion and removal. The housing and contact system shall withstand normal handling and assembly processes without deformation or structural damage. Workmanship shall be free from defects including contamination, cracks, corrosion, plating irregularities, or mechanical deformation that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process prior to implementation. Documentation Supporting documentation shall include engineering drawings, material specifications, electrical performance data, inspection records, qualification reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable industry standards. #EngineeringSpecification #Connector #ElectronicInterconnect #SignalIntegrity #EmbeddedSystems #IndustrialElectronics #ElectricalEngineering #Manufacturing #QualityAssurance #EngineeringDocumentation

Optical Sensor Through-Beam 0.197" (5mm) PCB Mount The EE-SX4081 specification defines the engineering requirements for a slot-type photomicrosensor designed for non-contact object detection and position sensing in electronic and electromechanical systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate optical sensing, reliable switching performance, and long-term operational stability. The component is intended for use in industrial automation, office equipment, consumer electronics, and embedded control systems requiring precise detection of object presence, motion, or position. The integrated infrared emitter and phototransistor receiver provide dependable sensing through interruption of the optical path, enabling high-speed, contactless detection in compact system designs. Engineering Requirements The photomicrosensor shall be manufactured using qualified optoelectronic components and controlled production processes to ensure consistent sensing performance, mechanical integrity, and long service life. The optical assembly shall maintain accurate alignment between the emitter and receiver to provide stable detection characteristics throughout the specified operating conditions. Electrical characteristics shall provide reliable switching response, stable output behavior, and low power consumption while maintaining consistent sensitivity across the intended operating voltage and temperature ranges. The sensor shall exhibit reliable performance under normal ambient light conditions and shall maintain signal integrity during continuous operation. Mechanical construction shall ensure precise slot dimensions, secure mounting capability, and resistance to vibration, mechanical shock, and thermal cycling encountered during normal operation. The package shall be suitable for printed circuit board assembly and shall withstand standard soldering and handling processes without degradation. Workmanship shall be free from defects including contamination, optical misalignment, package damage, corrosion, or structural irregularities that could affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, optical performance data, qualification reports, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete traceability throughout the product lifecycle. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #Photomicrosensor #OpticalSensor #SlotSensor #IndustrialAutomation #EmbeddedSystems #Optoelectronics #QualityAssurance #EngineeringDocumentation #ElectronicComponents

The CH9102X is a high-speed USB-to-UART bridge IC developed by WCH (Jiangsu Qinheng Microelectronics). It enables seamless communication between a USB host and UART-based embedded systems, making it ideal for programming, debugging, firmware updates, and serial data communication. The device integrates a USB 2.0 Full-Speed interface, an internal clock, power-on reset, and firmware, eliminating the need for an external crystal oscillator. The CH9102X variant supports 3.3 V UART I/O and is widely used on development boards such as ESP32 and other MCU-based designs. Key Features USB 2.0 Full-Speed (12 Mbps) compliant device interface USB-to-UART bridge supporting baud rates from 50 bps to 4 Mbps 3.3 V UART I/O (CH9102X variant) Integrated clock oscillator (no external crystal required) Built-in power-on reset circuit Hardware full-duplex UART with independent TX/RX buffers Supports 5, 6, 7, or 8 data bits Supports None, Odd, Even, Mark, and Space parity Supports RTS/CTS hardware flow control Supports MODEM signals: RTS, CTS, DTR, DSR, DCD, and RI TNOW output for automatic RS-485 transmit/receive control Compatible with built-in CDC drivers and vendor VCP drivers on major operating systems Available in compact RoHS-compliant QFN packages #CH9102X #USBtoUART #USBBridge #UART #SerialConverter #WCH #USB20 #EmbeddedSystems #ESP32 #MCU #RS485 #FirmwareUpdate #Debugging #IoT #PCBDesign

3.5x3.7×1.9 mm, 0.25 W intelligent externally controlled surface-mount device (SMD) type LED SK6812MINIRGBW-NW-P6 is a smart, addressable RGBW LED that integrates red, green, blue, and neutral white (NW) LEDs with a built-in control IC in a compact SMD package. Each LED acts as an individually addressable pixel, allowing precise color and brightness control through a single-wire digital interface. It is commonly used in RGBW lighting effects, backlighting, gaming peripherals, custom keyboards, LED displays, wearables, and decorative lighting applications. Key Features Individually addressable RGB + Neutral White (RGBW) LED Built-in intelligent control IC and constant-current driver Single-wire serial communication interface 32-bit color data (RGBW control) Cascadable design for long LED chains Integrated signal reshaping for reliable data transmission Operating voltage: 3.5V to 5.5V Typical data transmission rate: 800 kbps 256-level grayscale PWM dimming per channel Compact 3.7 mm × 3.5 mm SMD-6 package Built-in power-on reset circuit Wide operating temperature range: -40°C to +85°C Suitable for animations, indicators, displays, and smart lighting applications. #SK6812MINIRGBW #SK6812 #RGBWLED #AddressableLED #SmartLED #NeutralWhiteLED #DigitalLED #PixelLED #LEDLighting #EmbeddedSystems #PCBDesign #IoT #Electronics #LEDDisplay #LightingControl

Surface-Mount Tactile Switch – SPST normally open (SPST-NO) tactile pushbutton switch for user input, control panels, consumer electronics, industrial equipment, IoT devices, and embedded systems. Features a top-actuated rectangular button, 50 mA at 12 VDC contact rating, 160 gf operating force, and 0.25 mm travel for precise tactile feedback. Designed with surface-mount J-lead terminals, a 6.0 × 3.5 mm footprint, and a 4.3 mm actuator height, providing reliable operation in compact PCB designs. Constructed with a liquid crystal polymer (LCP) housing, rated for 50,000 mechanical cycles, and specified for operation over a −40°C to +85°C temperature range. Part of Würth Elektronik's WS-TASV tactile switch series. #WurthElektronik #434123043816 #WSTASV #TactileSwitch #PushButton #SPST #SMTSwitch #UserInterface #ControlPanel #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics

Red 633nm LED Indication - Discrete 2.1V 2-SMD, No Lead The 599-0K10-107F is a reverse-mount surface-mount (SMD) single-color red LED manufactured by Dialight. It is designed to emit light through a cutout in the PCB, making it ideal for applications where illumination is required on the opposite side of the board while keeping the LED mounted on the component side. This compact LED provides a wide viewing angle, low power consumption, and reliable performance for status indication, backlighting, and front-panel illumination in space-constrained electronic designs. Key Features Reverse-mount SMD LED for through-PCB illumination Red emission with 632 nm dominant wavelength Typical forward voltage: 2.4 V Typical forward current: 20 mA Wide 140° viewing angle Compact package: 3.2 mm × 1.25 mm × 1.1 mm Suitable for automated SMT assembly Operating temperature range: −40°C to +85°C RoHS compliant Ideal for status indicators, keypad backlighting, front-panel indicators, and networking/telecommunications equipment. #Dialight #ReverseMountLED #SMDLED #RedLED #StatusIndicator #PCBBacklighting #FrontPanel #IndustrialElectronics #Telecommunications #EmbeddedSystems #CommonPartsLibrary #Optoelectronics #LED #SMD

The RFFC5072 is a highly integrated wideband RF frequency conversion IC that combines a fractional-N PLL synthesizer, low phase-noise VCO, and a high-linearity RF mixer in a single device. It is designed for wireless infrastructure, software-defined radio (SDR), test equipment, military communications, and broadband frequency conversion applications. The device can generate local oscillator (LO) frequencies from 85 MHz to 4.2 GHz and perform frequency conversion for RF signals up to 6 GHz while maintaining excellent phase noise and spurious performance. Features  85MHz to 4200MHz LO Frequency Range  Fractional-N Synthesizer with Very Low Spurious Levels  Typical Step Size 1.5Hz  Fully Integrated Low Phase Noise VCO and LO Buffers  Integrated Phase Noise • 0.18° rms at 1GHz • 0.50° rms at 3GHz  High Linearity RF Mixer(s)  30MHz to 6000MHz Mixer Frequency Range  Input IP3 +23dBm  Mixer Bias Adjustable for Low Power Operation  Full Duplex Mode (RFFC5071)  2.7V to 3.3V Power Supply  Low Current Consumption  3- or 4-Wire Serial Interface Applications  Wideband Radios  Distributed Antenna Systems  Diversity Receivers  Software Defined Radios  Frequency Band Shifters  Point-to-Point Radios  WiMax/LTE Infrastructure  Satellite Communications  Wideband Jammers #RFFC5072 #Qorvo #RFMixer #FrequencySynthesizer #PLL #VCO #WidebandRF #FrequencyConverter #SDR #WirelessInfrastructure #RFDesign #MicrowaveEngineering #Telecommunications #EmbeddedSystems #ElectronicsDesign #RFIC #SignalProcessing #HardwareEngineering