Female Header 38 Position 2.54mm Pitch Dual Row Through Hole -40℃~+105℃ X6521FV-2x19-C85D32 is a 2.54 mm pitch, dual-row female header connector manufactured by XKB Connection. It is designed for through-hole PCB mounting and provides a reliable board-to-board or wire-to-board interconnection solution in industrial, consumer, and embedded electronic applications. The connector features 38 positions (2×19) arranged in two rows and supports moderate power and signal transmission requirements. Key Features Connector Type: Female Header / Receptacle Number of Positions: 38 contacts (2×19 configuration) Pitch: 2.54 mm (0.1 inch) Row Spacing: 2.54 mm Mounting Type: Through-Hole (THT) Orientation: Top-entry Rated Current: 3 A per contact Rated Voltage: 250 V Contact Material: Brass Contact Plating: Gold-plated contacts for improved conductivity and corrosion resistance Insulator Height: 8.5 mm Operating Temperature Range: -40°C to +105°C Hole Type: Square socket contacts RoHS Compliant Typical Applications Microcontroller and development boards Industrial control systems Embedded electronics Board-to-board interconnections Prototyping and evaluation hardware Signal and low-power distribution connections #CommonPartsLibrary #Connector

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

Analog to Digital Converters - ADC Single-channel, 9-bit, 1.3-GSPS analog-to-digital converter (ADC) with JESD204C interface 144-FCBGA -40 to 85 ADC09xJ1300 is a family of quad, dual and single channel, 9-bit, 1.3GSPS analog-to-digital converters (ADC). Low power consumption, high sampling rate and 9-bit resolution makes the ADC09xJ1300 ideally suited for suited for a variety of multi-channel communications and test systems. Full-power input bandwidth (-3dB) of 6GHz enables direct RF sampling of L-band and S-band. A number of clocking features are included to relax system hardware requirements, such as an internal phase-locked loop (PLL) with integrated voltagecontrolled oscillator (VCO) to generate the sampling clock. Four clock outputs are provided to clock the logic and SerDes of the FPGA or ASIC. A timestamp input and output is provided for pulsed systems. JESD204C serialized interface decreases system size by reducing the amount of printed circuit board (PCB) routing. Interface modes support from 2 to 8 lanes (dual and quad channel devices) or 1 to 4 lanes (for the single channel device), with SerDes baud-rates up to 17.16Gbps, to allow the optimal configuration for each application. Features • ADC Core: – Resolution: 9 Bit – Maximum sampling rate: 1.3GSPS – Non-interleaved architecture – Internal dither reduces high-order harmonics • Performance specifications (–1dBFS): – SNR (100 MHz): 53.5dBFS – ENOB (100 MHz): 8.5 Bits – SFDR (100 MHz): 64dBc – Noise floor (–20dBFS): –143dBFS • Full-scale input voltage: 80 mVPP-DIFF • Full-power input bandwidth: 6GHz • JESD204C Serial data interface: – Support for 2 to 8 (Quad/Dual channel) or 1 to 4 (Single channel) total SerDes lanes – Maximum baud-rate: 17.16Gbps – 64B/66B and 8B/10B encoding modes – Subclass-1 support for deterministic latency – Compatible with JESD204B receivers • Optional internal sampling clock generation – Internal PLL and VCO (7.2–8.2GHz) • SYSREF Windowing eases synchronization • Four clock outputs simplify system clocking – Reference clocks for FPGA or adjacent ADC – Reference clock for SerDes transceivers • Timestamp input and output for pulsed systems • Power consumption (1GSPS): – Quad Channel: 450mW / channel – Dual channel: 625mW / channel – Single channel: 940mW • Power supplies: 1.1V, 1.9V #CommonPartsLibrary #IntegratedCircuit #ADC #HighSpeedADC #RFADC #JESD204C #13GSPS #9bitADC #DirectRFSampling #TexasInstruments #MixedSignal #DataAcquisition #JESD204

STM32WLE5JC is an ultra-low-power wireless microcontroller from STMicroelectronics that combines an Arm Cortex-M4 processor with an integrated Sub-GHz radio transceiver in a single chip. Designed for long-range, low-power IoT and LPWAN applications, it supports LoRa®, (G)FSK, (G)MSK, and BPSK modulation schemes, making it ideal for smart metering, industrial monitoring, agriculture, asset tracking, and remote sensing applications. The device offers a high level of integration, robust security features, and extensive peripheral support while maintaining very low power consumption. Key Features Arm Cortex-M4 32-bit MCU running at up to 48 MHz Integrated Sub-GHz radio transceiver (150 MHz to 960 MHz) Supports LoRa®, LoRaWAN®, (G)FSK, (G)MSK, and BPSK modulations Up to 256 KB Flash memory and 64 KB SRAM Ultra-low-power operation with multiple low-power modes Programmable RF output power up to +22 dBm High receiver sensitivity down to -148 dBm (LoRa mode) Hardware AES-256 encryption and True Random Number Generator (RNG) Public Key Accelerator (PKA) for enhanced security 12-bit ADC, 12-bit DAC, comparators, and DMA controllers Multiple communication interfaces: USART, LPUART, SPI, I²C Operating voltage range: 1.8 V to 3.6 V Operating temperature range: -40°C to +105°C Available in compact UFQFPN, UFBGA, and WLCSP packages #STM32WLE5JC #STM32WL #LoRa #LoRaWAN #SubGHz #WirelessMCU #CortexM4 #LPWAN #IoT #SmartMetering #IndustrialIoT #EmbeddedSystems #STMicroelectronics

15 Position D-Sub Plug, Male Pins Connector The 88615-5005 is a D-subminiature connector manufactured by 3M, configured as a plug-style connector with male pin contacts. D-subminiature connectors, commonly known as D-Sub connectors, are among the most widely used and longest-standing rectangular connector standards in the electronics industry, recognized by their characteristic trapezoidal metal shell that provides a self-aligning, polarized mating interface and a degree of mechanical shielding for the contacts housed within. This particular connector is built around a defined male pin contact arrangement housed within the standard D-shaped metal shell, which serves to guide correct mating alignment with its corresponding female socket connector counterpart while also helping to reduce the risk of bent or damaged pins during the mating process. As a plug-style device with pin contacts, this connector is typically mounted on a cable assembly, panel, or enclosure and is intended to mate with a female D-Sub receptacle mounted on a printed circuit board, another cable assembly, or an equipment panel, forming a complete signal or low-power interconnect path between two systems or subsystems. D-Sub connectors of this style have long been used across an extremely broad range of applications, including legacy computer peripheral interfaces, industrial control systems, test and measurement equipment, instrumentation racks, and many other applications requiring a rugged, field-serviceable, and widely interoperable multi-pin connection. Their enduring popularity stems from the connector family's mechanical robustness, ease of hand assembly and field termination, broad availability of compatible mating hardware such as backshells and hoods, and long-established presence in legacy and ruggedized electronic system designs across commercial, industrial, and aerospace sectors. 3M's D-Sub connector assemblies in this product family are typically constructed using a metal or metal-plated shell to provide mechanical strength and a degree of electromagnetic shielding, paired with an insulating housing that holds the individual pin contacts in precise alignment. The pin contacts themselves are typically machined or stamped from a conductive alloy and plated to ensure low-resistance, corrosion-resistant electrical contact across the connector's service life. As is typical for connectors in this product class, the device is intended for general-purpose signal and low-power interconnection rather than high-speed digital or high-current power transmission, making it well suited to control signal routing, instrumentation wiring, and other moderate-density interconnect applications. Spec Sheet Identification Part Number: 88615-5005 Connector Family: D-Sub Connector Assemblies Manufacturer: 3M Connector Type / Configuration Type: D-Subminiature connector Gender: Plug, male pin contacts Contact Style: Male pins Shell Style: Standard D-shaped trapezoidal metal shell Mechanical Specifications Mounting Style: Cable-mount or panel-mount plug configuration Mating Interface: Standard D-Sub polarized shell, self-aligning Contact Material: Conductive alloy pin contacts, plated for corrosion resistance and low contact resistance Application Context Typical Use: General-purpose signal and low-power interconnection Common Applications: Industrial control systems, instrumentation, test and measurement equipment, legacy peripheral interfaces, panel and rack wiring Compatibility Mates With: Corresponding D-Sub female socket receptacle connector Accessory Compatibility: Compatible with standard D-Sub backshells, hoods, and jackscrew hardware Environmental & Qualification Construction Class: General-purpose connector construction typical of the D-Sub product family RoHS Compliance: Per 3M product documentation for this series Packaging Supply Format: Standard connector packaging per 3M distribution practices #88615 #3M #DSubConnector #DSubminiature #ConnectorAssembly #MalePinConnector #PlugConnector #SignalConnector #IndustrialConnector #InstrumentationConnector #PanelMount #CableAssembly #RectangularConnector #ElectronicComponents #PCBDesign #HardwareEngineering #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #ConnectorDatasheet

10 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold The SFM-105-02-X-D-A is a high-reliability dual-row socket connector designed for board-to-board and mezzanine interconnection applications. Manufactured by Samtec, this connector provides a compact and durable solution for connecting printed circuit boards in embedded systems, industrial electronics, communications equipment, test instruments, and high-performance computing platforms. The connector features precision-machined contacts that ensure consistent electrical performance, excellent mating reliability, and long operational life. Its low-profile design and high-density contact arrangement make it suitable for applications requiring space-efficient interconnect solutions while maintaining signal integrity and mechanical robustness. Engineering Specifications Manufacturer: Samtec Part Number: SFM-105-02-X-D-A Series: SFM Series Connector Type: Board-to-Board Socket Connector Contact System: Precision Socket Contacts Row Configuration: Dual Row Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Temperature Thermoplastic Mating Compatibility: Standard Samtec Header Systems Electrical Performance: High-Reliability Signal Interconnection Mechanical Durability: High Mating Cycle Life Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Control Equipment, Communication Systems, Data Acquisition Platforms, Instrumentation, Test Equipment, Computing Hardware, PCB Interconnect Solutions Key Features High-density dual-row socket configuration Precision-machined contacts for reliable electrical performance Gold-plated contact interface for enhanced conductivity and durability Compact footprint for space-constrained designs Excellent mating alignment and retention characteristics High mechanical durability for repeated insertion cycles Suitable for board stacking and mezzanine interconnections Compatible with a wide range of Samtec header connectors Designed for industrial and commercial electronic systems Supports reliable signal transmission in high-performance applications #SFM10502XDA #Samtec #BoardToBoardConnector #SocketConnector #DualRowConnector #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #CommunicationSystems #Instrumentation #DataAcquisition #MezzanineConnector #ThroughHoleConnector #ElectronicComponents #PCBDesign #SignalIntegrity #HighReliability #ConnectorTechnology #EmbeddedHardware

The ORP OEM™ Circuit is a compact, OEM-ready electrochemical interface board that provides accurate oxidation-reduction potential (ORP) measurement from an ORP probe to your embedded system. Designed for use by developers, engineers, and manufacturers, this board simplifies integration of ORP sensing into custom hardware and industrial products. #Module #Part

Teensy-LC delivers an impressive collection of capabilities to make modern electronic projects simpler. It features an ARM Cortex-M0+ processor at 48 MHz, 62K Flash, 8K RAM, 12 bit analog input & output, hardware Serial, SPI & I2C, USB, and a total of 27 I/O pins.

Transceiver 433MHz IPEX interface -100dBm 1km SPI SMD,20x14mm RF Transceiver Modules and Modems RoHS The E04-400M16S is based on STMicroelectronics' S2-LPQTR chip as the core, it is an ultra-small size chip wireless transceiver RF module independently developed by Ebyte, working in the 433M/470M frequency band, with a maximum transmission power of 16dBm. Since this module is a SPI pure hardware radio frequency transceiver module, it needs to be driven by MCU. Features  Ultra-small size, only 14x20mm;  The communication distance can reach 1km under ideal conditions;  The maximum transmit power is 16dBm;  The receiving current (RX) is as low as 7mA, and the transmitting current (TX) is as low as 10mA@10dBm;  Low power consumption, suitable for battery-powered applications;  Support 433M/470M frequency band;  Support multiple debugging modes of 2(G)FSK, 4(G)FSK, OOK, ASK;  Support 2.5V～3.6V power supply, power supply greater than 3.3V can guarantee the best performance;  Industrial-grade standard design, supporting long-term use at -40～85℃;  IPEX interface and stamp hole are optional, which is convenient for users to develop and integrate. Application  Smart meeting  Wireless alarm system  Smart door lock  Building automation  Industrial acquisition and control  Intelligent lighting system #E04_400M16S #EBYTE #S2LP #RFModule #WirelessTransceiver #433MHz #470MHz #IoT #IndustrialAutomation #SmartHome #LongRangeWireless #SPI #LowPowerRF #EmbeddedSystems #WirelessCommunication

The RP2350, developed by Raspberry Pi Ltd, represents a significant advancement in the field of microcontrollers, building upon the foundation laid by its predecessor, the RP2040. This component is designed to cater to a wide range of applications requiring dual-core processing capabilities, with the option to switch between Dual Cortex-M33 or Hazard3 processors operating at up to 150 MHz. It features an extensive 520 kB of on-chip SRAM distributed across 10 independent banks, alongside 8 KB of one-time-programmable (OTP) storage. External memory interfaces are well-supported, with provisions for up to 16 MB of external QSPI flash/PSRAM, and an additional 16 MB accessible via an optional second chip-select, facilitating extensive code and data storage options. Security features are robust, including options for boot signing enforced by on-chip mask ROM, with key fingerprints stored in OTP, and hardware mitigations against fault injection attacks. The RP2350 also boasts a comprehensive set of peripherals, including 2x UARTs, 2x SPI controllers, 2x I2C controllers, 24x PWM channels, and a USB 1.1 controller with PHY for host and device support, among others. Programmable IO (PIO) state machines enhance its flexibility, enabling the implementation of custom peripherals. For developers, the RP2350 offers low-power operation modes and a built-in boot ROM that supports direct boot from external flash or OTP, serial boot from USB or UART, and secure boot with code signature enforcement. The device is available in QFN-60 (7x7 mm) and QFN-80 (10x10 mm) packages, with or without built-in flash, catering to diverse application requirements. This microcontroller is a compelling choice for sophisticated projects that demand high performance, extensive memory and peripheral support, and advanced security features.

The RP2350, developed by Raspberry Pi Ltd, is a high-performance microcontroller designed to cater to a broad range of applications requiring efficient power management, advanced security features, and versatile IO options. This microcontroller stands out with its dual-core architecture, featuring either Cortex-M33 or Hazard3 processors operating at up to 150 MHz, ensuring robust performance for complex applications. It boasts a substantial 520 KB of on-chip SRAM distributed across 10 independent banks, enhancing parallel data processing capabilities. Additionally, the RP2350 supports up to 16 MB of external QSPI flash/PSRAM for extensive program and data storage, further expandable via an optional second chip-select. A notable feature of the RP2350 is its integrated on-chip switched-mode power supply, designed to generate core voltage efficiently, complemented by a low-quiescent-current LDO mode for reduced power consumption in sleep states. Security is a paramount feature of the RP2350, offering options for boot signing with key fingerprint in OTP, hardware mitigations against fault injection attacks, and a hardware SHA-256 accelerator for cryptographic operations. The microcontroller is also equipped with a comprehensive set of peripherals, including USB 1.1 controller and PHY, multiple UARTs, SPI, and I2C controllers, 24 PWM channels, and 12 programmable IO (PIO) state machines, providing extensive interface capabilities. The RP2350 is available in QFN-60 and QFN-80 packages, with or without flash-in-package options, catering to various design requirements and application needs.

The Texas Instruments SN74HC08-Q1 comprises a series of automotive-qualified quadruple 2-input AND gates designed for a wide range of applications. This component operates across a temperature range of -40°C to +125°C, catering to the stringent demands of automotive environments. It features buffered inputs, positive and negative input clamp diodes, and supports a wide operating voltage range from 2 V to 6 V. The SN74HC08-Q1 is optimized for low power consumption, offering a significant reduction compared to LSTTL logic ICs, and can support fanouts up to 10 LSTTL loads. Packaged in both SOIC and TSSOP options, it provides flexibility for different hardware designs. With part numbers like SN74HC08QDRQ1 and SN74HC08QPWRQ1, this component is designed for applications that require combining power good signals and enabling digital signals, making it a versatile choice for automotive and digital systems engineering.

ASSMANN WSW A-CCS 068-Z-T ASSMANN ASSMANN A-CCS 020-Z-T PLCC socket connector, 20-pin through-hole (THT) socket for PLCC integrated circuits, 1.27mm pitch contacts, PPS glass-fiber reinforced UL94V-0 housing, phosphor bronze contacts with matte tin plating over nickel, low insertion force design, rated for 1A and 125–250V operation, 200 mating cycles, operating temperature -40°C to +105°C, designed for removable PLCC memory devices, microcontrollers, programmable logic ICs and development hardware. Search Keywords: A-CCS 020-Z-T, ACCS020ZT, ASSMANN A-CCS 020-Z-T, ASS 0981 CO, PLCC socket 20 pin, 20 pin PLCC socket, PLCC IC socket, 1.27mm pitch PLCC socket, through hole PLCC socket, THT PLCC socket, ASSMANN PLCC socket, removable IC socket, PLCC connector Hashtags: #ACCS020ZT #ASSMANN #PLCCSocket #20PinPLCC #PLCCConnector #ICSocket #ThroughHoleSocket #THTSocket #127mmPitch #EmbeddedHardware #ProgrammableLogic #MicrocontrollerSocket #ElectronicsConnector #SocketConnector

The RP2350, developed by Raspberry Pi Ltd, is a high-performance microcontroller designed to cater to a broad range of applications requiring efficient power management, advanced security features, and versatile IO options. This microcontroller stands out with its dual-core architecture, featuring either Cortex-M33 or Hazard3 processors operating at up to 150 MHz, ensuring robust performance for complex applications. It boasts a substantial 520 KB of on-chip SRAM distributed across 10 independent banks, enhancing parallel data processing capabilities. Additionally, the RP2350 supports up to 16 MB of external QSPI flash/PSRAM for extensive program and data storage, further expandable via an optional second chip-select. A notable feature of the RP2350 is its integrated on-chip switched-mode power supply, designed to generate core voltage efficiently, complemented by a low-quiescent-current LDO mode for reduced power consumption in sleep states. Security is a paramount feature of the RP2350, offering options for boot signing with key fingerprint in OTP, hardware mitigations against fault injection attacks, and a hardware SHA-256 accelerator for cryptographic operations. The microcontroller is also equipped with a comprehensive set of peripherals, including USB 1.1 controller and PHY, multiple UARTs, SPI, and I2C controllers, 24 PWM channels, and 12 programmable IO (PIO) state machines, providing extensive interface capabilities. The RP2350 is available in QFN-60 and QFN-80 packages, with or without flash-in-package options, catering to various design requirements and application needs.

The RP2350, developed by Raspberry Pi Ltd, is a high-performance microcontroller designed to cater to a broad range of applications requiring efficient power management, advanced security features, and versatile IO options. This microcontroller stands out with its dual-core architecture, featuring either Cortex-M33 or Hazard3 processors operating at up to 150 MHz, ensuring robust performance for complex applications. It boasts a substantial 520 KB of on-chip SRAM distributed across 10 independent banks, enhancing parallel data processing capabilities. Additionally, the RP2350 supports up to 16 MB of external QSPI flash/PSRAM for extensive program and data storage, further expandable via an optional second chip-select. A notable feature of the RP2350 is its integrated on-chip switched-mode power supply, designed to generate core voltage efficiently, complemented by a low-quiescent-current LDO mode for reduced power consumption in sleep states. Security is a paramount feature of the RP2350, offering options for boot signing with key fingerprint in OTP, hardware mitigations against fault injection attacks, and a hardware SHA-256 accelerator for cryptographic operations. The microcontroller is also equipped with a comprehensive set of peripherals, including USB 1.1 controller and PHY, multiple UARTs, SPI, and I2C controllers, 24 PWM channels, and 12 programmable IO (PIO) state machines, providing extensive interface capabilities. The RP2350 is available in QFN-60 and QFN-80 packages, with or without flash-in-package options, catering to various design requirements and application needs.

The RP2350, developed by Raspberry Pi Ltd, represents a significant advancement in the field of microcontrollers, building upon the foundation laid by its predecessor, the RP2040. This component is designed to cater to a wide range of applications requiring dual-core processing capabilities, with the option to switch between Dual Cortex-M33 or Hazard3 processors operating at up to 150 MHz. It features an extensive 520 kB of on-chip SRAM distributed across 10 independent banks, alongside 8 KB of one-time-programmable (OTP) storage. External memory interfaces are well-supported, with provisions for up to 16 MB of external QSPI flash/PSRAM, and an additional 16 MB accessible via an optional second chip-select, facilitating extensive code and data storage options. Security features are robust, including options for boot signing enforced by on-chip mask ROM, with key fingerprints stored in OTP, and hardware mitigations against fault injection attacks. The RP2350 also boasts a comprehensive set of peripherals, including 2x UARTs, 2x SPI controllers, 2x I2C controllers, 24x PWM channels, and a USB 1.1 controller with PHY for host and device support, among others. Programmable IO (PIO) state machines enhance its flexibility, enabling the implementation of custom peripherals. For developers, the RP2350 offers low-power operation modes and a built-in boot ROM that supports direct boot from external flash or OTP, serial boot from USB or UART, and secure boot with code signature enforcement. The device is available in QFN-60 (7x7 mm) and QFN-80 (10x10 mm) packages, with or without built-in flash, catering to diverse application requirements. This microcontroller is a compelling choice for sophisticated projects that demand high performance, extensive memory and peripheral support, and advanced security features.

Toby PLCC series DIP socket for PLCC IC packages, through-hole PCB mounting, available for 20/28/32/52/68/84-pin PLCC devices, copper alloy contacts with tin plating over nickel, PPS UL94V-0 insulator, 1A current rating, 1000MΩ minimum insulation resistance, 300VAC dielectric withstand voltage, 20mΩ max contact resistance, -40°C to +105°C operating temperature, suitable for socketing PLCC ICs, memory chips, microcontrollers, programmable logic and embedded hardware. Search Keywords: PLCC socket, Toby PLCC socket, PLCC DIP socket, PLCC through hole socket, PLCC IC socket, 20 pin PLCC socket, 28 pin PLCC socket, 32 pin PLCC socket, 52 pin PLCC socket, 68 pin PLCC socket, 84 pin PLCC socket, PLCC PCB socket, square IC socket, IC socket connector PCF80C552 PLCC68 / PLCC-68 socket Hashtags: #PLCCSocket #TobyPLCCSocket #PLCC-68-R #PLCC-68 #ThroughHoleSocket #PLCCConnector #20PinPLCC #28PinPLCC #32PinPLCC #52PinPLCC #68PinPLCC #84PinPLCC #PPSInsulator #TinPlatedContactsphosphor bronze, tin plated,55C to 85C,1000 M,30 m

ezBLDC is a two axis smart BLDC motor driver, powered by SimpleFOC. Implementing 2 DRV8313s this board is capable of 12V @ 2.5A / phase for control of up to 2 motors at once. With its onboard smarts, this board can accept simple UART, I2C, or step/dir commands to control complex, real-time, feedback-enabled motion, freeing up the main microcontroller to do other tasks. Implementing the hardware basics for controlling brushless DC motors can be a hassle, but it doesn't have to be. This motor driver allows anyone with an Arduino to get moving with BLDC motors, with easy IO and motor connectors onboard.

STMicroelectronics STSAFE-A110 secure element IC for authentication and secure data management, designed for IoT devices, smart home, smart city, industrial applications, consumer electronics and accessories. Supports authentication to remote or local hosts, secure channel establishment with TLS handshake support, secure boot and firmware upgrade signature verification, host pairing, secure counters, local host envelope wrapping/unwrapping, symmetric data encryption/decryption, on-chip key pair generation, LPWAN security support, ECC cryptography with NIST P-256/P-384, ECDSA, ECDH, SHA-256/SHA-384, 6KB configurable EEPROM, I2C interface, 1.62V to 5.5V supply voltage, -40°C to +105°C operating temperature, available in SO8N and UFDFPN8 packages. Search Keywords: STSAFE-A110, STSAFEA110, STMicroelectronics STSAFE-A110, STSAFE secure element, secure element IC, IoT authentication IC, hardware security IC, secure authentication chip, I2C secure element, ECC secure element, ECDSA ECDH secure chip, TLS authentication IC, secure boot authentication, firmware upgrade security IC, LPWAN security chip, SO8N secure element, UFDFPN8 secure element Hashtags: #STSAFEA110 #STSAFE #STMicroelectronics #SecureElement #AuthenticationIC #IoTSecurity #HardwareSecurity #SecureBoot #FirmwareAuthentication #ECCSecurity #ECDSA #ECDH #TLSHandshake #I2CSecurity #LPWANSecurity #SO8N #UFDFPN8STMicroelectronics Authentication, state-of-the-art security for peripherals and IoT devices