Footprint Fix


Fix this: Library footprint is defective: the imported 'Silk Shapes' artwork resolves on the Top copper layer, blocking DGX pin access. Routing flags DIODE, GND, IMON, and TMR unrouteable on every instance. Package metadata is also wrong ('TO');
I’ll inspect the footprint nodes and package metadata, remove or relayer the copper-blocking artwork, then verify pad access and report the defective library part.
The copper-blocking artwork is disabled and the package family is corrected to TSSOP; I’m verifying the source footprint state now.
Fixed the source footprint:
  • Disabled the defective Silk Shapes artwork resolving on Top copper, clearing access to DIODE, GND, IMON, and TMR.
  • Corrected package metadata from TO to TSSOP, the closest supported family for TI’s DGX VSSOP package.
  • Verified both changes in the footprint.
  • Filed an internal library-quality report for the import/layer defect.

3D view of the PCB of TPS48110AQDGXRQ1

TPS48110AQDGXRQ1