Audit complete. The datasheet URL was already the official onsemi PDF, and the six-pin mapping is correct; key issues are incorrect package metadata (TO vs SC-88), unspecified pin types/descriptions, incorrect AND-function classification, and a critical apparent 1000× footprint scaling error. I filed an internal part-quality report and documented full specs and findings in NC7WZ07P6X Part Audit.
I’ll correct the source footprint geometry from the official SC-88 land pattern, then export/read back the manufacturing data to confirm the pad sizes and pitch numerically.
Repaired the SC-88 footprint to the official onsemi land pattern and verified the Gerber export:
Pads: 0.80 × 0.40 mm
Row center spacing: 2.00 mm
Pin pitch: 0.65 mm
Overall copper span: 2.80 × 1.70 mm
The apparent 1000× scale issue was a meter-versus-millimeter display interpretation; exported dimensions are now correct. A fresh Gerber package was generated and is available above.
The part identity and six-pin electrical mapping match the official onsemi datasheet, and the official datasheet URL is already present. However, the package metadata is incorrect, pin descriptions/types are not populated, the logic-function metadata is incorrect, and the footprint's computed geometry appears scaled 1000x too small despite the embedded KiCad source containing plausible SC-88 dimensions.
Source
Manufacturer: onsemi (property currently says ON Semiconductor; acceptable legacy naming)
SC-88, case 419B-02; commonly cross-listed as SC-70-6 / SOT-363
Use SC-88 as the manufacturer package
Datasheet URL
Official onsemi PDF already set
Correct; no update needed
Part type
Integrated Circuit / Logic
Correct
Logic function metadata
AND
Incorrect; this is a dual non-inverting buffer with open-drain outputs
Description
Dual non-inverting open-drain buffer; 1.65-5.5 V
Functionally correct overall
Pinout Cross-Check
Table
Pin
Datasheet name
Datasheet function
Current symbol terminal
Result
1
A1
Input
A1
Match
2
GND
Ground
GND
Match
3
A2
Input
A2
Match
4
Y2
Open-drain output
Y2
Match
5
VCC
Supply voltage
VCC
Match
6
Y1
Open-drain output
Y1
Match
Symbol issues
Every terminal has Pin Type: Unspecified; expected types are Input for A1/A2, Ground/Power for GND, Power for VCC, and open-drain Output for Y1/Y2.
Human-readable Pin Description fields are absent.
The terminal numbering and names are correct.
The left-input/right-output symbol organization is electrically sensible.
Footprint Cross-Check
Datasheet package
Package: SC-88, case 419B-02
Nominal body: 2.00 mm x 1.25 mm
Body limits: D = 1.80-2.20 mm; E = 1.15-1.35 mm
Pitch: 0.65 mm
Lead width: 0.15-0.30 mm
Lead length: 0.10-0.30 mm
Maximum package height: 0.90 mm (from package title)
Embedded footprint source
The embedded SOT65P210X110-6N.kicad_mod uses:
Six rectangular SMD pads
0.65 mm row pitch
Pad size 0.40 mm x 1.20 mm
Pad row centers at x = +/-0.95 mm
Fabrication body outline 1.25 mm x 2.00 mm
Pin-1 chamfer/marking
Those source dimensions are plausible for an SC-88 land pattern and the body outline matches the nominal package.
Critical computed-geometry mismatch
Flux's computed pad and shape data reports the same dimensions divided by 1000, for example:
Pad center x = +/-0.00095 mm instead of +/-0.95 mm
Pad size = 0.0004 mm x 0.0012 mm instead of 0.40 mm x 1.20 mm
Fabrication outline approximately 0.00125 mm x 0.002 mm instead of 1.25 mm x 2.00 mm
If the computed values are what manufacturing/export uses, the footprint is unusable. This appears to be a footprint import/unit-scaling defect and requires correction or confirmation in the PCB editor/export pipeline before use.
The datasheet package outline does not provide a recommended solder land pattern, so pad dimensions cannot be declared an exact manufacturer-land-pattern match from this datasheet alone. They are geometrically plausible for SC-88.
Key Electrical Specifications
Function: two independent non-inverting buffers, open-drain outputs
Logic behavior: input LOW drives output LOW; input HIGH releases output to high impedance
VCC operating range: 1.65 V to 5.5 V
Data retention supply: 1.5 V to 5.5 V
Inputs tolerate up to 5.5 V independent of VCC
Inputs and outputs are high impedance with VCC = 0 V
Output sink capability: 24 mA at VCC = 3.0 V with VOL max 0.55 V; 32 mA at VCC = 4.5 V with VOL max 0.55 V
Typical tPZL: 2.9 ns at 3.3 V and 2.3 ns at 5.0 V under datasheet test conditions
Typical tPLZ: 2.1 ns at 3.3 V and 1.4 ns at 5.0 V
Input leakage: up to +/-1 uA over -40 to +85 C
Power-off leakage: up to 10 uA over -40 to +85 C
Quiescent supply current: up to 10 uA over -40 to +85 C
Absolute maximum VCC, VIN, VOUT: -0.5 V to 6.5 V
Absolute maximum DC output current: +/-50 mA
Ambient characterization range in DC/AC tables: -40 C to +85 C
Top marking: Z07
Packing: 3000 units, tape and reel
Pb-free, halogen-free/BFR-free, RoHS compliant
Mismatches and Severity
Critical — footprint computed geometry appears 1000x too small. Confirm/fix before PCB use or manufacturing export.
Major — Package or Case Code = TO is wrong. It should identify SC-88 (case 419B-02), commonly SC-70-6/SOT-363.
Major — all symbol pin types are unspecified. This weakens ERC and fails to describe open-drain outputs and power pins.
Moderate — pin descriptions are absent. Populate each pin from the datasheet.
Moderate — logic-function metadata says AND. Correct classification is dual non-inverting buffer with open-drain outputs.
Minor — indexed package value SOT is overly broad. Prefer the exact manufacturer package.
Minor — description says outputs can sink up to 32 mA without immediately tying that figure to 4.5 V VCC. The 3.0 V rated point is 24 mA.
Recommended Corrections
Change Package or Case Code from TO to SC-88 (Case 419B-02) or the platform's canonical SC-88 value.
Change logic function from AND to Buffer / Non-Inverting Open-Drain Buffer.
Set pin types and descriptions according to the pin table above.
Investigate and repair the footprint unit scaling; verify actual exported Gerber pad dimensions with a measurement before release.