1/1 Transceiver Half RS422, RS485 8-SOIC The MAX3483, MAX3485, MAX3486, MAX3488, MAX3490, and MAX3491 are 3.3V, low-power transceivers for RS-485 and RS-422 communication. Each part contains one driver and one receiver. The MAX3483 and MAX3488 feature slew-rate-limited drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission at data rates up to 250kbps. The partially slew-rate-limited MAX3486 transmits up to 2.5Mbps. The MAX3485, MAX3490, and MAX3491 transmit at up to 10Mbps. Drivers are short-circuit current-limited and are protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-impedance state. The receiver input has a fail-safe feature that guarantees a logic-high output if both inputs are open circuit. The MAX3488, MAX3490, and MAX3491 feature fullduplex communication, while the MAX3483, MAX3485, and MAX3486 are designed for half-duplex communication. Applications ● Low-Power RS-485/RS-422 Transceivers ● Telecommunications ● Transceivers for EMI-Sensitive Applications ● Industrial-Control Local Area Networks ● Operate from a Single 3.3V Supply— No Charge Pump! ● Interoperable with +5V Logic ● 8ns Max Skew (MAX3485/MAX3490/MAX3491) ● Slew-Rate Limited for Errorless Data Transmission (MAX3483/MAX3488) ● 2nA Low-Current Shutdown Mode (MAX3483/MAX3485/MAX3486/MAX3491) ● -7V to +12V Common-Mode Input Voltage Range ● Allows up to 32 Transceivers on the Bus ● Full-Duplex and Half-Duplex Versions Available ● Industry Standard 75176 Pinout (MAX3483/MAX3485/MAX3486) ● Current-Limiting and Thermal Shutdown for Driver Overload Protection

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing

ESD DIODE 5VWM 14VC SOT-666-6 The USBLC6-2P6 is a dual-line, rail-to-rail transient voltage suppressor (TVS) diode array in a compact SOT-666 package. It is specifically optimized for protecting USB D+ and D− lines (and similar high-speed differential pairs) while maintaining very low signal distortion due to its low capacitance design. It clamps high-voltage ESD events to safe levels, protecting sensitive ICs such as MCUs, USB PHYs, and transceivers. Designed for USB and high-speed data protection Ideal for USB 2.0 (480 Mbps) interfaces Very low line capacitance Minimizes signal distortion on high-speed differential pairs Bidirectional ESD protection Protects both positive and negative voltage transients Low clamping voltage Typical clamp around ~17 V during surge events High peak pulse current capability Handles ESD strikes (IEC 61000-4-2 compliant, typically ±15 kV air / ±8 kV contact in similar ST USBLC family devices) Rail-to-rail protection structure Protects signal lines relative to VCC and GND Compact SOT-666 package Suitable for very small PCB layouts (phones, USB ports, embedded systems) 2-channel configuration Typically used for D+ / D− pair protection Typical Applications USB 2.0 ports (D+ / D− protection) Smartphones and tablets Embedded systems with external connectors HDMI / Ethernet signal protection (low-capacitance variants also used) Any exposed high-speed data interface requiring ESD protection #CommonPartsLibrary #Diode

This project is a reference design for an ESP32-WROOM-32E based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #project #ESP32 #ESP32WROOM #RF #WIFI #MCU #referenceDesign #simple-embedded #espressif #template #reference-design

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector

RS-485/RS-422 ICs THVD1450DR SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL LCSC Part Number: C2671361 JLCPCB Part Class: Extended Part Manufactured by TI(德州仪器) Texas Instruments THVD14xx family of noise-immune RS-485/RS-422 transceivers, 3V to 5.5V single-supply operation, meets or exceeds TIA/EIA-485A requirements, differential output voltage above 2.1V for PROFIBUS compatibility, ±18kV IEC 61000-4-2 contact ESD protection, ±25kV IEC air-gap ESD, ±30kV HBM ESD, ±4kV IEC EFT protection, ±15V extended common-mode range, low EMI 500kbps and 50Mbps data rate options, open/short/idle bus fail-safe, supports up to 256 bus nodes, -40°C to +125°C operating temperature, available in VSON, VSSOP and SOIC packages. Search Keywords: THVD14xx, Texas Instruments THVD14xx, TI THVD14xx, THVD1410, THVD1450, THVD1451, THVD1452, THVD1410 RS485, THVD1450 RS485, THVD1451 RS485, THVD1452 RS485, RS485 transceiver, RS422 transceiver, 3V to 5.5V RS485 transceiver, IEC ESD protected RS485, 18kV ESD RS485 transceiver, PROFIBUS compatible RS485, 500kbps RS485 transceiver, 50Mbps RS485 transceiver, 256 node RS485 transceiver, THVD14xx VSON, THVD14xx VSSOP, THVD14xx SOIC Hashtags: #THVD14xx #THVD1410 #THVD1450 #THVD1451 #THVD1452 #TexasInstruments #TIRS485 #RS485Transceiver #RS422Transceiver #IndustrialRS485 #ProfibusRS485 #3Vto5VTransceiver #500kbpsRS485 #50MbpsRS485 #IEC6100042 #18kVESDProtection #25kVESDProtection #EFTProtection #FailSafeReceiver #256NodeRS485 #VSON8 #VSSOP8 #SOIC8 #SOIC14

USB-to-UART Bridge CP2102N-A02-GQFN24 is a highly integrated USB-to-UART bridge controller from Silicon Labs. It provides a simple and cost-effective way to add USB connectivity to embedded systems by converting USB 2.0 Full-Speed communication into a standard UART interface. The device integrates the USB transceiver, oscillator, voltage regulator, and UART controller, minimizing external components and eliminating the need for USB firmware development. It is commonly used in microcontroller programming interfaces, industrial equipment, POS terminals, data loggers, and USB-to-serial adapters. Key Features USB 2.0 Full-Speed compliant (12 Mbps) interface. USB-to-UART bridge with data rates up to 3 Mbaud. Integrated USB transceiver; no external USB resistors required. Integrated oscillator; no external crystal required. On-chip 3.3 V voltage regulator. USB Battery Charger Detection (BC 1.2) support. Remote wakeup capability from USB suspend state. Low operating current of approximately 9.5 mA. Hardware and software flow control support. Internal configurable ROM for Vendor ID, Product ID, serial number, and USB descriptors. Royalty-free Virtual COM Port (VCP) drivers available for major operating systems. Operating temperature range: −40°C to +85°C. Compact 24-pin QFN (4 mm × 4 mm) package. Typical Applications USB-to-Serial adapters Microcontroller programming and debugging interfaces Industrial automation equipment Point-of-sale (POS) terminals Medical instruments Data acquisition and logging systems Embedded systems requiring USB connectivity #commonpartslibrary #integratedcircuit

53.3V Clamp 7.5A Ipp Tvs Diode Surface Mount SMA TVS diode SMA 33V The SMAJ33A-13-F is a surface-mount transient voltage suppression (TVS) diode designed to protect sensitive electronic components from voltage spikes and transient events. It is typically used in circuits exposed to electrostatic discharge, inductive load switching, and other transient voltage conditions. The device operates by clamping excessive voltage to a safe level, thereby preventing damage to downstream components. Its compact surface-mount package enables efficient use of board space while maintaining reliable thermal and electrical performance. Device Overview This component is constructed using silicon avalanche technology, providing fast response time to transient events. It is intended for use in high-reliability applications where overvoltage protection is critical. The unidirectional configuration ensures effective suppression in circuits with a defined polarity. The device is optimized for low leakage current under normal operating conditions and high surge capability during transient events. Electrical Characteristics The diode is designed to operate with a defined stand-off voltage, ensuring it remains non-conductive during normal system operation. Upon exceeding the breakdown threshold, the device transitions into conduction, clamping the voltage to a specified level. It supports high peak pulse power dissipation and is capable of handling repeated transient events without significant degradation. Mechanical and Packaging Information The device is provided in a compact surface-mount package suitable for automated assembly processes. The package is designed for efficient heat dissipation and mechanical robustness, supporting standard reflow soldering techniques. Terminal finishes are compatible with common PCB manufacturing processes and ensure reliable solder joints. Applications Suitable for use in consumer electronics, industrial control systems, telecommunications equipment, and automotive electronics where protection against voltage transients is required. Common use cases include power supply lines, data lines, and interface ports. Environmental and Reliability Considerations The component is designed to meet standard environmental and reliability requirements for electronic components. It is suitable for operation across a wide temperature range and is built to withstand typical handling and assembly stresses. #commonpartslibrary #circuitprotection #tvsdiode

This project is a reference design for an ESP32-WROOM-32E based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #project #ESP32 #ESP32WROOM #RF #WIFI #MCU #simpleEmbedded #espressif #template

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

The FSA2567 is a bi-directional, low-power, dual double-pole, double-throw (4PDT) analog switch targeted at dual SIM card multiplexing. It is optimized for switching the WLAN-SIM data and control signals and dedicates one channel as a supply-source switch.

The TYPE-C-16M-0243MD is a USB Type-C receptacle connector designed for high-reliability power and data interface applications in compact electronic systems. This surface-mount connector supports reversible plug insertion and is commonly used in embedded hardware, portable electronics, communication devices, industrial systems, and USB-powered equipment requiring modern USB Type-C connectivity. The connector is engineered to provide durable mechanical retention, reliable electrical contact performance, and compact PCB integration for high-density electronic designs. It supports USB power delivery and high-speed signal routing depending on the system implementation. The device is optimized for automated SMT assembly and is widely used in charging interfaces, data communication ports, development boards, consumer electronics, and IoT hardware platforms. Its reinforced shell structure and multiple grounding points improve mechanical robustness and EMI performance, making it suitable for repeated mating cycles and long-term operational reliability. Engineering Specification Device Type USB Type-C receptacle connector Connector Standard USB Type-C interface Mounting Style Surface mount technology Contact Configuration Multi-pin reversible connector interface Orientation Reversible plug insertion support Mechanical Structure Reinforced shell with PCB retention support Electrical Characteristics Designed for USB power and data transmission applications Signal Support Compatible with high-speed differential signal routing Power Capability Supports USB power delivery and charging architectures Shielding Characteristics Integrated grounding and EMI reduction structure Durability Features High mating cycle reliability for repeated insertion applications Package Type SMT mid-mount or hybrid mounting connector structure Assembly Compatibility Optimized for automated PCB manufacturing processes Applications Portable electronics Embedded systems USB charging devices Communication hardware Industrial electronics IoT devices Development boards Consumer electronics Power delivery interfaces Data communication systems Manufacturer Commonly associated with generic and OEM USB connector manufacturers #commonpartslibrary #usbtypec #usbconnector #typecconnector #embeddedhardware #electronicsdesign #communicationinterfaces #surfaceountcomponents #consumerelectronics #iothardware #pcbdesign #powermanagement #datainterface #industrialelectronics #usbpowerdelivery

# BZT52C12-7-F ## General Description The BZT52C12-7-F is a surface-mount Zener diode manufactured by Diodes Incorporated and designed for precision voltage regulation, voltage reference generation, overvoltage protection, and signal conditioning applications. The device provides a stable reverse-breakdown voltage characteristic that enables reliable voltage clamping and circuit protection in a wide range of electronic systems. Its compact package, low leakage performance, and robust semiconductor construction make it suitable for consumer electronics, industrial controls, telecommunications equipment, power management circuits, embedded systems, and portable electronic devices. The diode is optimized for applications requiring dependable voltage stabilization and transient protection within space-constrained designs. ## Key Features ### Voltage Regulation Characteristics * Precision Zener voltage regulation * Stable reverse-breakdown performance * Consistent voltage reference capability * Reliable voltage clamping operation * Suitable for regulation and protection applications * Excellent long-term voltage stability ### Electrical Characteristics * Low leakage current performance * Fast response to transient conditions * Stable electrical operation * Reliable reverse-bias characteristics * Low power dissipation design * Suitable for signal and power circuits ### Protection Features * Overvoltage protection capability * Voltage clamping functionality * Transient suppression support * Circuit protection enhancement * Reliable fault-condition response * Improved system robustness ### Package Characteristics * Surface-mount package construction * Compact footprint design * High-density PCB layout compatibility * Automated assembly compatible * Reflow soldering compatible * Space-saving implementation ### Material Construction * Silicon Zener diode technology * High-reliability semiconductor structure * RoHS-compliant materials * Lead-free package construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Stable operation under industrial conditions * Reliable thermal performance * Resistant to environmental stress * Suitable for continuous-duty applications ### Application Areas * Voltage Reference Circuits * Power Supply Regulation * Overvoltage Protection Systems * Signal Conditioning Circuits * Industrial Control Equipment * Embedded Systems * Telecommunications Equipment * Consumer Electronics * Battery-Powered Devices * Sensor Interface Circuits * Data Communication Equipment * General Electronic Protection Circuits ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Voltage Regulation and Protection Solution ## Manufacturer Diodes Incorporated ## Product Family BZT52 Series Surface-Mount Zener Diodes #BZT52C127F #DiodesIncorporated #ZenerDiode #VoltageReference #VoltageRegulation #OvervoltageProtection #CircuitProtection #SignalConditioning #PowerManagement #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #ElectronicsEngineering #PCBDesign #SMTComponents

Authentication Chip 8-UDFN (2x3) The ATECC608B-MAHDA-S is a secure authentication and cryptographic co-processor designed for hardware-based security, device authentication, encrypted communication, and secure key storage in embedded systems and IoT applications. The device integrates advanced cryptographic functionality with protected non-volatile memory to provide a secure root of trust for connected devices. The integrated security engine supports public key cryptography, secure boot validation, message authentication, key generation, digital signatures, and encrypted data exchange. The device is optimized for low-power embedded applications requiring protection against counterfeiting, unauthorized access, firmware tampering, and network-based attacks. The ATECC608B-MAHDA-S supports industry-standard cryptographic algorithms and secure provisioning workflows, enabling secure authentication in cloud-connected systems, industrial automation, consumer electronics, and automotive embedded platforms. The compact surface-mount package and low-power operation make the device suitable for highly integrated embedded designs where hardware security and identity protection are critical requirements. Key Features Hardware-based cryptographic security device Secure key storage and management Integrated authentication engine Public key cryptography support Secure boot and firmware validation capability Digital signature generation and verification Hardware random number generator Encrypted communication support Tamper-resistant key protection Secure provisioning and device identity management Low-power operation for embedded systems I2C serial communication interface Compact surface-mount package IoT and cloud authentication support Electrical Characteristics Secure non-volatile key storage architecture Low operating power consumption Hardware cryptographic acceleration Secure internal key isolation Fast authentication processing capability Wide operating voltage support Industrial temperature operation compatibility High-reliability embedded security implementation Applications IoT device authentication Secure embedded systems Cloud-connected devices Secure boot implementations Firmware integrity verification Industrial automation systems Smart home products Medical electronics Automotive embedded security Asset tracking and identification Anti-counterfeiting systems Encrypted communication platforms Package Information Package Type: SOIC Mounting Type: Surface Mount Compact embedded security package RoHS compliant configuration available #commonpartslibrary #integratedcircuit #securityic #cryptography #iotsecurity #embeddedhardware #authentication #secureboot #hardwaresecurity #encryptedcommunication

Sensor Evaluation Boards RoHS The OV2640 Camera Board integrates the OV2640 2MP CameraChip™ sensor with onboard circuitry to simplify interfacing with microcontrollers. It captures images up to UXGA resolution (1622 × 1200 / 1632 × 1232 depending on configuration) and supports both raw and compressed output formats. The sensor also includes an internal image signal processor (ISP), allowing direct JPEG compression without external processing. This makes it especially suitable for low-cost embedded systems where bandwidth and MCU resources are limited. ⭐ Key Features 📸 Image Performance 2 Megapixel CMOS sensor (OV2640) Max resolution: UXGA (up to ~1600 × 1200 class) Frame rates (typical): UXGA / SXGA: up to ~15–30 fps (depending on mode) SVGA: up to 30 fps CIF: up to 60 fps 🎨 Output Formats Supports multiple image data formats: JPEG (hardware compressed) YUV 422 / 420 RGB565 / RGB555 YCbCr 4:2:2 8-bit raw / compressed output modes ⚡ Electrical Characteristics Supply voltage: 3.3V I/O voltage range: 1.7V – 3.3V Low-power CMOS design optimized for embedded devices

The LSM6DSOXTR is a low-power inertial measurement unit integrating a three-axis accelerometer and a three-axis gyroscope within a compact surface-mount package. Designed for motion tracking, gesture recognition, activity monitoring, and sensor fusion applications, the device incorporates embedded machine learning capabilities and programmable finite state machines to enable intelligent edge processing with reduced host processor workload. The sensor supports high-performance motion sensing while maintaining low power consumption, making it suitable for wearable devices, IoT products, industrial monitoring systems, smart home equipment, and portable electronics. Engineering Specification Device Type Six-axis inertial measurement unit featuring a three-axis accelerometer and three-axis gyroscope. Sensor Functions Motion sensing, orientation detection, vibration monitoring, gesture recognition, activity tracking, tilt sensing, and sensor fusion. Integrated Features Embedded machine learning core, finite state machine engine, sensor hub functionality, timestamp generation, event detection, and programmable interrupt generation. Communication Interface Supports digital communication through I²C, SPI, and I³C interfaces for integration with microcontrollers and embedded processors. Power Characteristics Optimized for low-power operation with multiple performance modes supporting battery-powered and always-on applications. Measurement Capabilities Provides configurable acceleration and angular rate measurement ranges with programmable output data rates and digital filtering options. Embedded Intelligence Includes on-chip machine learning and event classification capabilities to enable local data processing and reduce system power consumption. Package Style Compact surface-mount LGA package suitable for space-constrained electronic designs. Applications Wearable electronics, asset tracking devices, industrial sensors, robotics, smart appliances, navigation systems, handheld devices, health monitoring equipment, and IoT products. Manufacturer STMicroelectronics. Hashtags #LSM6DSOXTR #STMicroelectronics #IMU #MotionSensor #Accelerometer #Gyroscope #SensorFusion #MachineLearningCore #EmbeddedSystems #WearableElectronics #IndustrialAutomation #IoT #SmartDevices #MEMS #CommonPartsLibrary

Multi-Band CAT-M and NB-loT Module The SIM7080G is Multi-Band CAT-M and NB-IoT module solution in a SMT type . It has strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I2C etc. The module provides much flexibility and ease of integration for customer's application. It is designed for applications that need low latency, Low throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for M2M applications, such as metering, asset tracking, remote monitoring , E-health etc.. LTE Cat-M1 and NB-IoT Dual Mode Supports both LTE Cat-M1 (eMTC) and NB-IoT communication technologies. Complies with 3GPP Release 14 standards. Global Multi-Band Support Covers a wide range of global LTE frequency bands for worldwide deployment. Ultra-Low Power Operation Supports Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX). Enables battery lifetimes of up to 10 years in low-duty-cycle applications. Integrated GNSS Positioning Supports GNSS navigation capabilities including GPS and other satellite systems for location-based applications. Rich Peripheral Interfaces UART USB GPIO SPI I²C ADC PCM/I²S SIM card interface Comprehensive Internet Protocol Support TCP/IP UDP HTTP/HTTPS FTP MQTT CoAP LwM2M TLS/DTLS security protocols Firmware Update Support FOTA (Firmware Over-The-Air) USB firmware upgrade capability. Compact SMT Package 77-pin LCC+LGA package Dimensions: 17.6 mm × 15.7 mm × 2.3 mm Compatible footprint with the SIM868 module family. Industrial Operating Temperature Operating range: −40°C to +85°C. #Module #RF-Transceiver

USB-A (USB TYPE-A) USB 2.0 Receptacle Connector 4 Position Through Hole, Right Angle The ADS1256IDBT is a high-precision, low-noise, 24-bit analog-to-digital converter manufactured by Texas Instruments. It is designed for high-resolution measurement applications requiring exceptional accuracy, low drift, and programmable data rates. The device integrates a low-noise programmable gain amplifier, a precision delta-sigma ADC core, and a flexible multiplexer that supports multiple differential or single-ended analog inputs. The converter is optimized for industrial process control, sensor measurement, weigh scales, data acquisition systems, temperature monitoring, and portable instrumentation. Its integrated digital filtering and selectable gain settings enable direct interfacing with low-level sensors such as strain gauges, thermocouples, RTDs, and bridge sensors without requiring extensive external signal conditioning. The ADS1256IDBT supports SPI-compatible serial communication and operates with low power consumption while maintaining excellent dynamic performance and high effective resolution. The device provides programmable output data rates suitable for both low-speed precision measurements and higher-speed acquisition systems. Device Features 24-bit delta-sigma analog-to-digital converter Low-noise programmable gain amplifier Eight single-ended or four differential analog input channels Programmable gain settings from 1 to 64 Programmable data output rates SPI-compatible serial interface Integrated digital filter for noise reduction Low offset drift and gain drift Internal oscillator support Sensor burnout detection capability Self-calibration and system calibration functions Low power operation Wide analog supply voltage range Excellent 50 Hz and 60 Hz rejection performance Electrical Characteristics Resolution of 24 bits Maximum data rate up to 30 kSPS Differential input architecture Input multiplexer for multi-channel acquisition Low RMS noise performance High common-mode rejection ratio High power-supply rejection ratio Programmable gain amplifier integrated on-chip Internal reference support with external reference capability Interface and Control SPI-compatible digital communication interface Configurable control registers Read and write register functionality Synchronization and standby control support Hardware reset capability Interrupt and data-ready signaling support Package Information Manufacturer package designation: DBT Package type: TSSOP Surface-mount device Fine-pitch lead configuration Industrial temperature grade device Applications Precision data acquisition systems Industrial automation and control Weigh scales and bridge sensors Temperature measurement systems Pressure sensing applications Portable instrumentation Medical instrumentation Laboratory measurement equipment Energy monitoring systems Process monitoring and control Manufacturer Information Manufacturer: Texas Instruments Manufacturer Part Number: ADS1256IDBT Product Category: Precision Analog-to-Digital Converter RoHS compliant device #commonpartslibrary #integratedcircuit #analog #adc #deltasigma #precisionadc #sensorinterface #dataacquisition #industrialautomation #instrumentation #signalconditioning #texasinstruments #spiinterface #mixedsignal #measurementsystems

The FSA2567 is a bi-directional, low-power, dual double-pole, double-throw (4PDT) analog switch targeted at dual SIM card multiplexing. It is optimized for switching the WLAN-SIM data and control signals and dedicates one channel as a supply-source switch.

Data collection for TinyML app

TVS SMBJ12A-HRA SMB_L4.3-W3.6-LS5.4-R-RD LCSC Part Number: C1977456 JLCPCB Part Class: Extended Part Manufactured by Littelfuse(美国力特) Description: SMBJ-HRA Series high-reliability transient voltage suppressor (TVS) diode, surface-mount surge protection device designed to protect sensitive electronic circuits from lightning-induced and other transient overvoltage events. 600W peak pulse power capability (10/1000µs waveform), low clamping voltage, fast response time (<1ps), low leakage current (<1µA above 12V), IEC 61000-4-2 ESD protection, IEC 61000-4-4 EFT protection, operating temperature range -65°C to +150°C, SMB package, suitable for power, data, communication and industrial protection applications. Search Keywords: SMBJ-HRA, SMBJ HRA, High Reliability TVS Diode, SMB TVS Diode, 600W TVS, Transient Voltage Suppressor, Surge Protection Diode, Unidirectional TVS, Bidirectional TVS, IEC61000-4-2 TVS, IEC61000-4-4 TVS, Lightning Protection Diode, SMB Package TVS, High Reliability Protection Diode Hashtags: #SMBJHRA #TVSDiode #TransientVoltageSuppressor #SurgeProtection #SMBPackage #600WTVS #ESDProtection #EFTProtection #LightningProtection #UnidirectionalTVS #BidirectionalTVS #HighReliabilityTVS #CircuitProtection #OvervoltageProtection #SMBJSeries

SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory