0.35 BB CONN. H=0.6 SSB6 RP REC ASSY 5050660622 is a 6-position board-to-board (mezzanine) receptacle connector from the Molex SlimStack™ Armor 505066 Series. It is designed for compact electronic devices where a very low-profile connection between two PCBs is required. The connector features a fine 0.35 mm pitch, 0.60 mm mated height, and surface-mount termination, making it suitable for smartphones, wearables, IoT devices, cameras, and other space-constrained applications. Key Features 6 circuits (contacts) for board-to-board interconnection. 0.35 mm pitch for high-density PCB designs. Ultra-low 0.60 mm mated height to minimize product thickness. 2-row connector configuration for efficient space utilization. Surface-mount (SMT) mounting for automated assembly. Armor Nail design improves solder joint strength and mechanical retention. Gold-plated contacts for reliable electrical performance and corrosion resistance. 50 V AC/DC voltage rating. Up to 0.3 A per contact current rating. Operating temperature range: -40°C to +85°C. Liquid Crystal Polymer (LCP) housing for high heat resistance during reflow soldering. 30 mating cycle durability. Typical Applications Smartphones and tablets Wearable devices Wireless modules Portable medical devices Cameras and imaging equipment Compact consumer electronics #CommonPartsLibrary #Connector

Telecom Relay DPDT (2 Form C) Surface Mount The G6K-2F-Y DC5 specification defines the engineering requirements for a low-profile dual-pole signal relay designed for precision switching in electronic control and communication systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure reliable signal switching, low contact resistance, and long-term operational stability in compact electronic assemblies. The relay is intended for use in telecommunications equipment, instrumentation, industrial control systems, automated test equipment, and embedded electronic applications requiring high-reliability signal routing. It provides electrically isolated switching with low power consumption and stable contact performance, making it suitable for low-level signal and logic circuit applications. Engineering Requirements The relay shall be manufactured using qualified electromechanical components and controlled production processes to ensure consistent switching characteristics, mechanical durability, and long service life. The internal contact system shall provide reliable electrical continuity and repeatable switching performance throughout the specified operational life. Electrical characteristics shall ensure stable contact resistance, low coil power consumption, high insulation resistance, and reliable dielectric isolation between coil and contact circuits. The relay shall maintain dependable switching performance under specified voltage, current, temperature, and environmental operating conditions. Mechanical construction shall provide accurate contact alignment, secure enclosure integrity, and resistance to vibration, shock, and thermal cycling. The package shall be suitable for printed circuit board mounting and compatible with standard electronic assembly and soldering processes without degradation of performance. Workmanship shall be free from defects including contamination, corrosion, mechanical deformation, contact misalignment, or structural irregularities that could adversely affect electrical or mechanical reliability. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, qualification reports, inspection records, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #SignalRelay #ElectromechanicalRelay #ElectronicSwitching #IndustrialElectronics #EmbeddedSystems #Telecommunications #QualityAssurance #EngineeringDocumentation #ElectronicComponents

Adafruit Accessories SMT GPIO Header for Raspberry Pi HAT - 2x20 Short Female Header SMT female header connector, providing a low-profile 2x20 GPIO interface for Raspberry Pi HAT connection. This connector features a 40-position short SMT design with a 2.54 mm pitch, designed for mounting Raspberry Pi HAT boards onto compatible Raspberry Pi models including B+, A+, and Pi 2 platforms. #Adafruit #2187 #SMTFemaleHeader #GPIOHeader #RaspberryPiHAT #BoardToBoardConnector #40PositionConnector

50 Position Card Connector CompactFlash® - Type I, II Surface Mount, Right Angle Gold 1734451-1 is a 50-position CompactFlash (CF) card connector from TE Connectivity. It is a low-profile, right-angle, surface-mount connector designed for interfacing CompactFlash Type I and Type II memory cards with a printed circuit board (PCB). The connector features gold-plated contacts for reliable signal transmission and durability, making it suitable for embedded systems, industrial equipment, data acquisition devices, and legacy storage applications. This part is currently marked as obsolete by the manufacturer. Key Features 50-position CompactFlash card connector Supports CompactFlash Type I and Type II cards Right-angle PCB mounting orientation Surface-mount termination (SMT) 1.27 mm contact pitch Gold-plated contact mating area Brass contacts with nickel underplating Low-profile connector design Maximum contact current rating: 0.5 A per contact Thermoplastic housing, UL 94V-0 rated Designed for signal transmission applications Board-mount connector with hold-down feature Obsolete product status #TEConnectivity #CompactFlash #CFCardConnector #MemoryConnector #PCCardSocket #EmbeddedSystems #SMTConnector #RightAngleConnector #PCBDesign #ElectronicComponents #IndustrialElectronics #DataStorage #ConnectorSolution #HardwareDesign #ObsoletePart

CONN HEADER 40POS DL STR GOLD 3M 303 Series, 2.54mm Pitch 40 Way 2 Row Shrouded Straight PCB Header, Through Hole, Solder Termination 3M 303 Series low-profile board-to-board/socket header connector with 2.54 mm (0.100") pitch, available in straight and right-angle versions. Designed as a low-cost, rugged female header solution for PCB interconnection in embedded systems, development boards, industrial electronics, communication equipment and general-purpose electronic assemblies. Features brass contacts with nickel underplating and gold flash contact finish, glass-filled polyester (PBT) housing rated UL94V-0, orientation marking triangle, end windows for alignment, and compatibility with standard 0.64 mm (0.025") square pin headers. Rated for 1 A current, 500 V insulation withstand voltage, and operation from -55°C to +105°C. Search Keywords: 3M 303 Series, low profile header, female header connector, 2.54mm socket header, 0.100 inch connector, board to board connector, PCB socket connector, right angle header, straight header connector, through hole socket strip, gold flash socket header, 3M header connector, female pin header, electronic connector, embedded system connector Hashtags: #3M #303Series

The ADF6-100-03.5-L-4-2-A-TR is a high-density board-to-board mezzanine connector from the Samtec AcceleRate® HD series. It is designed for high-speed and high-performance interconnect applications requiring compact size, excellent signal integrity, and high pin density. This connector features a fine 0.635 mm pitch with a 4-row socket configuration, making it suitable for advanced embedded systems, networking equipment, data communication devices, industrial electronics, and high-speed computing platforms. Key Features High-density mezzanine connector system 0.635 mm fine pitch design 4-row socket configuration Supports high-speed data transmission up to 64 Gbps PAM4 / 32 Gbps NRZ Optimized Edge Rate® contact system for improved signal integrity Surface-mount (SMD) mounting style Gold-plated contacts for reliable electrical performance Compact low-profile design Designed for board-to-board stacking applications Compatible with multiple stacking heights Suitable for PCIe®, CXL®, networking, AI, telecom, and embedded systems applications Tape-and-reel packaging for automated assembly processes #Connector

240 Position Connector High Density Array, Male Surface Mount Gold The ADM6-60-01.5-L-4-2-A-TR is a compact board-to-board (BTB) mezzanine connector designed for high-density, low-profile interconnections between printed circuit boards (PCBs). It is commonly used in applications where space is limited but reliable multi-pin connectivity is required. Connector Type: Surface-mount, dual-row board-to-board connector Pitch: 1.5 mm Number of Positions: 60 pins Rows: 2 (30 pins per row) Mounting Style: SMT (Surface Mount Technology) Orientation: Typically vertical (mezzanine stacking) Contact Type: Female receptacle (usually mates with a corresponding male header) Compact Design: Optimized for space-constrained PCB layouts High Pin Density: 60 contacts in a small footprint Reliable Contact: Designed for stable electrical and mechanical connection Tape & Reel Packaging (TR): Suitable for automated assembly processes Stack Height: Fixed (around 4 mm, depending on variant) #CommonPartsLibrary #Connector #AcceleRate® ADM6

Bourns SRN3015 Series semi-shielded power inductor, compact 3.0mm × 3.0mm × 1.5mm SMD package, ferrite core construction, inductance range 1.0µH to 100µH, rated current up to 2.35A, saturation current up to 2.35A, low DCR design, operating temperature -40°C to +125°C, RoHS compliant and halogen-free, optimized for DC/DC converters, portable electronics, digital cameras, HDDs, smartphones, LCD displays and compact power management applications. Search Keywords: SRN3015, Bourns SRN3015, SRN3015 power inductor, semi shielded inductor, SMD power inductor, 3x3mm inductor, ferrite inductor, DC DC converter inductor, low profile inductor, SRN3015-1R0Y, SRN3015-2R2M, SRN3015-4R7M, SRN3015-100M, power choke, switching regulator inductor Hashtags: #SRN3015 #BournsSRN3015 #Bourns #PowerInductor #SemiShieldedInductor #SMDInductor #FerriteInductor #DCDCInductor #SwitchingRegulatorInductor #PowerChoke #LowProfileInductor #3x3mmInductor #PortablePower #SMPSInductor #MagneticComponent