2 Circuit IC Switch 2:1 10Ohm 10-UQFN (2.0x1.5) The TS5A23157 device is a dual single-pole doublethrow (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. Signals up to 5.5 V (peak) can be transmitted in either direction. Features 1• Low ON-State Resistance (15 Ω at 125℃) • 125℃ Operation • Control Inputs are 5-V Tolerant • Specified Break-Before-Make Switching • Low Charge Injection • Excellent ON-Resistance Matching • Low Total Harmonic Distortion • 1.8-V to 5.5-V Single-Supply Operation • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) 2 Applications • Sample-and-Hold Circuits • Battery-Powered Equipment • Audio and Video Signal Routing • Communication Circuits #commonpartslibrary #integratedcircuit #circuitswitch #TexasInstruments #AnalogSwitch #SPDT #SignalRouting #Multiplexer #LowOnResistance #HighSpeedSwitching #UQFN #EmbeddedSystems #ElectronicsDesign

16 Bit Digital to Analog Converter 1 10-VSSOP The DAC80501MDGSR is a high-precision, single-channel digital-to-analog converter developed by Texas Instruments for industrial, instrumentation, and embedded control applications requiring accurate voltage output generation. The device integrates a low-drift voltage reference, precision output buffer, and serial peripheral interface communication into a compact low-power solution optimized for high-resolution signal generation. Designed for applications such as programmable power supplies, process control systems, automated test equipment, and sensor calibration, the device delivers excellent linearity, low noise performance, and stable output characteristics across varying environmental conditions. The integrated architecture minimizes external component requirements while maintaining high accuracy and long-term reliability. The converter supports rail-to-rail output operation and offers flexible reference configurations to accommodate different system architectures. Its SPI-compatible digital interface enables straightforward integration with microcontrollers, processors, and FPGA-based systems. Electrical Characteristics The device operates from a single analog supply and supports precision voltage output generation with monotonic performance across the full operating range. Integrated precision reference circuitry provides low temperature drift and stable output characteristics suitable for high-accuracy measurement and control systems. Low glitch energy, low offset error, and low gain error characteristics improve output stability during code transitions. The output amplifier is capable of driving moderate capacitive loads while maintaining signal integrity and settling performance. Interface and Control Communication is implemented through a high-speed SPI-compatible serial interface supporting standard synchronous digital communication protocols. The interface allows direct programming of DAC output codes and internal configuration registers. The device supports daisy-chain capable serial communication architecture for simplified expansion in multi-device systems. Internal registers provide control of reference operation, power management, and output configuration functions. Power Management The DAC80501MDGSR incorporates low-power operating modes intended for energy-sensitive applications. Integrated power-down functionality reduces current consumption during inactive system states while preserving configuration integrity. Internal circuitry is optimized for low quiescent current operation without compromising output precision or dynamic response performance. Package Information The device is supplied in a compact VSSOP surface-mount package suitable for space-constrained industrial and embedded designs. The package configuration supports automated assembly processes and standard PCB manufacturing techniques. Typical Applications Typical applications include industrial automation, programmable voltage sources, data acquisition systems, sensor simulation, instrumentation equipment, motor control systems, and precision calibration platforms. The device is particularly suitable for systems requiring stable and repeatable analog voltage generation with minimal external circuitry. #commonpartslibrary #integratedcircuit #analog #digital #converter

16 MHz ±15ppm Crystal 8pF 60 Ohms 4-SMD, No Lead The CX3225SB16000D0GZJC1, manufactured by Kyocera AVX, is a 16.000 MHz crystal oscillator element designed to provide precise frequency reference for microcontrollers, communication ICs, and digital systems. It belongs to the CX3225SB series, known for compact size and stable frequency performance. Key Characteristics Type: Quartz crystal (passive frequency component) Frequency: 16 MHz Load Capacitance: 8 pF Frequency Stability: ±15 ppm Frequency Tolerance: ±15 ppm Operating Mode: Fundamental ESR (Equivalent Series Resistance): ~60–80 Ω Mechanical Details Package: 4-SMD, no-lead (surface mount) Size: 3.2 mm × 2.5 mm (3225 package) Height: ~0.6 mm (low profile) Operating Conditions Temperature Range: −25°C to +85°C Mounting Type: Surface mount (SMT) Function (Simple Explanation) This component: Generates a stable clock signal (16 MHz) Acts as the timing reference for MCUs, processors, or RF modules Works together with internal oscillator circuits inside ICs Microcontroller clock sources (e.g., ESP32, STM32, AVR) Communication modules Embedded systems Consumer electronics IoT devices #CommonPartsLibrary #Crystal #Oscillator #resonator

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

- ESP32-WROOM-32UE Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN), Bluetooth® Smart Ready 4.x Dual Mode 2.4GHz Evaluation Board The ESP32-DEVKITC-32UE is a development board based on the ESP32 series SoC designed by Espressif. It is widely used for IoT, embedded systems, and wireless communication applications due to its built-in Wi-Fi and Bluetooth capabilities. Microcontroller: ESP32 dual-core Tensilica LX6 processor Wireless Connectivity: Wi-Fi (802.11 b/g/n) and Bluetooth (Classic + BLE) Flash Memory: Integrated SPI flash (varies by module version) Development Interface: USB-to-UART bridge for easy programming and debugging Power Supply: Typically powered via USB or external 5V input GPIO Pins: Multiple multifunction GPIOs supporting ADC, DAC, PWM, SPI, I2C, UART, etc. Supports deep sleep and ultra-low power modes Multiple peripheral interfaces (SPI, I2C, UART, SDMMC, PWM) Compatible with ESP-IDF, Arduino IDE, and MicroPython Built-in antenna (UE variant uses U.FL or external antenna option depending on module design) IoT devices and smart home systems Wireless sensor networks Data logging and monitoring systems Robotics and automation Embedded control systems #commonpartslibrary #developmentboard #esp32 #wroom

EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory

MCP3913 Series 3.6 V 4.5 mA SMT Six-Channel Analog Front End - SSOP-28 The MCP3913A1T-E/SS is a high-performance, multi-channel analog front-end (AFE) from Microchip Technology intended for precision measurement applications. It features six simultaneous sampling 24-bit delta-sigma ADCs with integrated programmable gain amplifiers, enabling accurate acquisition of low-level analog signals. Designed for energy monitoring and industrial sensing, the device provides low noise, high dynamic range, and flexible configuration. It supports SPI communication for efficient interfacing with microcontrollers and digital processing systems. Key Features Six simultaneous sampling 24-bit delta-sigma ADC channels Integrated programmable gain amplifiers per channel High signal-to-noise ratio and low distortion Programmable oversampling ratios for performance tuning Internal voltage reference with external reference option SPI-compatible digital interface Configurable data output formats and control registers Low power operation modes Electrical Characteristics Resolution: 24-bit Number of Channels: 6 Input Configuration: Differential Supply Voltage: 2.7V to 3.6V Operating Temperature Range: -40°C to +125°C Programmable Gain: Up to 32 V/V (typical) Reference Voltage: Internal or external selectable Functional Description The device integrates six high-resolution delta-sigma ADCs that sample input signals simultaneously, ensuring accurate phase and timing relationships across channels. Each input passes through a programmable gain stage, allowing optimization for different sensor levels. Analog signals are digitized using oversampling and digital filtering techniques to achieve high precision and noise reduction. Configuration is handled via internal registers, and data is transferred through an SPI interface. Package Information Package Type: SSOP Pin Count: 28 Mounting Type: Surface Mount Applications Energy metering Power monitoring systems Industrial automation Multi-channel data acquisition Sensor interfacing Smart grid systems Advantages High integration reduces external components Simultaneous sampling improves measurement accuracy High resolution supports precise signal analysis Flexible configuration for various system requirements #commonpartslibrary #integratedcircuit #powermanagement #energymetering

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

27.12 MHz ±10ppm Crystal 10pF 50 Ohms 4-SMD, No Lead # 7M-27.120MEEQ-T Crystal Unit Engineering Specification ## General Description The 7M-27.120MEEQ-T is a surface-mount quartz crystal resonator designed to provide a stable and accurate frequency reference for digital, wireless, communication, NFC, RFID, microcontroller, and embedded system applications. Manufactured by TXC Corporation, this crystal offers reliable frequency stability, low equivalent series resistance, and compact packaging suitable for space-constrained designs. Its surface-mount construction enables automated assembly while maintaining excellent electrical performance across a wide range of operating conditions. ## Features * Fundamental mode quartz crystal resonator * Surface-mount device package for automated PCB assembly * High frequency accuracy and stability * Low equivalent series resistance * Low power consumption * Suitable for clock generation and timing circuits * RoHS compliant construction * Reliable performance for industrial and consumer electronics applications ## Electrical Characteristics * Nominal Frequency: 27.120 MHz * Crystal Type: Fundamental Mode * Load Capacitance: 10 pF * Frequency Tolerance: ±20 ppm * Frequency Stability: ±20 ppm * Equivalent Series Resistance: 60 Ω Maximum * Drive Level: Low-power operation * Operating Temperature Range: Industrial grade * Storage Temperature Range: Extended environmental capability ## Mechanical Characteristics * Package Type: Surface-Mount Crystal * Mounting Style: SMD/SMT * Compact footprint optimized for high-density PCB layouts * Four-pad no-lead package construction ## Applications * PN532 NFC Controllers * RFID Readers and Writers * Microcontroller Clock Sources * Wireless Communication Modules * Embedded Systems * Industrial Control Electronics * Consumer Electronic Devices * IoT and Smart Device Platforms ## Compliance * RoHS Compliant * Lead-Free Construction * Suitable for Automated Assembly Processes #7M27_120MEEQT #TXC #CrystalResonator #SMDCrystal #QuartzCrystal #27_120MHz #PN532 #NFC #RFID #EmbeddedSystems #TimingReference #ElectronicsDesign