22 Position Terminal Block Header, Male Pins, Shrouded (4 Side) 0.100" (2.54mm) 90°, Right Angle Surface Mount #CommonPartsLibrary #Connector #Interconnect #Terminal-Block #Header #Plugs and Socket #COMBICON DMC

40 Position Connector Plug, Outer Shroud Contacts Surface Mount Gold #CommonPartsLibrary #Connector #Interconnect #Rectangular-Connector #Array #Edge-Type #Mezzanine #WP7

5 Position Spring Piston Connector Through Hole #CommonPartsLibrary #Connector #Interconnect #Rectangular-Connector #Spring-Loaded #825-22

24 Position Connector Header, Center Strip Contacts Surface Mount Gold The AXT424124 is a Panasonic P4S series 0.4 mm pitch board-to-board / board-to-FPC connector, specifically a 24-position surface-mount header designed for compact, high-density electronic assemblies. It is commonly used in mobile devices and industrial equipment where space saving and reliable fine-pitch interconnection are required. This connector belongs to Panasonic’s P4S narrow-pitch interconnect family, optimized for very small pitch stacking (0.4 mm) and low-profile designs. It supports mating with a corresponding socket connector to form a mezzanine-style board connection. Key Features Ultra-fine pitch: 0.4 mm for high-density PCB layouts 24-pin dual-row header configuration Board-to-board / board-to-FPC compatibility Low profile design with ~1.5 mm mating height option Space-saving construction for compact electronics High reliability “TOUGH CONTACT” design for stable electrical connection Gold-plated contacts for improved conductivity and corrosion resistance Current rating: ~0.3 A per pin (total limited) Dielectric strength: 150 V AC Insulation resistance: ≥ 1000 MΩ Insertion life: ~50 mating cycles Surface-mount (SMD) termination for automated PCB assembly Typical Applications Smartphones and portable consumer electronics Industrial control modules Compact embedded systems Wearable devices and space-constrained PCBs #Panasonic #AXT424124 #P4SSeries #BoardToBoardConnector #FPCConnector #0.4mmPitch #SMDConnector #MezzanineConnector #HighDensityPCB #ElectronicComponents

WR-FPC SMT ZIF Horizontal Hinge FFC/FPC Connector, 22 positions, 0.50 mm pitch, bottom-contact type with flip-lock (ZIF) actuator. Surface-mount connector designed for flexible flat cable (FFC) and flexible printed circuit (FPC) connections in compact electronic devices. Horizontal cable entry, low-profile design, halogen-free and RoHS compliant. Suitable for displays, touch panels, cameras, embedded systems, consumer electronics, industrial devices, and PCB interconnect applications. Search Keywords: WR-FPC, WR-FPC SMT ZIF, 687122149022, FFC Connector, FPC Connector, 22 Pin FFC Connector, 22 Pin FPC Connector, 0.5mm Pitch Connector, Bottom Contact Connector, ZIF Connector, Flip Lock Connector, Horizontal FFC Connector, SMT FFC Connector, Würth Elektronik Connector, Flexible Flat Cable Connector, LCD Connector, Display Connector, Camera Connector Hashtags: #WRFPC #687122149022 #WurthElektronik #FFCConnector #FPCConnector #ZIFConnector #FlipLockConnector #SMTConnector #BottomContact #22PinConnector #05mmPitch #FlexibleFlatCable #FlexiblePrintedCircuit #DisplayConnector #EmbeddedHardware #PCBDesign #ElectronicsDesign #HardwareEngineering #IndustrialElectronics #ConsumerElectronicsWR-FPC 0.50mm SMT Horiz. Bot. Contact Hinge type WR-FPC 0.50mm 22pins Hinge type SMT Horizontal Bottom Contact

Circuit Board Hardware - PCB Spring-Loaded Pin with a Standard Tail 5gf 5.2A 0.019 (0.48mm) Dia Spring Loaded Pin Gold Through Hole Contact #0985015207114110 #MillMax #SocketPin #ICSocket #ReceptaclePin #ThroughHole #PressFit #MachinedPin #GoldPlated #PCBConnector #Interconnect #ElectronicHardware #CategoryConnectors #CategoryICSockets #CategorySocketPins #CommonPartsLibrary

Single-Row Female Socket Header – 22-position single-row female socket header for board-to-board and wire-to-board interconnection. Features a 2.54 mm (0.100") pitch, through-hole PCB mounting, solder termination, 3 A current rating per contact, and 250 V voltage rating. Constructed with gold flash-plated phosphor bronze contacts for enhanced corrosion resistance and a black UL94 V-0 polyester insulator. Supports push-pull mating, provides a 3.20 mm post length and 8.51 mm insulation height, and is specified for operation over a −40°C to +105°C temperature range. #SullinsConnectorSolutions #PPPC221LFBNRC #FemaleHeader #FemaleSocket #BoardToBoard #ThroughHole #22Position #2_54mmPitch #GoldPlatedContacts #PCBConnector #Interconnect #EmbeddedSystems

Through-hole female socket header providing a single-row board-to-board or wire-to-board interconnect. Features 19 positions on a 2.54 mm (0.100") pitch, gold-plated contacts, and is rated for 2.9 A per contact and 550 VAC RMS. #ThroughHole #FemaleHeader #SocketHeader #SingleRow #19Position #2.54mmPitch #GoldPlatedContacts #BoardToBoard #WireToBoard #2.9APerContact #550VAC #Samtec

Connector Header Surface Mount 10 position 0.039" (1.00mm) #JST #BM10BSRSSTB #SHSeries #BoardToWire #SMTConnector #MaleHeader #OneMillimeterPitch #PCBConnector #EmbeddedSystems #ElectronicsDesign #SurfaceMount #Interconnect

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

10 Position Terminal Block Header, Male Pins, Shrouded (4 Side) 0.100" (2.54mm) 90°, Right Angle Through Hole #CommonPartsLibrary #Connector #Interconnect #Terminal-Block #Header #Plugs and Sockets #MICRO-COMBICON MC

0.250" (6.35mm) Quick Connect Male Solder Connector Non-Insulated #CommonPartsLibrary #Connector #Interconnect #Terminal #Quick-Connect #Faston #928814

Board-to-Board Mezzanine Connector – 40-position board-to-board mezzanine connector for compact embedded systems, industrial electronics, consumer devices, communication modules, and high-density PCB interconnect applications. Features a 0.4 mm pitch, 2-row, vertical (180°) surface-mount configuration, and supports 300 mA maximum current per contact with a 60 V voltage rating. Constructed with gold-plated phosphor bronze contacts for excellent conductivity and long-term reliability, the connector is designed for high-density PCB stacking in space-constrained applications. Specified for operation over a −55°C to +85°C temperature range and supplied in an SMT package. #TXGA #FBB04004F40S1003K6M #BoardToBoardConnector #MezzanineConnector #40PinConnector #040mmPitch #SMTConnector #PCBInterconnect #HighDensityConnector #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector