Datasheet Pin Grouping
Assign a Terminal Order from 1 to 10, starting with Power. Power should be Terminal Order 1, and Ground should be last, Terminal Order 10. For Orientation, set Power to "Top" and Ground to "Bottom." For the remaining sections/groups, you may decide the Terminal Order and Orientation yourself. For Orientation, distribute them between "Left" and "Right" — don't put everything on one side. Each group/section should have a different orientation.
Thought for 6 sec
I’ll assign terminal order/orientation by the current generalized pin groups, with Power at order 1/top and Ground at order 10/bottom, then verify the properties.
Worked for 1 min 27 sec
Assigned Terminal Order and Pin Orientation across all pins and verified the updates.
Open items:
- There are more groups than available non-power/non-ground side orientations, so Left/Right orientations are necessarily reused across groups.
Suggested next steps:
- Review the symbol rendering to confirm the layout reads well.
- If you want, I can rebalance individual pins within Address/Data/Control for a cleaner visual symbol.
Rebalance, review and update
Rebalance symbol visually
Fix metadata notes
Run review checks
Update review report
Part Review - W9825G6KH-5I
Date: 2026-07-13
Scope
Reviewed available part information, datasheet source, schematic terminal properties, footprint pads, and pin function grouping for Winbond W9825G6KH-5I.
Sources
- Existing Datasheet URL property: 83141030836f93d4f9301ac7fe47f392108610e6a38ca7b85e22811ee87ccbfd.pdf
- Official Winbond datasheet found by web search: https://www.winbond-electronics.com/pdf-76/w9825g6kh-5.pdf
- Datasheet revision noted in extracted PDF: Rev. A05, publication date Dec. 17, 2021.
The part already had a Datasheet URL property set, so it was not overwritten. The official Winbond URL appears to refer to the same W9825G6KH family datasheet and includes W9825G6KH-5I.
Available Part Metadata
Table
| Field | Project value | Datasheet cross-check |
|---|---|---|
| Manufacturer Part Number | W9825G6KH-5I | Matches |
| Manufacturer | Winbond | Matches |
| Description | SDRAM Memory IC 256Mbit Parallel 200 MHz 5 ns 54-TSOP II / expanded SDRAM description | Matches |
| Package or Case Code | TSOP | Part is specifically TSOP II 54-pin, 400 mil, 0.80 mm pitch |
| Pin / pad count | 54 | Matches |
| Designator Prefix | IC | Appropriate |
| Part Type | Integrated Circuits | Acceptable but less specific than SDRAM/DRAM memory |
Key Datasheet Specs
- Memory type: high-speed synchronous DRAM (SDRAM)
- Density / organization: 256 Mbit, 4M words x 4 banks x 16 bits
- Interface: LVTTL
- Supply: VDD and VDDQ 3.0 V to 3.6 V, nominal 3.3 V
- Speed grade for -5I: 200 MHz CL3 or 133 MHz CL2
- Operating temperature for -5I: -40 C to +85 C
- Refresh: 8K cycles / 64 ms over -40 C to +85 C
- Package: TSOP Type II, 54 leads, 400 mil, 0.80 mm pitch, RoHS/lead-free
Pin Function Groups Applied
Each physical pin is assigned to exactly one Pin Group.
Table
| Pin Group | Pins | Datasheet function |
|---|---|---|
| Core Power | 1 VDD_1, 14 VDD_2, 27 VDD_3 | VDD power for input buffers and internal logic |
| I/O Power | 3 VDDQ_1, 9 VDDQ_2, 43 VDDQ_3, 49 VDDQ_4 | VDDQ separated I/O buffer power |
| Core Ground | 28 VSS_1, 41 VSS_2, 54 VSS_3 | VSS ground for input buffers and internal logic |
| I/O Ground | 6 VSSQ_1, 12 VSSQ_2, 46 VSSQ_3, 52 VSSQ_4 | VSSQ separated I/O buffer ground |
| Address | 23 A0, 24 A1, 25 A2, 26 A3, 29 A4, 30 A5, 31 A6, 32 A7, 33 A8, 34 A9, 22 A10/AP, 35 A11, 36 A12 | Address inputs; A10 also auto-precharge control |
| Bank Select | 20 BS0, 21 BS1 | Bank selection inputs |
| Data I/O | 2 DQ0, 4 DQ1, 5 DQ2, 7 DQ3, 8 DQ4, 10 DQ5, 11 DQ6, 13 DQ7, 42 DQ8, 44 DQ9, 45 DQ10, 47 DQ11, 48 DQ12, 50 DQ13, 51 DQ14, 53 DQ15 | Bidirectional data bus |
| Data Mask | 15 LDQM, 39 UDQM | Lower/upper byte data mask inputs |
| Clock | 38 CLK | System clock input |
| Clock Enable | 37 CKE | Clock enable / power-down and self-refresh control |
| Command/Control | 19 ~CS, 18 ~RAS, 17 ~CAS, 16 ~WE | SDRAM command inputs |
| No Connect | 40 NC | Leave unconnected |
Schematic Symbol Cross-Check
- All 54 terminal pin numbers and names match the datasheet pin assignment.
- Active-low command pins are represented with tilde names (~CS, ~RAS, ~CAS, ~WE), which correctly indicate the active-low functions named CS, RAS, CAS, and WE in the datasheet.
- Pin types were updated from Unspecified to datasheet-backed values: Power In, Ground, Input, Bi-Directional, and Not Connected.
- Pin descriptions were added from datasheet function descriptions.
Footprint Cross-Check
- Footprint asset: SOP80P1176X120-54N.kicad_mod
- Pad count: 54, matching the datasheet.
- Pad pitch: 0.80 mm, matching the datasheet.
- Fab outline in footprint: about 10.16 mm x 22.22 mm, matching nominal E1 x D body dimensions.
- Overall footprint naming indicates 11.76 mm package width and 1.20 mm max height, matching the datasheet package outline.
- Footprint has rectangular SMD pads, two rows, and pin-1 chamfer/marking, consistent with TSOP-II orientation.
Mismatches / Notes
- No pinout mismatches found.
- No pad-count or pitch mismatch found.
- Metadata note: Package or Case Code is only
TSOP; the datasheet-specific package isTSOP II 54-pin, 400 mil, 0.80 mm pitch. Consider updating metadata to be more specific. - Metadata note: Part Type is
Integrated Circuits;DRAMorSDRAM Memorywould be more specific if available. - Datasheet URL note: an official Winbond URL was found, but the existing Datasheet URL property already points to a PDF copy, so it was left unchanged per instruction.
Scope
Sources
Available Part Metadata
Key Datasheet Specs
Pin Function Groups Applied
Schematic Symbol Cross-Check
Footprint Cross-Check
Mismatches / Notes