Part Audit and Datasheet Review

flux

Read the attached instructions and applied them by updating the project document with the full grouped Terminal Order table using the current renamed terminals.
Open items:
  • None for the terminal-order request.
  • Short check in the document reports: 94/94 OK terminals, 0 rename needed, 0 uncertain.
Suggested next step:
  1. Review ME310G1-W1 Part Audit and Terminal Order Table and publish/update the part if it looks good.
cherepanyadima

cherepanyadima

Read the file and follow all instructions.
pasted-text-1783019761465.txt

flux

I’ll read the attached file and apply its instructions to the current part project.

flux

Read the attached file and applied its terminal-order instructions to the current ME310G1-W1 part.
Open items:
  • None for this instruction set.
  • The project currently has duplicate ME310G1-W1 Terminal Order Table documents, so I refreshed both entries.
Suggested next step:
  1. Optionally remove/merge the duplicate terminal-order document to keep one source of truth.
Merge docs and review
Merge duplicate docs
Rerun part review
Verify pin orientations
Check footprint export

Refine this doc
Ask about this doc
ME310G1-W1 Part Audit
Source documents
Concise part description
LTE Cat M1/NB2 cellular IoT module with integrated GNSS, global band support, USB/UART/SPI/SIM interfaces, and compact 94-pad LGA package.
Current part metadata reviewed
  • MPN: ME310G1-W1
  • Manufacturer: Telit Wireless Solutions
  • Designator prefix: IC
  • Published as Flux part: yes
  • Part UID: e24ed41c-a572-4d45-a5cc-91ffdfb5df48
  • Existing description was replaced with the concise datasheet-based description above.
  • Datasheet URL was missing and has been added using the official Telit-hosted product brief URL.
Key datasheet specs
  • Technology: LTE UE Cat M1 / NB2, 3GPP Release 14
  • Variant market: Worldwide
  • LTE bands: B1, B2, B3, B4, B5, B8, B8_US, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B71, B85
  • Output power: LTE 21 dBm, Power Class 5, for ME310G1-W1
  • GNSS: embedded GPS, GLONASS, BeiDou, Galileo
  • Data rates: LTE-M uplink up to 1 Mbps, downlink up to 588 kbps; NB2 uplink up to 160 kbps, downlink up to 120 kbps
  • Interfaces: 6 GPIO, 1.8 V SIM, USB 2.0 HS, UART, SPI, I2C, digital audio, ADC, DAC/PWM
  • Supply: nominal 3.8 Vdc; operating 3.2–4.2 V; extended 2.6–4.5 V
  • Temperature: -40 °C to +85 °C
  • Package/body: 13.1 mm × 14.3 mm × 2.6 mm, 94-pad LGA
Symbol / pinout cross-check
The symbol contains 94 terminal pads, matching the datasheet 94-pad LGA count. Pad-coordinate mapping is mostly consistent with the hardware design guide.
Mismatches / items to fix
  1. Pin descriptions/types are mostly missing: all inspected terminals have Pin Type: Unspecified and no useful pin descriptions. These should be populated from the hardware design guide, especially for power, RF, SIM, USB, UART, SPI, GPIO, reserved, and ground pads.
  2. Reserved/alternate-function labels need cleanup:
    • G1 is labeled RES_4, but datasheet lists ATC1 / MIPI_CLK for HW 1.0, reserved only on HW 0.0.
    • H2 is labeled RES_6, but datasheet lists ATV, reserved only on HW 0.0.
    • J1 is labeled RES_7, but datasheet lists ATC2 / MIPI_DATA for HW 1.0, reserved only on HW 0.0.
  3. RF antenna naming should be clearer:
    • A5 is CELLMAIN; datasheet uses CELL_MAIN_ANTENNA.
    • E19 is GNSS; datasheet uses GNSS_ANTENNA.
  4. Minor naming normalization recommended:
    • FORCED_USB__BOOT has a double underscore; datasheet uses FORCED_USB_BOOT.
    • C105/RTS0_ includes a trailing underscore; datasheet uses RTS0 / C105.
    • UART names are acceptable but inconsistent in order: datasheet uses TXD0/C103, RXD0/C104, RTS0/C105, CTS0/C106.
  5. Reserved pads are present and connected as terminals, but should have explicit Reserved / DNC descriptions and pin type metadata to prevent accidental use.
Footprint cross-check
  • Current PCB footprint contains 94 pad nodes, matching the datasheet pin count.
  • The layout data exposed to the audit lists pad nodes but does not expose enough pad geometry details in the returned view to fully verify copper pad size, solder-mask openings, pitch, or body outline against the Telit land pattern.
  • Datasheet/hardware guide requirements to verify or implement: NSMD pads, PCB pads 1:1 with module pads, 1.2 mm pitch, 0.8 mm solder-resist openings per W1 figure, no through-holes in pad, no exposed vias/microvias within 0.3 mm around pads unless same signal, ENIG finish recommended.
Overall result
  • Part identity, manufacturer, pin count, and general package class are consistent with ME310G1-W1.
  • Main risk is metadata quality: symbol pin descriptions/types are incomplete and several alternate-function/reserved pins are mislabeled or over-simplified.
  • Footprint pad count is correct, but geometry still needs a detailed mechanical land-pattern verification pass before release/manufacturing use.

  • Source documents

  • Concise part description

  • Current part metadata reviewed

  • Key datasheet specs

  • Symbol / pinout cross-check

  • Mismatches / items to fix

  • Footprint cross-check

  • Overall result

Documents

Assets

ME310G1-W1

ME310G1W1.kicad_modFootprint

ME310G1-W1

ME310G1-W1 Symbol.svgDefault
image6.png

image6.png

image6Thumbnail
ME310G1-W1

ME310G1-W1

ME310G1-W1.stp3D Model

ME310G1-W1

ME310G1-W1 thumbnail
LTE Cat M1/NB2 cellular IoT module from Telit xE310 family, 3GPP Release 14 compliant, supporting low-power PSM/eDRX operation, enhanced coverage, global LTE bands, and 2G fallback for asset tracking, smart metering, industrial sensors, healthcare, and other low-data IoT applications.

Properties

ME310G1-W1

LTE Cat M1/NB2

Telit Wireless Solutions

Integrated Circuit

telit.com/wp-content/uploads/2024/11/TC_ME310G1_Product_Brief.pdf

IC

parametric-v1

Pricing & Availability

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Controls