Power Supply Controller Digital Power Monitor 10-VSSOP The INA228AIDGSR is a high-precision digital power monitor and current-sense amplifier designed for accurate measurement of shunt voltage, bus voltage, current, power, energy, and charge in DC power systems. The device integrates a low-offset differential amplifier with high-resolution analog-to-digital converters and supports bidirectional current sensing across a wide common-mode voltage range. Communication is provided through an I²C- and SMBus-compatible digital interface, enabling direct telemetry integration into embedded control and battery management systems. The device is optimized for high-accuracy power monitoring applications requiring low drift, low offset, and high dynamic range. Integrated mathematical computation functions reduce host processor overhead by internally calculating current, power, accumulated energy, and charge values. Programmable conversion timing and averaging modes allow optimization between measurement speed and noise performance. The INA228AIDGSR is suitable for server power distribution, industrial automation, telecom infrastructure, automotive subsystems, battery-powered equipment, and precision instrumentation requiring real-time power analytics and fault monitoring. Engineering Specification Device Type Digital power monitor with integrated current-sense amplifier and high-resolution ADC. Measurement Functions Supports measurement of: Differential shunt voltage Bus voltage Current Power Energy accumulation Charge accumulation Temperature through external sensing methods Current Sensing Supports bidirectional current measurements using an external shunt resistor with programmable calibration scaling. ADC Architecture Incorporates high-resolution delta-sigma analog-to-digital converters with programmable conversion time and averaging configuration. Interface Uses I²C- and SMBus-compatible serial communication interface with programmable device addressing. Voltage Monitoring Supports high-side and low-side sensing across a wide common-mode input voltage range suitable for multi-rail power systems. Accuracy Features Includes: Low input offset voltage Low offset drift Precision gain architecture High measurement linearity Integrated calibration engine Power Computation Internally computes: Instantaneous power Average power Energy accumulation over time Charge accumulation over time Alert and Protection Features Provides programmable alert functionality for: Overcurrent Undervoltage Overvoltage Power threshold violations Conversion-ready indication Operating Modes Supports: Continuous conversion mode Triggered conversion mode Low-power shutdown mode Package Information Supplied in a compact VSSOP surface-mount package suitable for automated PCB assembly and space-constrained applications. Temperature Range Designed for operation across industrial temperature environments suitable for embedded and power-management systems. Typical Applications Battery management systems Power supply monitoring Server and telecom power rails Industrial control systems DC energy metering Embedded power analytics Automotive electronics Portable instrumentation #commonpartslibrary #integratedcircuit #powermanagement #powersupplycontroller

ARM® Cortex®-M33 RT-600 Microcontroller IC 32-Bit Dual-Core 300MHz External Program Memory 176-VFBGA (9x9) The RT600 is a family of dual-core microcontrollers for embedded applications featuring an Arm Cortex-M33 CPU combined with a Cadence Xtensa HiFi4 advanced Audio Digital Signal Processor CPU. The Cortex-M33 includes two hardware coprocessors providing enhanced performance for an array of complex algorithms. The family offers a rich set of peripherals and very low power consumption. The Arm Cortex-M33 is a next generation core based on the ARMv8-M architecture that offers system enhancements, such as ARM TrustZone® security, single-cycle digital signal processing, and a tightly-coupled coprocessor interface, combined with low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M33 CPU employs a 3-stage instruction pipe and includes an internal prefetch unit that supports speculative branching. A hardware floating-point processor is integrated into the core. On the RT600, the Cortex-M33 is augmented with two hardware coprocessors providing accelerated support for additional DSP algorithms and cryptography. The Cadence Xtensa HiFi 4 Audio DSP engine is a highly optimized audio processor designed especially for efficient execution of audio and voice codecs and pre- and post-processing modules. It supports four 32x32-bit MACs, some support for 72-bit accumulators, limited ability to support eight 32x16-bit MACs, and the ability to issue two 64-bit loads per cycle. There is a floating point unit providing up to four single-precision IEEE floating point MACs per cycle. The RT600 provides up to 4.5 MB of on-chip SRAM (plus an additional 128 KB of tightly-coupled HiFi4 ram) and several high-bandwidth interfaces to access off-chip flash. The FlexSPI flash interface supports two channels and includes an 32 KB cache and an on-the-fly decryption engine. The RT600 is designed to allow the CortexM33 to operate at frequencies of up to 300 MHz and the HiFi4 DSP to operate at frequencies of up to 600 MHz. Key Features Dual-core architecture with Arm Cortex-M33 CPU and Cadence Xtensa HiFi4 DSP Cortex-M33 operating at up to 300 MHz HiFi4 DSP operating at up to 600 MHz Up to 4.5 MB on-chip SRAM 128 KB DSP tightly coupled memory (TCM) FlexSPI interface supporting Quad/Octal SPI Flash with execute-in-place (XIP) High-speed USB 2.0 Host/Device with integrated PHY Digital microphone (DMIC) interface supporting up to 8 channels Multiple I2S, SPI, I²C, UART, SDIO, and I3C interfaces 12-bit ADC with up to 1 MSPS sampling rate Hardware cryptography acceleration (AES, SHA, RSA, ECC) Arm TrustZone® security technology Secure boot and physically unclonable function (PUF) key storage Multiple low-power operating modes for battery-powered applications Up to 147 GPIOs depending on package option 176-pin VFBGA package (9 mm × 9 mm) Typical Applications Voice-controlled smart devices Audio processing and DSP systems Smart speakers and soundbars Industrial HMI and control panels Edge AI and machine learning applications IoT gateways and connected devices Wearable and portable electronics #NXP #iMXRT685 #RT600 #CortexM33 #HiFi4DSP #Microcontroller #EmbeddedSystems #EdgeAI #VoiceRecognition #AudioProcessing #IoT #IndustrialAutomation #SecureMCU #MachineLearning #MCUDesign

Accelerometer X, Y, Z Axis ±2g, 4g, 8g 6.25Hz ~ 200Hz 12-LGA (2.2x2.3) The ADXL367BCCZ-RL7 is an ultra-low power, three-axis MEMS accelerometer developed by Analog Devices for motion sensing applications requiring extremely low energy consumption and high measurement stability. The device integrates precision acceleration sensing, embedded motion detection capabilities, and intelligent power management features within a compact surface-mount package suitable for portable and battery-operated systems. The accelerometer supports both I²C and SPI digital communication interfaces, enabling flexible integration with embedded processors, microcontrollers, and sensor hubs. Its architecture is optimized for continuous motion monitoring while maintaining exceptionally low current consumption, making it ideal for wearable electronics, asset tracking devices, medical monitoring equipment, industrial sensing systems, and Internet of Things platforms. The device incorporates embedded activity, inactivity, and wake-up detection functions that allow host processors to remain in low-power states until significant motion events occur. Integrated FIFO buffering and programmable interrupt functionality reduce processor overhead and improve overall system efficiency. The ADXL367BCCZ-RL7 is designed for robust operation across a wide operating temperature range and maintains high measurement accuracy with low noise and excellent long-term stability. The compact LGA package enables dense PCB layouts for space-constrained designs. Key Features Motion Sensing Three-axis digital accelerometer Selectable acceleration measurement ranges High-resolution motion detection Low noise sensing architecture Integrated temperature sensor Power Management Ultra-low power operation optimized for battery-powered systems Multiple operating and standby modes Autonomous motion-triggered wake-up capability Efficient duty-cycling support Digital Interfaces Supports SPI communication Supports I²C communication Programmable interrupt outputs Embedded FIFO data buffering Embedded Detection Functions Activity detection Inactivity detection Motion-triggered interrupt generation Autonomous wake-up monitoring Mechanical and Environmental Compact LGA surface-mount package High shock tolerance Wide operating temperature capability Suitable for portable and industrial environments Electrical Characteristics Supply Requirements Low-voltage digital supply operation Optimized for low-current embedded systems Stable operation across supported voltage range Sensor Performance High sensitivity stability Low offset drift Low output noise density Configurable output data rates Communication and Control Supported Interfaces SPI serial interface I²C serial interface Programmability Configurable measurement ranges Adjustable output data rates Programmable interrupt mapping FIFO configuration support Package Information Package Type LGA surface-mount package Mounting PCB surface mount compatible Suitable for automated assembly processes Typical Applications Wearable electronics Health and fitness monitoring Portable instrumentation Asset and condition monitoring Industrial sensing systems IoT sensor nodes Motion-activated devices Battery-powered embedded systems #commonpartslibrary #integratedcircuit #accelerometer #sensor

1 MHz, Low-Power Op Amp SOT-23-5 #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #MCP6001

Pressure Sensor 203.05PSI (1400kPa) Absolute 24 b 8-SMD Module The MS580314BA01-00 is a high-resolution digital absolute pressure sensor module from TE Connectivity Measurement Specialties. It integrates a precision MEMS pressure sensing element, a 24-bit ΔΣ ADC, and factory-calibrated coefficients to provide highly accurate digital pressure and temperature measurements. The sensor supports both I²C and SPI communication interfaces, making it easy to interface with a wide range of microcontrollers while requiring minimal external components. It is designed for low-power, high-accuracy applications such as altimeters, depth measurement systems, weather monitoring, industrial pressure sensing, and portable instrumentation. Key Features Digital absolute pressure sensor with integrated MEMS sensing element High-resolution 24-bit ΔΣ ADC with factory calibration Supports I²C and SPI digital interfaces Pressure range up to 14 bar (1400 kPa / 203 psi) Supply voltage: 1.8 V to 3.6 V Integrated temperature measurement for compensation and monitoring Low power consumption, suitable for battery-powered devices Operating temperature range: −40°C to +85°C Excellent long-term stability with low hysteresis Compact 8-SMD module for surface-mount PCB assembly Requires few or no external components for operation #PressureSensor #MEMS #AbsolutePressure #DigitalSensor #24BitADC #I2C #SPI #LowPower #IndustrialElectronics #Altimeter #DepthMeasurement #WeatherMonitoring #TEConnectivity #SurfaceMount #EmbeddedSystems

680 kOhms ±5% 0.25W, 1/4W Through Hole Resistor Axial Automotive AEC-Q200 Carbon Film The CFR-25JB-52-680K is a carbon film through-hole resistor designed for general-purpose electronic applications requiring stable resistance characteristics, reliable long-term performance, and cost-effective implementation. This resistor is commonly used in signal conditioning, voltage division, pull-up and pull-down networks, biasing circuits, and low-power analog or digital systems. Its axial leaded construction supports automated insertion and conventional through-hole assembly methods, making it suitable for consumer electronics, industrial controls, instrumentation, and embedded systems. The device utilizes carbon film resistive technology to provide dependable electrical performance with moderate noise characteristics and good environmental stability. The flame-retardant coating enhances mechanical durability and improves resistance against moisture and environmental exposure. The component is optimized for standard operating environments where compact size, stable operation, and economical design are required. Electrical Characteristics Resistance Value: 680 kΩ Resistance Tolerance: ±5% Resistor Technology: Carbon Film Rated Power Dissipation: 1/4 W Maximum Working Voltage: 250 V Maximum Overload Voltage: 500 V Temperature Coefficient: ±350 ppm/°C Insulation Resistance: High reliability insulation structure suitable for general electronic equipment Mechanical Characteristics Package Type: Axial Through-Hole Mounting Style: Through Hole Body Style: Cylindrical Flame-Retardant Coated Body Lead Material: Tin-Plated Copper Lead Configuration: Axial Leads for PCB insertion Environmental Characteristics Operating Temperature Range: −55°C to +155°C Moisture Resistance: Suitable for standard humidity environments Flame Resistance: Flame-retardant protective coating compliant with general safety requirements Applications Signal Conditioning Circuits Voltage Divider Networks Pull-Up and Pull-Down Resistors Industrial Control Electronics Consumer Electronic Products General Analog and Digital Circuitry Embedded Systems and Microcontroller Interfaces #commonpartslibrary #passivecomponents #resistor #carbonfilm #throughhole #axialresistor #powermanagement #analog #digital #industrialelectronics

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

27.12 MHz ±10ppm Crystal 10pF 50 Ohms 4-SMD, No Lead # 7M-27.120MEEQ-T Crystal Unit Engineering Specification ## General Description The 7M-27.120MEEQ-T is a surface-mount quartz crystal resonator designed to provide a stable and accurate frequency reference for digital, wireless, communication, NFC, RFID, microcontroller, and embedded system applications. Manufactured by TXC Corporation, this crystal offers reliable frequency stability, low equivalent series resistance, and compact packaging suitable for space-constrained designs. Its surface-mount construction enables automated assembly while maintaining excellent electrical performance across a wide range of operating conditions. ## Features * Fundamental mode quartz crystal resonator * Surface-mount device package for automated PCB assembly * High frequency accuracy and stability * Low equivalent series resistance * Low power consumption * Suitable for clock generation and timing circuits * RoHS compliant construction * Reliable performance for industrial and consumer electronics applications ## Electrical Characteristics * Nominal Frequency: 27.120 MHz * Crystal Type: Fundamental Mode * Load Capacitance: 10 pF * Frequency Tolerance: ±20 ppm * Frequency Stability: ±20 ppm * Equivalent Series Resistance: 60 Ω Maximum * Drive Level: Low-power operation * Operating Temperature Range: Industrial grade * Storage Temperature Range: Extended environmental capability ## Mechanical Characteristics * Package Type: Surface-Mount Crystal * Mounting Style: SMD/SMT * Compact footprint optimized for high-density PCB layouts * Four-pad no-lead package construction ## Applications * PN532 NFC Controllers * RFID Readers and Writers * Microcontroller Clock Sources * Wireless Communication Modules * Embedded Systems * Industrial Control Electronics * Consumer Electronic Devices * IoT and Smart Device Platforms ## Compliance * RoHS Compliant * Lead-Free Construction * Suitable for Automated Assembly Processes #7M27_120MEEQT #TXC #CrystalResonator #SMDCrystal #QuartzCrystal #27_120MHz #PN532 #NFC #RFID #EmbeddedSystems #TimingReference #ElectronicsDesign

Gas, Humidity, Pressure, Temperature Sensor Digital Output The BME690 is a compact 4-in-1 environmental sensor from Bosch Sensortec designed for advanced indoor air-quality monitoring. It integrates gas, humidity, temperature, and barometric pressure sensing into a single low-power MEMS device. The sensor is optimized for battery-powered and high-condensation environments, making it suitable for smart home, industrial, wearable, and IoT applications. Key Features 4-in-1 environmental sensing: Gas sensing Relative humidity Temperature Barometric pressure Detects: Volatile Organic Compounds (VOCs) Volatile Sulfur Compounds (VSCs) Other air-quality-related gases Supports indoor air quality (IAQ) monitoring Provides: IAQ index bVOC equivalent CO₂ equivalent outputs Improved robustness for high-condensation environments Ultra-small package: 3.0 × 3.0 × 0.93 mm 8-pin metal LGA package Low power consumption suitable for battery-powered devices Interfaces: I²C up to 3.4 MHz SPI up to 10 MHz Wide operating range: Temperature: −40°C to +85°C Humidity: 0–100% RH Pressure: 300–1100 hPa Supply voltage: VDDIO: 1.2 V to 3.6 V VDD: 1.71 V to 3.6 V Humidity accuracy: ±3% RH Temperature accuracy: ±0.5°C Pressure accuracy: ±0.5 hPa absolute Supports AI-based gas classification using Bosch BME AI-Studio Pin-compatible evolution of the BME688 platform Designed for: Smart home devices HVAC systems Air-quality mapping Food freshness monitoring Wearables Industrial sensing applications #CommonPartsLibrary #Sensor

16 Bit Digital to Analog Converter 1 40-VQFN (6x6) The DAC81416RHAT is a precision, low-power, multi-channel digital-to-analog converter designed for high-accuracy industrial and instrumentation applications. It integrates sixteen independently programmable voltage-output DAC channels with internal precision reference support, output buffering, and flexible serial communication capability. The device is optimized for systems requiring deterministic analog signal generation, high linearity, low drift, and stable long-term performance. Typical applications include automated test equipment, process control, programmable logic controllers, data acquisition systems, and closed-loop control platforms. The device supports high-resolution output generation with monotonic behavior and excellent channel-to-channel matching. Integrated diagnostic and protection features improve system reliability in harsh operating environments. The architecture is intended for dense analog output designs where low power consumption, compact footprint, and precision accuracy are critical. Engineering Specification Manufacturer: Texas Instruments Device Type: Multi-Channel Precision Voltage Output Digital-to-Analog Converter Package Type: VQFN Mounting Type: Surface Mount Channel Configuration: Sixteen independent DAC output channels DAC Resolution: High-resolution precision architecture suitable for industrial control and instrumentation systems Output Type: Buffered voltage output Interface Type: SPI-compatible serial interface Reference Support: Internal reference with external reference capability Power Supply Operation: Single-supply analog and digital operation Output Characteristics: Rail-to-rail capable buffered analog outputs with low glitch energy and fast settling behavior Linearity Performance: High integral and differential linearity with monotonic output behavior across full operating range Noise Performance: Low output noise and low temperature drift for precision signal generation Update Capability: Simultaneous and asynchronous channel update support Calibration Features: Integrated gain and offset correction support Diagnostic Features: Communication integrity monitoring and fault detection capability Industrial Features: Designed for precision automation, process control, programmable instrumentation, and multi-channel analog control systems Temperature Range: Industrial operating temperature range Protection Features: Robust serial interface handling and stable output drive architecture for industrial environments Applications: Industrial automation, programmable power control, automated test equipment, data acquisition systems, instrumentation, and closed-loop analog control platforms #commonpartslibrary #integratedcircuit #analog #digital #converter

1/1 Transceiver Half RS422, RS485 8-SOIC RS-485 Transceiver – Low-power differential transceiver designed for RS-485 and RS-422 communication applications. Operates from a 3.3V supply, supports data rates up to 10 Mbps, and provides ±15kV ESD protection. Features one driver and one receiver with half-duplex operation in a 3.3V SOIC-8 package. #RS485Transceiver #DifferentialTransceiver #CommunicationIC #MaxLinear #SP3485EN-LTR

4/4 Transceiver Full MII, RMII 32-VQFN (5x5) ## Engineering Specification ## General Description The **LAN8770M-I/PRA** is a Microchip Technology single-port **100BASE-T1 Ethernet physical layer transceiver** designed for automotive, industrial, and embedded networking applications. It provides Ethernet communication over a single balanced twisted pair and is suitable for compact systems requiring reliable network connectivity, low-power operation, and standard MAC interface support. The device is commonly used in automotive electronic control units, infotainment systems, telematics modules, sensor nodes, industrial control systems, and embedded Ethernet hardware. ## Device Identification Manufacturer Part Number: **LAN8770M-I/PRA** Manufacturer: **Microchip Technology** Product Family: **LAN8770** Device Category: **Integrated Circuit** Device Type: **Ethernet PHY Transceiver** Ethernet Standard: **100BASE-T1** Interface Type: **MII and RMII** Mounting Type: **Surface Mount** Package Type: **VQFN** ## Functional Description The device functions as an Ethernet physical layer transceiver that connects a host controller or microcontroller MAC interface to a single-pair Ethernet physical medium. It handles the analog and digital PHY functions required for 100BASE-T1 communication, allowing embedded systems to transmit and receive Ethernet data over a single twisted pair cable. ## Network and Interface Description The **LAN8770M-I/PRA** supports 100 Mb/s single-pair Ethernet communication and provides MII and RMII host interface options. This allows integration with microcontrollers, processors, gateways, and network controllers that support standard Ethernet MAC interfaces. The device is intended for applications where compact Ethernet connectivity and reduced cabling complexity are required. ## Electrical Description The device is designed for low-voltage operation and supports multiple supply domains according to the manufacturer’s recommended operating conditions. Proper power sequencing, decoupling, reset handling, clocking, and reference layout should be implemented to maintain stable PHY operation and signal integrity. ## Package and Mechanical Description The component is supplied in a compact surface-mount **VQFN package**, suitable for dense printed circuit board assemblies. The package supports automated assembly and is appropriate for space-constrained automotive and industrial electronic designs. ## Control and Diagnostic Description The PHY supports management and configuration through standard control interfaces used in Ethernet designs. It provides status monitoring and configuration capability for link management, operating mode selection, and system-level diagnostics. These features allow the host controller to configure and monitor Ethernet link behavior during operation. ## Automotive and Industrial Suitability The **LAN8770M-I/PRA** is suitable for embedded systems requiring robust single-pair Ethernet communication. It is applicable to automotive networking, telematics, infotainment, advanced driver assistance systems, industrial Ethernet nodes, building automation, control modules, and other connected embedded platforms. ## Mounting and Assembly Description The component is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow Microchip’s hardware design guidance, including proper power supply decoupling, controlled impedance routing, short signal paths, grounding, and separation of sensitive analog and digital sections where applicable. ## Design Considerations The design should account for Ethernet signal integrity, single-pair cable interface requirements, common-mode noise control, EMC performance, supply filtering, oscillator or clock source requirements, reset timing, thermal performance, and package solderability. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Application Suitability The device is suitable for automotive Ethernet nodes, electronic control units, telematics modules, infotainment systems, sensor interfaces, industrial controllers, embedded gateways, connected equipment, and compact network-enabled hardware requiring 100BASE-T1 Ethernet PHY functionality. ## Hashtags #commonpartslibrary #integratedcircuit #ethernetphy #microchip #microchiptechnology #lan8770 #lan8770mipra #singlepairethernet #100baset1 #automotiveethernet #ethernettransceiver #phytransceiver #embeddednetworking #mii #rmii #vqfnpackage #smdcomponent #surfacemount #automotiveelectronics #industrialethernet #telematics #infotainment #embeddedhardware #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

3 Channel AFE 24 Bit 28-WQFN (5x5) ADS1293CISQ/NOPB is a highly integrated, low-power 3-channel ECG Analog Front-End (AFE) from Texas Instruments. It is designed for portable and battery-powered medical devices, fitness monitors, heart-rate monitoring systems, Holter monitors, and other electrocardiogram (ECG) applications. The device integrates signal acquisition, filtering, lead-off detection, right-leg drive generation, and high-resolution analog-to-digital conversion into a single IC, reducing external component count and system cost. Key Features Three high-resolution ECG acquisition channels 24-bit analog-to-digital conversion Simultaneous pace detection support Ultra-low power consumption of approximately 0.3 mW per channel Low input-referred noise of 7 µVpp (40 Hz bandwidth) Programmable sample rates up to 25.6 ksps Differential input voltage range of ±400 mV Integrated EMI-hardened input filters Flexible input routing matrix Built-in Right-Leg Drive (RLD) amplifier AC and DC lead-off detection Integrated Wilson and Goldberger terminal generation Battery voltage monitoring capability Internal oscillator and voltage reference ALARMB pin for interrupt-driven diagnostics and fault reporting Multiple power-down and standby modes for battery-powered systems SPI-compatible digital interface Operating temperature range: –20°C to +85°C 28-pin WQFN package (5 mm × 5 mm) Typical Applications Portable 1-, 3-, 5-, 6-, 7-, 8-, and 12-lead ECG systems Holter monitors Event recorders Telemedicine devices Patient vital-sign monitoring equipment Automated External Defibrillators (AEDs) Sports and fitness heart-rate monitors Wearable medical devices Hashtags #commonpartslibrary #integratedcircuit #TexasInstruments #ADS1293 #AFE #AnalogFrontEnd #ECG #Electrocardiogram #MedicalElectronics #HealthTech #WearableDevices #HeartRateMonitor #PatientMonitoring #BiomedicalEngineering #24BitADC #LowPowerDesign #SPI #SignalConditioning #PortableMedicalDevices #HolterMonitor #Telemedicine #VitalSignsMonitoring #EmbeddedSystems #MixedSignalIC #WQFN28 #BatteryPoweredDevices #MedicalInstrumentation

Ultra-Low-Power Voltage Supervisor (Reset IC) – Single-channel voltage supervisor designed for microcontrollers, processors, IoT devices, industrial control systems, automotive electronics, battery-powered equipment, and embedded systems requiring reliable power-on reset and brownout detection. The Texas Instruments TLV803EA30DBZR monitors a 3.0 V supply rail with a 3.08 V reset threshold, providing an active-low open-drain RESET output to ensure proper system initialization and recovery during undervoltage conditions. Features 250 nA typical quiescent current, 130 ms minimum reset timeout, supply voltage operation from 0.7 V to 6 V, and open-drain output for easy interfacing with multiple voltage domains. Includes power-on reset, brownout protection, and low-power operation, making it ideal for energy-efficient embedded applications. Operates over a −40°C to +125°C temperature range and is housed in a compact 3-pin SOT-23 (DBZ) package for surface-mount designs. #TexasInstruments #TLV803EA30DBZR #TLV803E #VoltageSupervisor #ResetIC #PowerOnReset #BrownoutDetection #LowPower #OpenDrain #PowerManagement #EmbeddedSystems #IndustrialElectronics

Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

DW1000 Series 3.6V 6.8 Mbps Ultra Wideband Low-Power Low-Cost Transceiver-QFN-48 #CommonPartsLibrary #IntegratedCircuit #RF #Transceiver

Connector Header Surface Mount 20 position 0.100" (2.54mm) The 3020-20-0300-00 is a shrouded rectangular male header connector manufactured by CNC Tech for board-to-cable interconnection applications. It features a dual-row, surface-mount design with a standard 2.54 mm pitch, making it suitable for signal and low-power connections in industrial, consumer, and embedded electronic systems. The connector incorporates gold-plated brass contacts for reliable electrical performance and a high-temperature nylon housing that provides excellent mechanical durability and insulation characteristics. The integrated keying slot and fully shrouded construction help ensure proper mating orientation and secure connections during assembly and operation. Key Features Dual-row male header connector Surface-mount (SMT) termination Standard 2.54 mm contact pitch 20-position configuration Shrouded four-wall housing for mating protection Integrated keying slot for polarization Gold-plated contact surfaces for improved conductivity and corrosion resistance Brass contact material for mechanical strength High-temperature PA9T nylon insulator UL94 V-0 flame-retardant housing material Operating temperature range suitable for industrial environments Board-to-cable/wire interconnection design Square contact geometry for reliable mating RoHS-compliant construction Rated for up to 3 A current per contact under specified conditions #CommonPartsLibrary #Connector #Header #MaleHeader #SMT #BoardToCable #CNCTech #Interconnect #ShroudedHeader #2p54mmPitch #Electronics #EmbeddedSystems #3020_20_0300_00

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A 8-SOIC (0.154", 3.90mm Width) # L6982N33DR ## General Description The L6982N33DR is a high-efficiency synchronous step-down switching regulator manufactured by STMicroelectronics. It is designed to provide a fixed regulated output voltage from a wide input voltage range while maintaining excellent conversion efficiency and low power dissipation. The device integrates high-side and low-side power MOSFETs, control circuitry, protection features, and compensation functions within a compact package, reducing external component count and simplifying power supply design. Its robust architecture makes it suitable for industrial automation systems, distributed power architectures, telecommunications equipment, embedded systems, consumer electronics, smart devices, and battery-powered applications requiring efficient DC-to-DC voltage conversion. ## Key Features ### Power Conversion Architecture * Synchronous buck regulator topology * Fixed output voltage regulation * Integrated power MOSFETs * High-efficiency power conversion * Optimized switching performance * Reduced external component requirements ### Electrical Characteristics * Wide input voltage operating range * Stable output voltage regulation * High conversion efficiency * Low standby power consumption * Fast transient response * Low output ripple performance ### Control Features * Current-mode control architecture * Internal compensation circuitry * Soft-start functionality * Frequency synchronization capability * Stable operation under varying load conditions ### Protection Features * Overcurrent protection * Short-circuit protection * Thermal shutdown protection * Undervoltage lockout protection * Safe startup operation * Enhanced system reliability ### Power Management * Low-power operating modes * Energy-efficient design * Suitable for battery-powered systems * Optimized thermal performance * Reduced power dissipation ### Package Characteristics * Surface-mount package * Compact footprint * Automated assembly compatible * High-density PCB design support * Industrial-grade packaging ### Material Construction * Monolithic integrated power management solution * Lead-free package materials * RoHS-compliant construction * High-reliability semiconductor technology ### Environmental Characteristics * Suitable for industrial operating environments * Long operational service life * Reliable continuous operation * Robust thermal performance ### Application Areas * Industrial Automation Equipment * Embedded Systems * Microcontroller Power Supplies * FPGA and Processor Power Rails * Telecommunications Equipment * Smart Metering Systems * Consumer Electronics * Building Automation Systems * Distributed Power Architectures * Battery-Powered Devices * IoT Products * Power Management Modules ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Management Solution ## Manufacturer STMicroelectronics ## Product Family L6982 Synchronous Step-Down Switching Regulator Series #L6982N33DR #STMicroelectronics #BuckConverter #DCtoDCConverter #SwitchingRegulator #PowerManagement #PowerSupplyDesign #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #PowerElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SMPS

ADC, Audio 32 b 7.35k ~ 768k I2C, I2S, TDM 20-WQFN (3x3) The TLV320ADC3120IRTER is a low-power, high-performance stereo audio analog-to-digital converter designed for voice, audio capture, and digital signal processing applications. The device integrates programmable microphone bias generation, low-noise input amplifiers, digital filtering, automatic gain control, and high-resolution audio conversion into a compact package. It supports a wide range of analog microphone and line-level input configurations while delivering excellent audio fidelity and power efficiency. The converter is optimized for portable electronics, smart devices, industrial audio systems, communication equipment, and embedded voice-processing applications requiring high-quality audio digitization. Engineering Specifications Manufacturer: Texas Instruments Part Number: TLV320ADC3120IRTER Device Type: Stereo Audio Analog-to-Digital Converter Audio Channels: Stereo Input Architecture Converter Type: Sigma-Delta Analog-to-Digital Converter Resolution: High-Resolution Audio Conversion Input Configuration: Differential and Single-Ended Inputs Microphone Support: Integrated Microphone Bias Generation Programmable Gain: Integrated Low-Noise Programmable Gain Amplifiers Digital Processing: Integrated Digital Filters Automatic Gain Control: Supported Audio Interface: Digital Audio Serial Interface Power Consumption: Low Power Operation Clocking Support: Flexible Audio Clock Configuration Noise Performance: Low Noise Audio Acquisition Dynamic Range: High Dynamic Range Package Type: WQFN Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Voice Capture Systems, Smart Speakers, Audio Recording Equipment, Industrial Audio Devices, Communication Systems, Embedded Audio Platforms, Human Machine Interfaces, Portable Electronics Key Features High-performance stereo audio conversion Integrated microphone bias circuitry Low-noise programmable gain amplifiers Automatic gain control functionality Flexible digital audio interface support Optimized for voice and audio capture applications Low power consumption for portable devices Integrated digital signal processing features High audio fidelity and dynamic range Compact surface-mount package for space-constrained designs #TLV320ADC3120IRTER #TexasInstruments #AudioADC #AudioConverter #StereoADC #DigitalAudio #VoiceCapture #AudioProcessing #EmbeddedAudio #MicrophoneInterface #AudioElectronics #DSP #IndustrialElectronics #SmartDevices #PortableElectronics #SignalProcessing #SurfaceMount #ElectronicComponents #PCBDesign #AudioSystemDesign

PSRAM (Pseudo SRAM) Memory IC 512Mbit HyperBus 166 MHz 36 ns 24-TFBGA (6x8) The IS66/67WVH64M8DALL/BLL are 512Mb Dual Die device containing two units of 256Mbit Pseudo Static Random Access Memory, organized as 64M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation, designed especially for Mobile and Automotive applications Key Features 512-Mbit (64M × 8) HyperRAM™ PSRAM High-speed HyperBus interface Clock frequency up to 166 MHz Fast 36 ns access time Single-ended clock architecture with reduced pin count Operating voltage range: 2.7 V to 3.6 V Industrial temperature range: −40°C to +85°C Low-power volatile memory solution Surface-mount 24-TFBGA (6 mm × 8 mm) package Suitable for graphics, AI edge devices, networking, and embedded systems requiring large external memory capacity. #CommonPartsLibrary #IntegratedCircuit #HyperRAM #PSRAM #ISSI #MemoryIC #HyperBus #EmbeddedSystems #IndustrialElectronics #IoT #HighSpeedMemory #BGA #VolatileMemory #EdgeComputing #HMI #ElectronicsDesign

137 MHz to 1020 MHz Low Power Long Range Transceiver, spreading factor from 6 to 12, LoRA, QFN-28 low-power lora transceiver QFN*1EP*6x6mm*P0.65mm*

32 Bit Analog to Digital Converter 5, 10 Input 1 Sigma-Delta 28-TSSOP The ADS1263IPW is a high-precision, low-noise analog-to-digital converter designed for demanding industrial, instrumentation, and sensor measurement applications. Manufactured by Texas Instruments, this device integrates a delta-sigma ADC architecture with programmable gain amplification, precision voltage reference support, sensor biasing functions, and extensive diagnostic capabilities. It is optimized for applications requiring extremely high resolution and accuracy when measuring low-level analog signals. The device supports direct interfacing to bridge sensors, thermocouples, RTDs, pressure sensors, strain gauges, and other precision transducers. Integrated system monitoring and fault detection features simplify implementation in safety-critical and high-reliability systems. Flexible input multiplexing and multiple data-rate options allow the converter to be used across a wide range of precision data acquisition applications. The ADS1263IPW communicates through a standard SPI-compatible serial interface and operates from low-voltage analog and digital supplies. The device is packaged in a thermally efficient TSSOP package suitable for compact embedded system designs. Electrical Characteristics The converter utilizes a delta-sigma ADC core with extremely high effective resolution and low input-referred noise performance. It supports differential and single-ended analog input configurations with programmable gain settings for low-level sensor measurements. The integrated programmable gain amplifier supports multiple gain selections for direct amplification of small analog signals. The converter includes internal offset and gain calibration functions to improve system-level measurement accuracy. The device provides low drift characteristics and high common-mode rejection performance suitable for precision industrial environments. Analog Features The converter supports multiple analog input channels through an integrated input multiplexer. Internal sensor bias current sources are available for RTD and resistive sensor excitation applications. Integrated digital filtering options allow optimization between noise performance and conversion speed. Simultaneous rejection of power-line interference frequencies is supported for industrial measurement systems. The device includes internal temperature sensing and diagnostic monitoring functions for enhanced system reliability. Digital Interface Communication is implemented through an SPI-compatible serial interface supporting flexible host controller integration. The interface supports command-based register access, data readback, and configuration management. Programmable data rates allow balancing between throughput and precision requirements. Power Requirements The device operates from separate analog and digital supply rails to improve noise isolation and measurement accuracy. Low-power operating modes are supported for energy-sensitive applications. Protection and Diagnostics Integrated fault detection and monitoring functions include sensor open-circuit detection, reference monitoring, supply monitoring, and internal self-test capability. These features improve reliability in industrial and safety-oriented systems. Package Information The ADS1263IPW is supplied in a TSSOP package with fine-pitch lead spacing suitable for high-density PCB layouts and automated assembly processes. Typical Applications Industrial process control systems Precision data acquisition equipment Temperature measurement systems Pressure and bridge sensor interfaces Weigh scale and load-cell instrumentation Laboratory and test instrumentation Medical instrumentation Energy monitoring and metering systems #commonpartslibrary #integratedcircuit #analog #digital #converter

Low-Power, Low-Noise and Low-Distortion Sound Plus™ Audio Operational Amplifiers 8-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #OPA1692

Low-power JFET dual operational amplifiers 8-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #TL062