The SUR Connector series, developed by JST, represents a groundbreaking advancement in the realm of wire-to-board insulation displacement connectors, boasting the world's first 0.8 mm pitch. This series includes both top entry and side entry types, designed to minimize occupation space on the PC board significantly compared to the conventional 1.0 mm pitch SSR connector, with the side entry type reducing board space by 34%. The top entry type measures only 2.2 mm in depth and 3.9 mm in height after mounting, whereas the side entry type is even more compact at 3.9 mm in depth and 1.75 mm in height. These connectors are engineered for a current rating of 0.5 A AC, DC for AWG #32 wires and 0.2 A AC, DC for AWG #36, with a voltage rating of 30 V DC. They operate within a temperature range of -25℃ to +85℃, ensuring reliability under various environmental conditions. The SUR series is characterized by a 3-point grip construction that allows for the use of super fine wires and includes a shrouded header with a twin U-slot insulation displacement section for secure and efficient wire connections. The connectors are available in a wide range of circuit sizes from 2 to 22, catering to diverse application requirements. They are made from copper alloy contacts with tin plating and a housing of PA, UL94V-0, ensuring compliance with RoHS standards for environmental safety. The series is available in both natural and lemon yellow color options, with model numbers specifying the number of circuits, wire range, and color. For instance, model numbers such as 02SUR-32S or 02SUR-36L indicate a 2-circuit connector suitable for AWG #32 and AWG #36 wires, respectively, with 'S' denoting natural color and 'L' lemon yellow. The connectors are supplied on embossed tape for automated assembly processes, highlighting JST's commitment to providing components that meet the needs of modern, high-efficiency manufacturing environments.

LVDS Digital Isolator 5700Vrms 4 Channel 2.5Gbps 40kV/µs CMTI 32-WFQFN Exposed Pad, CSP The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates Analog Devices, Inc., iCoupler® technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 kVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation). FEATURES ► 5.7 kV rms and 1.5 kV rms LVDS isolators ► Complies with TIA/EIA-644-A LVDS signal levels ► Quad-channel configuration ► Any data rate up to 2.5 Gbps switching with low jitter ► 10 Gbps total bandwidth across four channels ► 2.15 ns typical propagation delay ► Typical jitter: 0.82 ps rms random, 40 ps total peak ► Lower power 1.8 V supplies ► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier ► High common-mode transient immunity: 100 kV/μs typical ► Safety and regulatory approvals (28-lead SOIC_W_FP package) ► UL (pending): 5700 V rms for 1 minute per UL 1577 ► CSA Component Acceptance Notice 5A (pending) ► VDE certificate of conformity (pending) ► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 ► VIORM = 849 VPEAK (working voltage) ► Enable or disable refresh (low speed output correctness check) ► Operating temperature range: −40°C to +125°C ► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance APPLICATIONS ► Isolated video and imaging data ► Analog front-end isolation ► Data plane isolation ► Isolated high speed clock and data links ► Multi-gigabit serialization/deserialization (SERDES) ► Board-to-board optical replacement (for example, short reach fiber) #CommonPartsLibrary #Isolator #ADN4624BCPZ #AnalogDevices #LVDS #DigitalIsolator #GalvanicIsolation #HighSpeedCommunication #SERDES

MPU with Dual Arm Cortex-A35 @1.5GHz, Cortex-M33 @400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA The STM32MP257FAI3 is a high-performance microprocessor from STMicroelectronics' STM32MP2 series, integrating dual 64-bit Arm Cortex-A35 cores running at up to 1.5 GHz, a Cortex-M33 real-time core, and a Cortex-M0+ low-power management core. It is designed for advanced industrial, edge AI, machine vision, HMI, IoT gateway, and multimedia applications requiring Linux-class processing alongside deterministic real-time control. The device features AI acceleration, 3D graphics, video encoding/decoding, extensive connectivity, advanced security, and support for high-speed external memory. Key Features Dual-core 64-bit Arm Cortex-A35 CPU operating up to 1.5 GHz Arm Cortex-M33 real-time processor with TrustZone and FPU support Arm Cortex-M0+ low-power coprocessor for autonomous operation Integrated NPU (Neural Processing Unit) delivering up to 1.35 TOPS AI performance 3D GPU and hardware video encoder/decoder acceleration Supports DDR3L, DDR4, and LPDDR4 external memory up to 4 GB Multiple display interfaces including MIPI-DSI, LVDS, and parallel RGB USB 2.0 Host and USB 3.0 Dual-Role with embedded PHYs PCI Express interface with integrated 5 Gbps PHY Up to three Gigabit Ethernet interfaces with TSN and IEEE 1588 support Extensive connectivity: I2C, I3C, SPI, UART, USART, CAN FD, SDMMC, SAI, and SPDIF Hardware cryptographic accelerators including AES, SHA, RSA, ECC, PKA, and True RNG Secure boot, TrustZone security, tamper detection, and resource isolation framework Multiple low-power operating modes for energy-efficient designs Available in fine-pitch BGA packages for high-density embedded systems. #STM32MP257FAI3 #STM32MP2 #STMicroelectronics #CortexA35 #CortexM33 #EdgeAI #EmbeddedLinux #IndustrialAutomation #MachineVision #HMI #IoTGateway #MPU #PCIe #USB3 #GigabitEthernet #TrustZone #EmbeddedSystems #ArtificialIntelligence #LinuxProcessor #IndustrialIoT #CommonPartsLibrary #IntegratedCircuit #Microprocessor #STM32MP2

Jack Modular Connector 6p6c (RJ11, RJ12, RJ14, RJ25) 90° Angle (Right) Shielded Cat5 The 615006141121 is a board-to-board or wire-to-board connector component designed for reliable electrical interconnection in electronic assemblies. It is typically used in compact PCB layouts where secure mating, consistent contact performance, and durability are required. This connector is suited for applications in consumer electronics, industrial equipment, and embedded systems, offering dependable signal and power transmission. Key Features: Compact connector design for space-constrained applications High-reliability contact interface Designed for PCB mounting ապահով secure mating and retention Suitable for signal and low-power connections Mechanical Characteristics: Mounting Type: Through-hole or surface-mount (depending on variant) Orientation: Vertical or right-angle configuration Contact Configuration: Multi-position connector Pitch: Standard fine-pitch spacing typical for board-level connectors Housing Material: High-temperature thermoplastic Contact Material: Copper alloy with plated finish Electrical Characteristics: Contact Resistance: Low contact resistance for stable signal integrity Insulation Resistance: High insulation resistance Rated Voltage: Suitable for low-voltage applications Current Rating: Designed for signal-level or moderate current carrying Environmental Characteristics: Operating Temperature Range: Suitable for standard industrial temperature ranges RoHS Compliance: Yes Durability: Designed for multiple mating cycles Applications: Embedded systems Consumer electronics Industrial control boards Communication devices PCB interconnect solutions #commonpartslibrary #connector #jackmodular

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) LVDS Digital Isolator 5700Vrms 4 Channel 2.5Gbps 40kV/µs CMTI 28-BSSOP (0.295", 7.50mm Width) The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates Analog Devices, Inc., iCoupler® technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 kVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation). FEATURES ► 5.7 kV rms and 1.5 kV rms LVDS isolators ► Complies with TIA/EIA-644-A LVDS signal levels ► Quad-channel configuration ► Any data rate up to 2.5 Gbps switching with low jitter ► 10 Gbps total bandwidth across four channels ► 2.15 ns typical propagation delay ► Typical jitter: 0.82 ps rms random, 40 ps total peak ► Lower power 1.8 V supplies ► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier ► High common-mode transient immunity: 100 kV/μs typical ► Safety and regulatory approvals (28-lead SOIC_W_FP package) ► UL (pending): 5700 V rms for 1 minute per UL 1577 ► CSA Component Acceptance Notice 5A (pending) ► VDE certificate of conformity (pending) ► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 ► VIORM = 849 VPEAK (working voltage) ► Enable or disable refresh (low speed output correctness check) ► Operating temperature range: −40°C to +125°C ► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance APPLICATIONS ► Isolated video and imaging data ► Analog front-end isolation ► Data plane isolation ► Isolated high speed clock and data links ► Multi-gigabit serialization/deserialization (SERDES) ► Board-to-board optical replacement (for example, short reach fiber) #CommonPartsLibrary #ADN4624BRNZ #DigitalIsolator #LVDS #AnalogDevices #HighSpeedInterface #GalvanicIsolation #LVDSIsolator #DigitalIsolation #IndustrialElectronics #HighSpeedData #SERDES #SignalIntegrity #EmbeddedSystems #ElectronicsDesign #InterfaceICs

11 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold or Gold, GXT™ 91921-31111LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is an 11-position vertical receptacle designed for compact, high-density PCB interconnect applications such as embedded systems, industrial electronics, and compact computing devices. Key Features 1.00 mm fine-pitch board-to-board connector 11-position vertical receptacle Surface-mount (SMT) termination Dual-row configuration Gold/GXT™ contact plating for reliable electrical performance Multiple stacking height support (4.15 mm to 7.52 mm) Solder retention tabs for improved mechanical stability Operating temperature range: −55 °C to +125 °C Current rating: 1 A per contact Designed for industrial and compact embedded applications Compatible with IR reflow and vapor-phase soldering processes RoHS compliant and low-halogen material construction Typical Applications Embedded computing modules Industrial control boards Compact SBCs and SOMs Communication equipment Consumer electronics requiring low-profile mezzanine interconnects

24 Position Connector Header, Center Strip Contacts Surface Mount Gold The AXT424124 is a Panasonic P4S series 0.4 mm pitch board-to-board / board-to-FPC connector, specifically a 24-position surface-mount header designed for compact, high-density electronic assemblies. It is commonly used in mobile devices and industrial equipment where space saving and reliable fine-pitch interconnection are required. This connector belongs to Panasonic’s P4S narrow-pitch interconnect family, optimized for very small pitch stacking (0.4 mm) and low-profile designs. It supports mating with a corresponding socket connector to form a mezzanine-style board connection. Key Features Ultra-fine pitch: 0.4 mm for high-density PCB layouts 24-pin dual-row header configuration Board-to-board / board-to-FPC compatibility Low profile design with ~1.5 mm mating height option Space-saving construction for compact electronics High reliability “TOUGH CONTACT” design for stable electrical connection Gold-plated contacts for improved conductivity and corrosion resistance Current rating: ~0.3 A per pin (total limited) Dielectric strength: 150 V AC Insulation resistance: ≥ 1000 MΩ Insertion life: ~50 mating cycles Surface-mount (SMD) termination for automated PCB assembly Typical Applications Smartphones and portable consumer electronics Industrial control modules Compact embedded systems Wearable devices and space-constrained PCBs #Panasonic #AXT424124 #P4SSeries #BoardToBoardConnector #FPCConnector #0.4mmPitch #SMDConnector #MezzanineConnector #HighDensityPCB #ElectronicComponents

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector

CONN HEADER SMD R/A 3POS 1.25mm The SM03B-GHS-TB(LF)(SN) is a 3-pin, surface-mount, right-angle header connector that mates with JST GH-series wire housings. It provides a reliable, low-profile connection between a PCB and external wires using a crimp-style mating system. It belongs to the JST GH series, known for fine-pitch, compact connectors optimized for miniaturized electronics. 3-position connector (signal/power lines) 1.25 mm pitch for high-density PCB layout Surface-mount, right-angle (horizontal) mounting Shrouded header design for secure mating and alignment Locking ramp mechanism to prevent accidental disconnection Tin-plated contacts for reliable conductivity Lead-free / RoHS compliant (LF/SN finish) Current rating: ~1 A typical Voltage rating: ~50 V Operating temperature: approx. -25 °C to +85 °C 📦 Typical Applications Consumer electronics (wearables, IoT devices) Industrial control modules Robotics and sensor interfaces Battery-powered embedded systems Compact PCB interconnect systems #CommonPartsLibrary #Connector

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector

USB-A (USB TYPE-A) USB 2.0 Receptacle Connector 4 Position Through Hole, Right Angle The ADS1256IDBT is a high-precision, low-noise, 24-bit analog-to-digital converter manufactured by Texas Instruments. It is designed for high-resolution measurement applications requiring exceptional accuracy, low drift, and programmable data rates. The device integrates a low-noise programmable gain amplifier, a precision delta-sigma ADC core, and a flexible multiplexer that supports multiple differential or single-ended analog inputs. The converter is optimized for industrial process control, sensor measurement, weigh scales, data acquisition systems, temperature monitoring, and portable instrumentation. Its integrated digital filtering and selectable gain settings enable direct interfacing with low-level sensors such as strain gauges, thermocouples, RTDs, and bridge sensors without requiring extensive external signal conditioning. The ADS1256IDBT supports SPI-compatible serial communication and operates with low power consumption while maintaining excellent dynamic performance and high effective resolution. The device provides programmable output data rates suitable for both low-speed precision measurements and higher-speed acquisition systems. Device Features 24-bit delta-sigma analog-to-digital converter Low-noise programmable gain amplifier Eight single-ended or four differential analog input channels Programmable gain settings from 1 to 64 Programmable data output rates SPI-compatible serial interface Integrated digital filter for noise reduction Low offset drift and gain drift Internal oscillator support Sensor burnout detection capability Self-calibration and system calibration functions Low power operation Wide analog supply voltage range Excellent 50 Hz and 60 Hz rejection performance Electrical Characteristics Resolution of 24 bits Maximum data rate up to 30 kSPS Differential input architecture Input multiplexer for multi-channel acquisition Low RMS noise performance High common-mode rejection ratio High power-supply rejection ratio Programmable gain amplifier integrated on-chip Internal reference support with external reference capability Interface and Control SPI-compatible digital communication interface Configurable control registers Read and write register functionality Synchronization and standby control support Hardware reset capability Interrupt and data-ready signaling support Package Information Manufacturer package designation: DBT Package type: TSSOP Surface-mount device Fine-pitch lead configuration Industrial temperature grade device Applications Precision data acquisition systems Industrial automation and control Weigh scales and bridge sensors Temperature measurement systems Pressure sensing applications Portable instrumentation Medical instrumentation Laboratory measurement equipment Energy monitoring systems Process monitoring and control Manufacturer Information Manufacturer: Texas Instruments Manufacturer Part Number: ADS1256IDBT Product Category: Precision Analog-to-Digital Converter RoHS compliant device #commonpartslibrary #integratedcircuit #analog #adc #deltasigma #precisionadc #sensorinterface #dataacquisition #industrialautomation #instrumentation #signalconditioning #texasinstruments #spiinterface #mixedsignal #measurementsystems