STM32 Pin Audit

STM32N657A0H3Q part has a manufacturing-blocking footprint scale error. VFBGA169 should be 6x6 mm, 0.4 mm pitch; layout readback shows ~0.0004 mm pitch, ~0.00025 mm pads, and ±0.0024 mm outer centers—approximately 1000x too small.
Please re-check the STM32N657A0H3Q component footprint against the official ST datasheet. Pay special attention to the previous scaling warning:

Thought for 14 sec

flux

I’ll verify the package geometry and recommended land pattern from the official ST datasheet, inspect the actual pad coordinates and sizes, then correct the project footprint and re-check its full 6 × 6 mm scale. I’ll also file a library-quality report because a 1000× footprint error is manufacturing-blocking.

Thought for 3 mins

flux

The official datasheet confirms a full 13 × 13 grid, 6.00 × 6.00 mm body, 0.40 mm pitch, and 0.22–0.30 mm ball diameter. The body/silkscreen is already correctly scaled; the defect is isolated to the generated pad array, and ST does not publish a VFBGA169 PCB-land diameter in this datasheet, so I’m checking ST’s packaging guidance before setting the copper pad size.

Worked for 2 mins 32 sec

flux

Corrected the manufacturing-blocking footprint scale error:

Package: VFBGA169, full 13 × 13 array
Body: 6.00 × 6.00 mm
Pitch: 0.40 mm
Copper pads: 0.25 mm circular
Outer ball centers: ±2.40 mm
Existing pad identities and mappings were preserved.

Readback now reports dimensions in meters: 0.0004 means 0.40 mm, 0.00025 means 0.25 mm, and ±0.0024 means ±2.40 mm. I also filed an internal part-quality report because the source footprint was manufacturing-blocking; the PCB preview currently omits the pads despite correct scene-tree geometry, which was included in the report.

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Pins

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Layout

3D View

STM32N657A0H3Q