Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

ARM® Cortex®-M33 RA6E1 Microcontroller IC 32-Bit 200MHz 1MB (1M x 8) FLASH 64-LFQFP (10x10) ## Engineering Specification ## General Description The **R7FA6E10F2CFM#AA0** is a Renesas Electronics **RA6E1 series microcontroller** designed for embedded control, industrial electronics, IoT edge devices, automation systems, and general-purpose connected applications. It is built around an **Arm Cortex-M33 processor with TrustZone support**, providing high performance, secure execution capability, and flexible integration for modern embedded designs. ## Device Identification Manufacturer Part Number: **R7FA6E10F2CFM#AA0** Manufacturer: **Renesas Electronics** Product Family: **RA Family** Series: **RA6 Series** Group: **RA6E1 Group** Device Category: **Integrated Circuit** Device Type: **Microcontroller Unit** ## Core and Processing The device uses an **Arm Cortex-M33 core** and is intended for high-performance embedded processing. It supports secure application development through TrustZone technology and is suitable for systems requiring reliable control, fast response, and efficient software execution. ## Memory Configuration The microcontroller includes program flash memory, data flash memory, and SRAM resources suitable for embedded firmware, application code, configuration storage, and runtime processing requirements. ## Package and Mechanical Description The component is supplied in an **LQFP surface-mount package**, making it suitable for compact printed circuit board layouts and standard automated assembly processes. ## Electrical and Operating Description The device is designed for low-voltage embedded systems and supports operation across an industrial temperature range. It is suitable for products requiring stable performance in controlled, commercial, or industrial operating environments. ## Communication and Interface Support The device supports common embedded communication interfaces such as USB, UART, SPI, I²C, QSPI, and CAN, allowing integration with sensors, displays, external memory, communication modules, and other peripheral devices. ## Analog and Control Features The microcontroller includes analog conversion capability, timer functions, PWM support, watchdog protection, reset monitoring, and low-voltage detection features. These functions make it suitable for control systems, monitoring equipment, and mixed-signal embedded applications. ## Security and Debug Features The device supports embedded security functions including TrustZone, unique device identification, and true random number generation. Debug and development access is supported through standard JTAG and SWD interfaces. ## Application Suitability This device is suitable for embedded controllers, IoT devices, industrial automation, metering equipment, appliance control, USB-connected products, sensor-based systems, and general electronic control applications requiring a compact and secure microcontroller solution. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #renesas #renesaselectronics #ra6e1 #ra6series #armcortexm33 #embeddedsystems #electronicscomponents #semiconductor #mcu #iotdevices #industrialautomation #pcbdesign #electronicparts #componentlibrary #engineeringparts #hardwaredesign #electronicsengineering

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345-EP is an extended performance version of the ADXL345, which is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface. The ADXL345-EP is well suited for extended temperature range industrial and aerospace equipment. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, enhanced plastic package. Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) Power consumption scales automatically with bandwidth User-selectable resolution from 10 to 13 bits 4 mg/LSB scale factor in all g ranges 32-sample FIFO minimizes host processor load Single tap, double tap, and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS SPI (3- and 4-wire) and I2C digital interfaces Flexible interrupt modes mappable to either interrupt pin Measurement ranges selectable via serial command Bandwidth selectable via serial command 10,000 g shock survival Pb free/RoHS compliant #commonpartslibrary #integratedcircuit #accelerometer

Single-Channel ESD Protection TVS Diode – Bidirectional transient voltage suppressor (TVS) diode for ESD protection of USB, GPIO, data lines, and other low-voltage high-speed interfaces. Features a 5.5 V reverse standoff voltage (VRWM), 6 V minimum breakdown voltage, 14 V maximum clamping voltage at 1 A, and ±30 kV IEC 61000-4-2 contact and air-gap ESD protection. Provides 6 A (8/20 µs) surge current capability, 12 pF typical capacitance, 100 nA maximum leakage current, and 0.4 Ω typical dynamic resistance. Operates over a −40°C to +125°C temperature range and is housed in a 2-pin SOT-523 (DYA) package. #TexasInstruments #TPD1E10B06DYAR #TPD1E10B06 #TVSDiode #ESDProtection #TransientVoltageSuppressor #CircuitProtection #USBProtection #GPIOProtection #SurgeProtection #SOT523 #EmbeddedSystems

Ultra Efficient Dual Sources Energy Manager with Ratio/Constant Voltage Regulation, Regulated Buck Output and 5 V Charger, 120 mV, 135 mA The AEM13921 is a fully integrated and compact power management circuit that extracts DC power from two harvesting sources to store energy in a rechargeable storage element and supply an application circuit. A 5 V input can also be used to charge the storage element (e.g., if it gets depleted). This compact and ultra-efficient PMIC allows for extending battery lifetime and eliminating the primary energy storage in a large range of applications. Both sources implement Maximum Power Point Tracking (MPPT) based on open-circuit voltage ratio as well as constant source voltage regulation features, allowing for harvesting the maximum power available from each source to charge the storage element. With its unique cold-start circuit, it can start operating with an input voltage as low as 275 mV (min. 1.5 µW power). The configurable protection thresholds prevent overcharging and overdischarging the storage element. No external components are required to set those thresholds. The thermal monitoring prevents charging and discharging the storage element outside a configurable temperature range. The Average Power Monitoring (APM) allows the application circuit to get an estimate of the energy harvested from each source to the battery and from the battery to the application circuit. A shipping mode is available to avoid charging and discharging the storage element during shipping or storage. A buck regulator with selectable output voltage allows an application circuit to be supplied with high efficiency. I²C communication allows users to control every setting of the AEM13921 from the application circuit MCU. Features and Benefits Dual sources inputs - Boost operation optimized for each source. - Conversion efficiency above 90 % on each source. - Harvests from 120 mV after cold start. - Simultaneous harvesting from both sources. - Up to 135 mA current extracted from the harvester. Maximum Power Point Tracking - Both sources configurable to constant voltage mode or to open-circuit voltage ratio mode. - Optimal harvesting from a multiple combinations of harvesters (PV cells, RF, vibration, pulsed sources...). Cold start from 275 mV / 1.5 µW input - Startup at ultra-low power from each harvesting source input. Configurable overdischarge & overcharge protection - Supports various types of rechargeable storage elements (LiC, Li-ion, LiPo, Li-ceramic pouch...). Regulated output for application circuit - Buck regulator conversion efficiency up to 96 %. - Selectable output voltage between 0.6 V and 3.3 V. - Output current up to 100 mA. Thermal monitoring - Storage element protection against overtemperature and under-temperature during charging and discharging, independently. Average Power Monitoring - Provides data to determine how much energy has been transferred to the storage from each source and from the 5 V charger, as well as the energy drained from the storage to supply the application circuit. System configuration by GPIO or I²C communication - All settings dynamically configurable through GPIO or I²C (Fast Mode Plus). - System data available through I²C. Shipping mode - Storage element charge and discharge disabling during shipment. External 5 V charging capability - Extra charging input for 5 V power supplies. - Configurable CC and CV modes (max. 135 mA). - Provides a fast charging alternative when no source is available for a long time. #AEM13921 #EnergyHarvesting #PowerManagementIC #PMIC #MPPT #BatteryCharging #EnergyAutonomous #IoT #WirelessSensor #IndustrialMonitoring #EmbeddedSystems #QFN #epeas #LowPowerDesign

ADC, Audio 32 b 8k ~ 192k I2S 20-WQFN (3x3) The PCM1822 is a high-performance, Burr-Brown™ audio analog-to-digital converter (ADC) that supports simultaneous sampling of up to two analog channels. The device supports single-ended and differential line and microphone inputs with a 1-VRMS full-scale signal. The device integrates a phase-locked loop (PLL), a DC removal high-pass filter (HPF), and supports sample rates up to 192 kHz. The device supports time-division multiplexing (TDM) or I2S audio formats, selectable with the hardware pin level. Additionally, the PCM1822 supports master and slave mode selection for the audio bus interface operation. These integrated high-performance features, along with the ability to be powered from a single supply of 3.3 V, make the device an excellent choice for costsensitive, space-constrained audio systems in far-field microphone recording applications. The PCM1822 is specified from –40°C to +125°C, and is offered in a 20-pin WQFN package. Features • Stereo high-performance ADC: – 2-channel analog microphones or line-in • ADC line and microphone differential and singleended input performance: – PCM1822 dynamic range: • 117-dB, dynamic range enhancer enabled • 111-dB, dynamic range enhancer disabled – THD+N: –95 dB • 1-VRMS full-scale input • ADC sample rate (fS) = 8 kHz to 192 kHz • Hardware pin control configurations • Linear-phase or low-latency filter selection • Flexible audio serial data interface: – Master or slave interface selection – 32-bits, 2-channel TDM – 32-bits, 2-channel I2S • Automatic power-down upon loss of audio clocks • Integrated high-performance audio PLL • Single-supply operation: 3.3 V • I/O-supply operation: 3.3 V or 1.8 V • Power consumption for 3.3-V AVDD supply: – 19.6 mW/channel at 16-kHz sample rate – 21.3 mW/channel at 48-kHz sample rate #CommonPartsLibrary #IntegratedCircuit #PCM1822IRTER #TexasInstruments #AudioADC #StereoADC #BurrBrown #I2S #TDM #AudioElectronics #EmbeddedAudio #SmartSpeaker #AVReceiver #HighResolutionAudio #PCBDesign #ElectronicsDesign #SignalProcessing

PSRAM (Pseudo SRAM) Memory IC 512Mbit HyperBus 166 MHz 36 ns 24-TFBGA (6x8) The IS66/67WVH64M8DALL/BLL are 512Mb Dual Die device containing two units of 256Mbit Pseudo Static Random Access Memory, organized as 64M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation, designed especially for Mobile and Automotive applications Key Features 512-Mbit (64M × 8) HyperRAM™ PSRAM High-speed HyperBus interface Clock frequency up to 166 MHz Fast 36 ns access time Single-ended clock architecture with reduced pin count Operating voltage range: 2.7 V to 3.6 V Industrial temperature range: −40°C to +85°C Low-power volatile memory solution Surface-mount 24-TFBGA (6 mm × 8 mm) package Suitable for graphics, AI edge devices, networking, and embedded systems requiring large external memory capacity. #CommonPartsLibrary #IntegratedCircuit #HyperRAM #PSRAM #ISSI #MemoryIC #HyperBus #EmbeddedSystems #IndustrialElectronics #IoT #HighSpeedMemory #BGA #VolatileMemory #EdgeComputing #HMI #ElectronicsDesign

Isolation and Data Interface (Encapsulated) Pulse Transformer 1CT:1CT Surface Mount #commonpartslibrary #transformer

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-PICOSTAR (0.76x0.76) The TMP114NCIYMTR is a high-accuracy digital temperature sensor designed for precision thermal monitoring applications in industrial, automotive, medical, and embedded electronic systems. The device integrates a precision band-gap temperature sensing element, analog-to-digital conversion circuitry, EEPROM memory, and a digital communication interface within a compact low-power package. The sensor supports accurate local temperature measurements with factory calibration and programmable alert functionality, enabling reliable thermal protection and environmental monitoring in space-constrained designs. Engineering Specification Manufacturer: Texas Instruments Manufacturer Part Number: TMP114NCIYMTR Device Type: Digital Temperature Sensor Temperature Measurement Method: Local Semiconductor Temperature Sensing Interface Type: I²C-Compatible Serial Interface Supply Voltage Range: Ultra-Low Voltage Operation Compatible with Battery-Powered Systems Temperature Measurement Range: Industrial Temperature Range Support Accuracy: High-Precision Factory-Calibrated Temperature Measurement Resolution: High-Resolution Digital Temperature Output Conversion Architecture: Integrated Sigma-Delta Analog-to-Digital Conversion Programmable Features: High and low temperature alert thresholds EEPROM-stored configuration settings Programmable conversion rate Offset correction calibration Alert and interrupt functionality Power Consumption: Optimized for Low-Power Embedded Applications Communication Speed: Standard and Fast-Mode I²C Support Package Type: Small Outline Leadless Package Mounting Type: Surface Mount Technology Operating Environment: Suitable for Industrial and Embedded Control Systems Protection Features: Integrated thermal monitoring alerts Nonvolatile configuration retention Robust digital communication interface Applications: Industrial temperature monitoring Medical instrumentation Battery-powered electronics Thermal management systems Precision embedded sensing Data acquisition equipment Environmental monitoring devices #commonpartslibrary #integratedcircuit #temperaturesensor #digital

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

Isolation and Data Interface (Encapsulated) Pulse Transformer 1CT:1CT Transmitter, 1CT:1CT Receiver Surface Mount #commonpartslibrary #transformer

Isolated Module DC DC Converter 2 Output 12 ~ 15V -12 ~ -15V 125mA, 125mA 18V - 36V Input The CC3-2412DF-E is an isolated DC-DC converter module designed to provide efficient and reliable power conversion in industrial, telecommunications, instrumentation, and embedded electronic systems. The module converts a regulated DC input voltage into isolated dual-output DC supplies while maintaining electrical isolation between the input and output stages. Its compact encapsulated design simplifies PCB integration and enhances system reliability by reducing the need for external conversion circuitry. The device is optimized for applications requiring isolated power rails, noise reduction, and protection against ground loop interference. Engineering Specifications Manufacturer: TDK-Lambda Part Number: CC3-2412DF-E Device Type: Isolated DC-DC Converter Module Conversion Topology: Isolated Power Conversion Input Voltage: Nominal DC Input Operation Output Configuration: Dual Output Output Regulation: Regulated DC Output Isolation Type: Galvanic Isolation Efficiency: High-Efficiency Power Conversion Protection Features: Short Circuit Protection and Overload Tolerance Package Type: Encapsulated Through-Hole Module Mounting Style: Through-Hole Operating Temperature Range: Industrial Grade Reliability: Designed for Continuous Operation RoHS Compliant: Yes Applications: Industrial Automation, Telecommunications Equipment, Embedded Systems, Instrumentation, Data Acquisition Systems, Process Control Equipment, Power Distribution Circuits, Isolated Interface Designs Key Features Isolated input-to-output power conversion Dual regulated output architecture Compact PCB-mount package High efficiency operation Reduced electrical noise and ground loop interference Reliable performance in industrial environments Simplified power supply design integration Robust protection against abnormal operating conditions Suitable for mixed-signal and sensitive analog systems Long operational lifespan and stable output characteristics #CC32412DFE #TDKLambda #DCDCConverter #IsolatedPowerSupply #PowerModule #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerConversion #GalvanicIsolation #Telecommunications #Instrumentation #AutomationSystems #PCBDesign #ElectronicComponents #DualOutput #PowerManagement #IndustrialAutomation #ElectricalEngineering #PowerSupplyDesign

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) LVDS Digital Isolator 5700Vrms 4 Channel 2.5Gbps 40kV/µs CMTI 28-BSSOP (0.295", 7.50mm Width) The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates Analog Devices, Inc., iCoupler® technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 kVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation). FEATURES ► 5.7 kV rms and 1.5 kV rms LVDS isolators ► Complies with TIA/EIA-644-A LVDS signal levels ► Quad-channel configuration ► Any data rate up to 2.5 Gbps switching with low jitter ► 10 Gbps total bandwidth across four channels ► 2.15 ns typical propagation delay ► Typical jitter: 0.82 ps rms random, 40 ps total peak ► Lower power 1.8 V supplies ► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier ► High common-mode transient immunity: 100 kV/μs typical ► Safety and regulatory approvals (28-lead SOIC_W_FP package) ► UL (pending): 5700 V rms for 1 minute per UL 1577 ► CSA Component Acceptance Notice 5A (pending) ► VDE certificate of conformity (pending) ► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 ► VIORM = 849 VPEAK (working voltage) ► Enable or disable refresh (low speed output correctness check) ► Operating temperature range: −40°C to +125°C ► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance APPLICATIONS ► Isolated video and imaging data ► Analog front-end isolation ► Data plane isolation ► Isolated high speed clock and data links ► Multi-gigabit serialization/deserialization (SERDES) ► Board-to-board optical replacement (for example, short reach fiber) #CommonPartsLibrary #ADN4624BRNZ #DigitalIsolator #LVDS #AnalogDevices #HighSpeedInterface #GalvanicIsolation #LVDSIsolator #DigitalIsolation #IndustrialElectronics #HighSpeedData #SERDES #SignalIntegrity #EmbeddedSystems #ElectronicsDesign #InterfaceICs

+/-24V PGA I/P 24-BIT 256KSPS DA The ADAQ7767-1BBCZ is a high-performance, precision data acquisition (DAQ) µModule® system from Analog Devices. It integrates a 24-bit sigma-delta analog-to-digital converter (ADC), signal conditioning, and essential analog front-end components into a compact package. Designed for high accuracy and ease of use, it significantly reduces design complexity, layout effort, and noise sensitivity in precision measurement systems. This device is optimized for applications requiring high resolution, low noise, and excellent DC performance, such as industrial automation, instrumentation, and test equipment. Key Features 24-bit resolution sigma-delta ADC Integrated analog front end (AFE) Low noise, high dynamic range performance Programmable gain amplifier (PGA) Wide input bandwidth Low drift and high linearity SPI-compatible serial interface Internal reference and buffer options Compact system-in-package (SiP) design Electrical Characteristics Resolution: 24 bits Sampling Rate: Up to 256 kSPS (depending on configuration) Input Type: Differential Input Voltage Range: ±VREF (dependent on configuration) Signal-to-Noise Ratio (SNR): ~108 dB (typical) Total Harmonic Distortion (THD): Low distortion performance Reference Voltage: Internal or external supported Power Requirements Analog Supply Voltage (AVDD): 4.5 V to 5.5 V (typical) Digital Supply Voltage (DVDD): 1.8 V to 3.3 V Power Consumption: Optimized for precision applications Interface Communication: SPI-compatible serial interface Data Output: Serial digital output Control: Register-based configuration Package Information Package Type: µModule® (BGA) Package Code: BBCZ Mounting Type: Surface mount Compact footprint for space-constrained designs Operating Conditions Operating Temperature Range: -40°C to +85°C (industrial grade) Storage Temperature Range: -65°C to +150°C Applications Industrial process control Data acquisition systems Precision instrumentation Test and measurement equipment Medical instrumentation Energy monitoring systems Advantages Reduces PCB design complexity Minimizes noise and parasitic effects Factory-optimized signal chain performance Faster time-to-market

1/1 Transceiver Half RS422, RS485 8-SOIC RS-485 Transceiver – Low-power differential transceiver designed for RS-485 and RS-422 communication applications. Operates from a 3.3V supply, supports data rates up to 10 Mbps, and provides ±15kV ESD protection. Features one driver and one receiver with half-duplex operation in a 3.3V SOIC-8 package. #RS485Transceiver #DifferentialTransceiver #CommunicationIC #MaxLinear #SP3485EN-LTR

Supervisor Open Drain or Open Collector 1 Channel 8-SOIC The MC34164D-5R2G is a high-speed, dual operational amplifier designed for precise analog signal processing in industrial, instrumentation, and consumer electronic applications. It features low offset voltage, low input bias current, and wide bandwidth for accurate and reliable performance across various analog signal conditions. Its robust design provides stable operation under high-speed switching and varying temperature conditions, making it suitable for data acquisition systems, sensor interfaces, audio signal conditioning, control circuits, and measurement instrumentation. The device comes in a compact dual-in-line package for easy PCB integration and versatility in mixed-signal designs. Engineering Specifications Manufacturer: ON Semiconductor Part Number: MC34164D-5R2G Device Type: Dual Operational Amplifier Amplifier Configuration: Dual Op-Amp Input Offset Voltage: Low for Precision Applications Input Bias Current: Low Supply Voltage Range: Wide Operating Range Gain Bandwidth Product: High for Fast Signal Processing Slew Rate: Optimized for High-Speed Applications Output Type: Rail-to-Rail Compatible Noise Performance: Low Noise Analog Operation Package Type: Small Outline Integrated Circuit (SOIC) Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Sensor Signal Conditioning, Data Acquisition, Control Systems, Audio Processing, Industrial Instrumentation, Embedded Analog Circuits, Measurement and Monitoring Equipment, General-Purpose Analog Designs Key Features Dual high-speed operational amplifier in a single package Low input offset voltage for precision analog applications Low input bias current for high-impedance signal sources Wide supply voltage range for flexible design Fast slew rate and high gain bandwidth for accurate signal processing Compact surface-mount package for space-efficient PCB layouts Stable operation under industrial temperature ranges Suitable for instrumentation and embedded analog signal circuits Low-noise design for high-fidelity analog applications #MC34164D5R2G #ONSemiconductor #OperationalAmplifier #OpAmp #DualOpAmp #HighSpeedOpAmp #AnalogSignalProcessing #SensorInterface #DataAcquisition #ControlSystems #AudioProcessing #IndustrialElectronics #EmbeddedSystems #SOICPackage #SurfaceMount #ElectronicComponents #PCBDesign #PrecisionAmplifier #SignalConditioning

Charger IC Multi-Chemistry 32-QFN (4x4) The BQ25730RSNR is a highly integrated synchronous buck battery charger and system power management IC developed by Texas Instruments for applications requiring efficient charging of multi-cell lithium-ion and lithium-polymer batteries. The device is optimized for USB Type-C, USB Power Delivery, industrial, and portable embedded systems where high charging efficiency, flexible power management, and compact implementation are required. The charger integrates high-side and low-side MOSFET gate drivers along with advanced power path management features, enabling efficient battery charging while simultaneously powering the system load. The architecture supports NVDC power path operation, allowing stable system voltage regulation even when the battery is deeply discharged or absent. The device supports a wide operating input voltage range and programmable charging parameters suitable for various battery chemistries and capacities. Integrated input current optimization and dynamic power management help maximize available adapter power while preventing overload conditions. The BQ25730RSNR communicates with the host processor through an I²C interface, enabling software configuration, telemetry monitoring, and fault management. Internal ADC functionality provides real-time monitoring of charging voltage, current, temperature, and system operating conditions. Its high integration level reduces external component count and PCB area, making it suitable for compact industrial and portable power applications. Electrical Characteristics Wide input voltage operating range compatible with USB PD adapters and industrial power sources. Supports multi-cell lithium-ion and lithium-polymer battery charging configurations. High-efficiency synchronous buck charging architecture. Programmable charge current and charge voltage through digital control interface. Integrated ADC for system telemetry and power monitoring. Dynamic power management optimizes adapter utilization and system stability. Low standby current operation for battery-powered systems. Charging Features Constant current and constant voltage charging modes. Programmable input current limiting for USB and adapter compliance. Battery preconditioning and charge termination functionality. Support for fast charging operation with thermal regulation. Power path management enables simultaneous battery charging and system operation. Automatic recharge and battery maintenance functionality. Protection Features Input overvoltage protection. Battery overvoltage and overcurrent protection. Thermal regulation and thermal shutdown protection. Short-circuit and fault condition protection. Battery temperature monitoring support using external NTC thermistors. Reverse current protection and adapter isolation. Interface and Control I²C serial communication interface for configuration and monitoring. Programmable charging profiles and operating parameters. Interrupt and status reporting capabilities. Integrated telemetry reporting for voltage, current, and temperature measurements. Autonomous operation capability with minimal host intervention. Package Information Package type is WQFN. Compact thermally enhanced surface-mount package. Optimized for automated PCB assembly and high-density layouts. Applications USB Type-C and USB Power Delivery systems. Industrial portable electronics. Embedded computing platforms. Portable medical and instrumentation equipment. Battery-powered industrial controllers. Handheld terminals and data acquisition systems. Portable consumer and commercial electronics. #commonpartslibrary #integratedcircuit #powermanagement #batterycharger

16 Bit Analog to Digital Converter 2 Input 2 Pipelined 64-QFN (9x9) #CommonPartsLibrary #IntegratedCircuit #ADC #Data Acquisition #LTC2185

HC-05 module is an easy to use Bluetooth SPP (Serial Port Protocol) module, designed for transparent wireless serial connection setup. Serial port Bluetooth module is fully qualified Bluetooth V2.0+EDR (Enhanced Data Rate) 3Mbps Modulation with complete 2.4GHz radio transceiver and baseband. It uses CSR Bluecore 04-External single chip Bluetooth system with CMOS technology and with AFH(Adaptive Frequency Hopping Feature). It has the footprint as small as 12.7mmx27mm. Hope it will simplify your overall design/development cycle #Module #Bluetooth #SPP