I’ll apply this to the current MPN, STM32C031K6T6. I’ll preserve every pin number and mapping, remove Pin Group, assign datasheet-based sections/types/orientations/orders, and rebalance the symbol with power first and ground last.
Updated the official datasheet URL and reorganized all 32 symbol pins without changing names, numbers, or mappings. Pins are balanced 16/16 left/right, Power is first, Ground last, and all Pin Group properties were removed.
The Part Datasheet Audit contains the full findings. Critical issue: the LQFP32 footprint appears scaled approximately 1000× too small; incorrect Logic/AND classification and missing package metadata were also flagged. An internal part-quality report was filed.
STM32C031K6T6 temperature code 6: -40 °C to +85 °C ambient, +105 °C maximum junction
12-bit ADC, up to 19 external + 2 internal channels for the K6 device
1 x I2C Fast-mode Plus, 1 x SPI / I2S, 2 x USART
Advanced-control timer, four general-purpose 16-bit timers, two watchdogs, SysTick
SWD debug
Package: 32-pin LQFP, 7 x 7 mm body, 0.80 mm pitch, 9 x 9 mm lead span
Metadata audit
Table
Field
Current state
Datasheet cross-check
Status
MPN
STM32C031K6T6
Exact match
Pass
Manufacturer
STMicroelectronics
Exact match
Pass
Pin count
32
K = 32 pins
Pass
Datasheet URL
Official ST PDF set
Correct
Pass
Description
STM32C031K6T6 only
Should describe the Cortex-M0+ MCU and principal memory/peripherals
Incomplete
Part Type
Integrated Circuits
Broadly valid
Pass
IC subtype
Logic
Device is a microcontroller, not a logic gate
Mismatch
Logic Function
AND
Not applicable to this MCU
Mismatch
Package property
Not explicitly set
Should state LQFP32, 7 x 7 mm, 0.80 mm pitch
Missing
Symbol style
Parametric v1
Appropriate for terminal organization
Pass
Symbol and pin audit
All 32 physical pin numbers remain present exactly once and match the LQFP32 column of datasheet Table 12. No pins were renamed, renumbered, replaced, or remapped.
The symbol terminals were reorganized into Power, Clock, Reset, GPIO Port A, GPIO Port B, GPIO Port C, and Ground sections. Terminal orders are unique from 1 through 32, with Power first and Ground last. Multi-pin sections are evenly split between left and right; the complete symbol is balanced 16 left / 16 right. Pin Group was removed from every terminal as requested.
Pin types and descriptions are now populated from the datasheet. Power is Power In, ground is Ground, and multiplexed GPIO pins are Bi-Directional. No unresolved pin functions remain.
Naming observations
The following existing terminal names are non-canonical concatenations but their physical numbers and functions match the datasheet:
PC14-OSCX_INPC14 -> datasheet name PC14-OSCX_IN (PC14), pin 2
PC15-OSCX_OUTPC15 -> datasheet name PC15-OSCX_OUT (PC15), pin 3
PA11PA9 -> datasheet name PA11 [PA9], pin 22
PA12PA10 -> datasheet name PA12 [PA10], pin 23
They were intentionally not renamed because the requested constraint prohibited changing pin names or mappings. Their Pin Description fields now explain the oscillator/remap functions.
Footprint audit
The footprint topology is consistent with an LQFP32: 32 perimeter pads, eight per side, and the pad sequence corresponds to the symbol pin numbers. The footprint asset and 3D model are labeled LQFP32_7X7_STM.
However, the persisted computed geometry is approximately 1000 times too small:
Current pad pitch appears about 0.0008 mm; datasheet pitch is 0.80 mm.
Current pad size appears about 0.000508 x 0.0014732 mm; the intended imported values appear to be 0.508 x 1.4732 mm.
Current body/pad extents are expressed around 0.004-0.005 mm from center instead of approximately 4-5 mm.
The datasheet footprint example specifies 0.80 mm pitch, 0.50 mm pad width, 1.20 mm pad length, 6.10 mm inner span, 9.70 mm outer span, and a 7.30 mm courtyard/body-related dimension. The current footprint must not be used for PCB fabrication until its scale is corrected and reverified.
Final mismatch list
Critical
Footprint geometry is scaled approximately 1000x too small. This is fabrication-blocking.
Metadata
IC subtype is incorrectly classified as Logic.
Logic Function is incorrectly set to AND.
Description is too generic and omits the MCU function/specification summary.
Explicit package/case metadata is missing.
Non-critical naming
Four terminal names use concatenated formatting rather than the datasheet notation; pin numbers and mappings are correct, and descriptions now disambiguate them.
Recommended corrections
Rebuild or rescale the LQFP32 footprint to the official ST dimensions and verify pin-1 orientation, 0.80 mm pitch, pad dimensions, body outline, courtyard, and 3D model alignment.
Change the IC subtype/classification from Logic to Microcontroller and remove the AND logic function metadata.
Add package metadata: LQFP32, 7 x 7 mm body, 0.80 mm pitch.
Expand the description to identify the 48 MHz Cortex-M0+ MCU, 32 KB Flash, 12 KB SRAM, ADC, timers, and communication interfaces.
Optionally normalize the four concatenated terminal names in a separate change only if pin-name changes are approved.