Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, obtain the official Toshiba datasheet if needed, update the Datasheet property, then verify the symbol, footprint, and pin descriptions against it.
Audit complete. The existing Datasheet property already points to Toshiba’s official document endpoint, so no update was required; the symbol pinout and 2.54SOP4/11-5H1S footprint match the datasheet.
Key specs: 200 V off-state, 200 mA on-state, 1 mA max trigger current, 8 Ω max on-resistance, 1500 Vrms isolation, −40°C to +85°C, 4-pin SMD. Only metadata gaps found: pins lack explicit descriptions/electrical types, and package, mount, pin count, and ratings are not populated as separate formal properties.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
Photorelay with a 1-Form-A (normally open) MOSFET output, designed for isolated solid-state switching applications. It features a 200 V OFF-state output voltage, 200 mA ON-state current, 1 mA maximum trigger LED current, 8 Ω maximum ON-state resistance, 1500 Vrms minimum isolation voltage, and is housed in a 4-pin SOP (2.54SOP4) package.