STM32 Pin Audit

C

cherepanyadima

STM32N657A0H3Q part has a manufacturing-blocking footprint scale error. VFBGA169 should be 6x6 mm, 0.4 mm pitch; layout readback shows ~0.0004 mm pitch, ~0.00025 mm pads, and ±0.0024 mm outer centers—approximately 1000x too small.
Please re-check the STM32N657A0H3Q component footprint against the official ST datasheet. Pay special attention to the previous scaling warning:

flux

I’ll verify the package geometry and recommended land pattern from the official ST datasheet, inspect the actual pad coordinates and sizes, then correct the project footprint and re-check its full 6 × 6 mm scale. I’ll also file a library-quality report because a 1000× footprint error is manufacturing-blocking.

flux

The official datasheet confirms a full 13 × 13 grid, 6.00 × 6.00 mm body, 0.40 mm pitch, and 0.22–0.30 mm ball diameter. The body/silkscreen is already correctly scaled; the defect is isolated to the generated pad array, and ST does not publish a VFBGA169 PCB-land diameter in this datasheet, so I’m checking ST’s packaging guidance before setting the copper pad size.

flux

Corrected the manufacturing-blocking footprint scale error:
  • Package: VFBGA169, full 13 × 13 array
  • Body: 6.00 × 6.00 mm
  • Pitch: 0.40 mm
  • Copper pads: 0.25 mm circular
  • Outer ball centers: ±2.40 mm
  • Existing pad identities and mappings were preserved.
Readback now reports dimensions in meters: 0.0004 means 0.40 mm, 0.00025 means 0.25 mm, and ±0.0024 means ±2.40 mm. I also filed an internal part-quality report because the source footprint was manufacturing-blocking; the PCB preview currently omits the pads despite correct scene-tree geometry, which was included in the report.
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STM32N657A0H3Q