Board Mount Humidity Sensors Intermediate Humidity and Temperature Sensor Humidity, Temperature 0 ~ 100% RH I2C ±1.8% RH 4 s Surface Mount The SHT41-AD1B-R2 is a fully calibrated, low-power environmental sensor that measures relative humidity (RH) and temperature. It integrates sensing elements, signal processing, and a digital interface into a small surface-mount package, making it ideal for space-constrained designs. Key Features Sensor Type: Digital humidity and temperature sensor Interface: I²C (easy MCU integration) Supply Voltage: ~1.08 V to 3.6 V Humidity Accuracy: up to ±1.8% RH (typical) Temperature Accuracy: up to ±0.2 °C (typical) Response Time: Fast measurement and low latency Power Consumption: Ultra-low, suitable for battery devices Package: DFN (compact, ~1.5 × 1.5 mm) Factory Calibration: No external calibration required Functional Overview The sensor uses capacitive humidity sensing combined with a bandgap temperature sensor. Internal electronics convert these measurements into digital data via I²C, eliminating the need for external ADCs or complex signal conditioning. Design Advantages Small footprint for compact PCBs Low power consumption for IoT and portable devices High reliability with long-term stability Fast response time for real-time monitoring Simple integration with microcontrollers Typical Applications IoT and smart home devices HVAC and climate control systems Wearables and portable electronics Industrial monitoring systems Environmental data logging #CommonPartsLibrary #Sensors,-Transducer #Humidity #Moisture-Sensor #SHT4x

Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications. Key Features 9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries Applications Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems #BNO085 #IMU #9AxisSensor #MotionTracking #SensorFusion #OrientationSensor #Robotics #AR #VR #IoT #Wearables #EmbeddedSystems #CEVA #HillcrestLabs #MotionDetection #Quaternion #InertialMeasurementUnit

36-V, Low-Power, Low Offset Voltage, Rail-to-Rail Operational Amplifier 8-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #OPA2196

Accelerometer X, Y, Z Axis ±2g, 4g, 8g 1.5kHz 14-CLCC (6x6) General Description The ADXL355BEZ is a low noise, low drift, low power, three-axis MEMS accelerometer intended for high-precision sensing applications. It delivers high-resolution digital acceleration data with excellent long-term stability and minimal temperature-induced variation. The device integrates a complete sensing chain, including the MEMS sensor element, analog conditioning, analog-to-digital conversion, and digital filtering. Output data is provided through SPI or I²C interfaces, enabling straightforward integration into embedded and industrial systems. Key Features Three-axis acceleration sensing (X, Y, Z) Selectable full-scale ranges: ±2 g, ±4 g, ±8 g Low noise density (~25 µg/√Hz) Low offset and minimal temperature drift High-resolution 20-bit digital output Integrated digital filtering SPI and I²C communication interfaces Low power consumption (~200 µA typical) Wide supply voltage range (2.25 V to 3.6 V) Integrated temperature sensor Hermetically sealed package Applications Structural health monitoring Vibration measurement and analysis Tilt and inclination sensing Industrial condition monitoring Navigation and inertial systems Seismic detection Robotics and stabilization platforms Functional Description The ADXL355BEZ includes an integrated sensing and processing architecture composed of: Three-axis MEMS sensing element Analog front-end signal conditioning High-resolution ADC Digital filtering and decimation stages Temperature sensing element Digital communication interface (SPI/I²C) Configuration and control registers Electrical Characteristics (Typical) Supply voltage: 2.25 V to 3.6 V Supply current: ~200 µA Output data rate: up to 4 kHz Noise density: ~25 µg/√Hz Resolution: 20-bit Interface: SPI / I²C Mechanical and Package Information Package type: LGA (Land Grid Array) Approximate dimensions: 3 mm × 5 mm × 1 mm Hermetically sealed for improved environmental robustness Interface and Communication Supports SPI (4-wire) and I²C protocols Outputs 20-bit acceleration data per axis Data format: two’s complement Measurement Ranges ±2 g ±4 g ±8 g Environmental Specifications Operating temperature range: -40°C to +125°C Storage temperature range: -55°C to +150°C Power Management Supports measurement and standby modes Designed for low-power operation in continuous sensing applications Compliance and Reliability Industrial-grade device Designed for long-term stability RoHS compliant #commonpartslibrary #sensor #accelerometer

Low-Power, RRIO, 1-MHz Operational Amplifier for Cost-Sensitive Systems SC-70-5 #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #TLV9001

RS485, RS422, 20Mbps Transceiver, 3.0V to 7V, Low-Power, SOT-23 #microcontrollers #Interface #UART #commonpartslibrary

Temperature Sensor Digital, Local -40°C ~ 125°C 10 b 8-MSOP The MCP9808T-E/MS is a high-accuracy digital temperature sensor developed by Microchip Technology for precision thermal monitoring applications. The device communicates through a standard I²C-compatible serial interface and is optimized for low-power embedded systems requiring accurate ambient temperature measurement. It integrates internal temperature sensing, analog-to-digital conversion, programmable alert functionality, and configurable power management within a compact MSOP package. The sensor is designed for applications including industrial monitoring, consumer electronics, IoT devices, thermal management systems, medical instrumentation, and battery-powered portable equipment. Its low operating current and shutdown capability make it suitable for energy-efficient systems where thermal accuracy and minimal power consumption are critical. The device supports programmable temperature limits and interrupt generation for over-temperature events, enabling autonomous thermal supervision without continuous host processor intervention. The MCP9808T-E/MS maintains high measurement accuracy across a wide operating temperature range and offers stable digital output without requiring external calibration components. Electrical Characteristics Supply voltage operation supports low-voltage and standard logic systems. Low operating current enables efficient continuous monitoring. Shutdown mode significantly reduces power consumption during inactive periods. Digital I²C interface supports standard and fast communication modes. Integrated temperature conversion engine provides direct digital temperature output. Temperature Sensing Features High-accuracy ambient temperature measurement. Wide operating temperature range suitable for industrial environments. Programmable resolution for balancing conversion speed and precision. Configurable upper, lower, and critical temperature alert thresholds. Integrated hysteresis control for stable thermal event detection. Communication Interface I²C-compatible serial communication interface. Configurable slave addressing for multi-device bus operation. Supports read and write access to internal configuration registers. Compatible with common microcontrollers and embedded processors. Functional Features Integrated alert output for thermal event signaling. Programmable interrupt and comparator operating modes. Internal registers support temperature monitoring and device configuration. Power-on reset circuitry ensures predictable startup behavior. Device identification registers support system-level verification. Mechanical Characteristics Package type is MSOP with compact surface-mount footprint. Suitable for automated PCB assembly processes. RoHS-compliant and lead-free manufacturing. Typical Applications Industrial temperature monitoring systems. Portable battery-powered electronics. Embedded microcontroller systems. Thermal protection and supervision circuits. Consumer and IoT sensing devices. Medical and laboratory instrumentation. #CommonPartsLibrary #Sensor #Transducer #Temperature-Sensor #MCP9808

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

Battery Battery Monitor IC Lithium Ion 9-DSBGA The BQ27220YZFR is a highly integrated single-cell battery fuel gauge IC developed for rechargeable lithium-ion and lithium-polymer battery applications. The device utilizes Texas Instruments’ Impedance Track™ algorithm to provide highly accurate battery capacity measurement, state-of-charge estimation, runtime prediction, and battery health monitoring across varying load and temperature conditions. The device is designed for compact portable electronics, wearable devices, IoT products, handheld instruments, and low-power embedded systems requiring precise battery monitoring and extended operating life. The BQ27220YZFR supports system-side fuel gauging without requiring battery pack-side electronics, simplifying battery integration and reducing overall system cost. The fuel gauge continuously monitors battery voltage, current, and temperature to estimate available capacity, remaining runtime, full charge capacity, and state-of-health information. Integrated low-power operation enables ultra-low standby current consumption suitable for always-on battery-powered products. Communication with the host processor is implemented through a standard I²C interface, allowing configuration access, telemetry reporting, and battery parameter monitoring. The device also integrates protection and alert functionality through programmable interrupt outputs and battery condition monitoring features. The BQ27220YZFR is optimized for use with single-cell lithium-based chemistries and supports learning cycles for adaptive battery characterization over product lifetime. Internal data flash memory stores battery profile information and calibration parameters to improve long-term gauging accuracy. The device is supplied in a compact lead-free wafer chip-scale package suitable for space-constrained PCB designs and portable electronics requiring minimal footprint and low-profile assembly. Electrical Characteristics Device Type Single-cell battery fuel gauge and battery monitor IC Battery Chemistry Support Lithium-ion and lithium-polymer rechargeable batteries Input Voltage Range Supports single-cell battery operation Fuel Gauging Method Impedance Track™ algorithm Communication Interface I²C serial interface Measurement Functions Battery voltage monitoring Battery current monitoring Battery temperature monitoring State-of-charge estimation Remaining capacity calculation Full charge capacity estimation State-of-health reporting Runtime prediction Power Consumption Ultra-low operating current for portable applications Temperature Monitoring External thermistor support Host Alert Features Interrupt and alert reporting capability Data Storage Integrated nonvolatile configuration memory Calibration Features Automatic learning and battery characterization support Protection Monitoring Battery condition and system monitoring functions Package Type DSBGA wafer chip-scale package Mounting Style Surface mount Operating Temperature Range Industrial temperature operation suitable for portable electronics Functional Features High-accuracy fuel gauging over battery lifetime Adaptive battery modeling and aging compensation Low-power operation for battery-powered systems Integrated battery profiling capability Real-time remaining runtime estimation Automatic battery learning cycles Compact PCB footprint for portable devices System-side implementation without smart battery pack requirement Programmable battery alert functionality Support for low-power embedded processors and mobile systems Optimized for wearable and IoT applications RoHS compliant and lead-free package construction #commonpartslibrary #integratedcircuit #powermanagement #batterymanagement

Pressure Sensor 4.35PSI ~ 18.13PSI (30kPa ~ 125kPa) Absolute 10-WFLGA The BMP581 is a high-precision digital barometric pressure sensor designed for altitude tracking, environmental monitoring, navigation, weather sensing, and industrial measurement applications. It integrates a MEMS pressure sensing element with a low-noise analog front end and digital signal processing to deliver highly accurate pressure and temperature measurements over a wide operating range. The device supports low-power operation, making it suitable for portable, battery-powered, and always-on sensing systems. The sensor communicates through standard digital interfaces and includes configurable sampling, filtering, and interrupt features for flexible system integration. Its compact package enables use in space-constrained embedded designs such as wearables, mobile devices, drones, smart home systems, IoT devices, and industrial instrumentation. Engineering Specification Device Type Digital barometric pressure and temperature sensor Manufacturer Bosch Sensortec Pressure Measurement High-resolution absolute pressure measurement with integrated temperature compensation Temperature Measurement Integrated digital temperature sensing for environmental monitoring and pressure compensation Pressure Range Wide atmospheric pressure sensing range suitable for altitude and environmental applications Interface Support I²C and SPI digital communication interfaces Supply Voltage Low-voltage operation optimized for embedded and portable systems Power Consumption Ultra-low power modes with configurable performance and sampling settings Measurement Features Oversampling support with programmable output data rate and internal filtering Accuracy High absolute and relative pressure accuracy for precise altitude estimation and environmental sensing Noise Performance Low-noise sensor architecture for stable pressure readings and improved altitude resolution Interrupt Features Configurable interrupt generation for data-ready and threshold-based events FIFO Support Integrated FIFO buffering for efficient sensor data management Operating Temperature Industrial temperature operating capability for consumer and industrial environments Package Type Compact surface-mount package optimized for small PCB footprint designs Applications Altitude tracking, indoor navigation, weather stations, drones, wearable electronics, IoT sensing, HVAC systems, industrial monitoring, and portable devices #CommonPartsLibrary #Sensor #Transducer #PressureSensor

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

Bipolar (BJT) Transistor Array 2 PNP (Dual) Matched Pair 65V 100mA 175MHz 380mW Surface Mount 6-TSOP The BCM856DS,115 is a dual matched PNP bipolar junction transistor (BJT) housed in a compact SOT-363 (SC-88) 6-pin surface-mount package. It consists of two independent PNP transistors with closely matched electrical characteristics, making it suitable for differential amplifier stages, current mirrors, and signal processing applications where symmetry and thermal tracking are important. Key Features Dual PNP transistor configuration in a single package Matched transistor pair for improved circuit stability Low collector-emitter saturation voltage High current gain consistency between channels Compact SOT-363 (SC-88) package for space-constrained designs Suitable for low-power and signal-level applications Electrical Characteristics (typical values unless otherwise noted) Collector-Emitter Voltage (VCEO): -45 V Collector-Base Voltage (VCBO): -50 V Emitter-Base Voltage (VEBO): -5 V Continuous Collector Current (IC): -100 mA per transistor Power Dissipation (Ptot): ~250 mW total DC Current Gain (hFE): 100 to 300 Transition Frequency (fT): ~100 MHz Package Information Package Type: SOT-363 (SC-88) Mounting: Surface Mount Pin Count: 6 Configuration: Dual PNP (E1, B1, C2, E2, B2, C1 pin arrangement depending on layout) Applications Differential amplifier input stages Current mirror circuits Signal amplification Analog front-end designs Matched pair transistor applications Additional Notes The two transistors are thermally coupled within the same package, improving matching over temperature variations Ideal for precision analog circuits requiring closely matched transistor characteristics Commonly used in compact and high-density PCB layouts #commonpartslibrary #transistor #bjt #pnp

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-DFN (1.5x1.5) STS40-CD1B-R3 is a high-accuracy digital temperature sensor from Sensirion, designed for precise temperature monitoring in space-constrained and low-power applications. Part of the STS4x series, it features a fully calibrated temperature sensing element with an I²C digital interface, providing reliable measurements over a wide operating temperature range. Its ultra-compact 4-DFN package makes it ideal for IoT devices, wearables, consumer electronics, industrial controls, and battery-powered systems. Key Features High-accuracy temperature measurement (±0.2°C typical at 25°C) Wide operating temperature range: -40°C to +125°C Digital I²C interface for easy MCU integration 16-bit temperature resolution Low operating voltage: 1.08 V to 3.6 V Factory calibrated and linearized output Ultra-small 1.5 mm × 1.5 mm DFN package Low power consumption suitable for battery-powered devices Surface-mount package for automated assembly Robust performance for industrial and consumer applications #STS40 #STS40CD1BR3 #Sensirion #TemperatureSensor #DigitalSensor #I2C #EmbeddedSystems #IoT #IndustrialAutomation #WearableElectronics #EnvironmentalMonitoring #ElectronicsDesign