MCP9601 Part Review

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MCP9601-E/MX Part Review

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Date: 2026-07-23 Current project: silicon-yard/mcp9601-emx

flux

Completed the datasheet-backed review and saved the full findings in MCP9601-E/MX Part Review.
Key findings: the symbol pin numbers/functions match the datasheet, and the 21 terminals are correct for 20 leads + EP. Issues flagged: package metadata/description incorrectly mention SSOP, part classification looks wrong, pin types/descriptions are missing, and the footprint perimeter pads do not match Microchip’s recommended land pattern.
A

adrian95

Please fix this, based from this flag issue:
MCP9601-E/MX library metadata reports packagecasecode as 20-SSOP and description also says 20-lead SSOP, but Microchip datasheet says MX is 20-lead MQFN/VQFN 5x5x1.0mm.

flux

Fixed the flagged metadata:
  • Package or Case Code: 20-VQFN
  • Description: Removed the incorrect SSOP reference and updated it to 20-lead MQFN/VQFN, 5 × 5 × 1.0 mm, 0.65 mm pitch, exposed pad, per the Microchip datasheet.
A

adrian95

thanks

flux

You’re welcome.
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MCP9601-E/MX Part Review
Date: 2026-07-23
Sources Reviewed
  • Current project: silicon-yard/mcp9601-emx
  • Project Datasheet URL property: https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/91ff02822566b655e25879e8320603e58e7410eabadbd86b5a11d2072e20f085.pdf
  • Official Microchip product page: https://www.microchip.com/en-us/product/MCP9601
  • Official current Microchip datasheet found by web search: https://ww1.microchip.com/downloads/aemDocuments/documents/MSLD/ProductDocuments/MCP960X-Data-Sheet-20005426.pdf
  • Flux library indexed datasheet URL: https://ww1.microchip.com/downloads/en/DeviceDoc/MCP960X-L0X-RL0X-Data-Sheet-20005426F.pdf
The part already had a Datasheet URL set, so no Datasheet property update was performed. The existing project URL is a Flux-hosted uploaded PDF; the official Microchip PDF URL above is the preferred source if the property should point directly to the manufacturer.
Current Part Information Observed

Table

FieldCurrent / indexed valueDatasheet-backed resultStatus
MPNMCP9601-E/MXMCP9601-E/MXOK
ManufacturerMicrochipMicrochipOK
Project descriptionBoard Mount Temperature SensorsThermocouple EMF-to-temperature converter / thermocouple digital temperature sensorBroad but acceptable; could be more specific
Library/search descriptionIncludes Thermocouple to Digital Converter... 20-MQFN (5x5) but also says in a 20-lead SSOP packageMX = More Thin Plastic Quad Flat, MQFN, 20-Lead; 5 mm × 5 mm × 1.0 mmMismatch: SSOP wording is wrong
Terminal count / pads2120 perimeter leads + exposed pad EP = 21 terminalsOK
Package / case codeLibrary index reports 20-SSOP20-lead MQFN/VQFN, 5 mm × 5 mm × 1.0 mm, 0.65 mm pitch, exposed padMismatch
Part type / subtypeIntegrated Circuits / Logic; logicFunction = ANDTemperature sensor / thermocouple EMF-to-temperature converterMismatch
LifecycleActiveMicrochip product page: In ProductionOK
Key Datasheet Specifications

Table

SpecificationValue
FunctionThermocouple EMF-to-temperature converter with cold-junction compensation and I²C interface
Supported thermocouplesK, J, T, N, E, S, B, R
Supply voltage2.7 V to 5.5 V operating; 6.0 V absolute maximum VDD
Input/output pin absolute maxGND - 0.3 V to 6.0 V
Operating temperature-40°C to +125°C
Storage temperature-65°C to +150°C
Junction temperature max+150°C
Hot-junction accuracy±1.5°C max over TA = 0°C to +85°C; ±3.0°C max over TA = -40°C to +125°C
Cold-junction accuracy±1.0°C max over TA = 0°C to +85°C; ±2.0°C max over TA = -40°C to +125°C
Temperature resolution±0.0625°C at maximum resolution
Conversion time320 ms at 18-bit, 80 ms at 16-bit, 20 ms at 14-bit, 5 ms at 12-bit
I²C clock10 kHz to 100 kHz
Current draw0.3 mA typ / 0.5 mA max I²C inactive; 1.5 mA typ / 2.5 mA max active or during calculation; 2 µA typ / 5 µA max shutdown
Alert outputsAlert 1-4, OC Alert, SC Alert are active-high push-pull outputs
SDABidirectional serial data; requires pull-up resistor
MQFN thermal resistanceθJA = 38.8°C/W
Package20-lead MQFN/VQFN, 5 mm × 5 mm × 1.0 mm, 0.65 mm pitch, exposed pad
Symbol / Pin Cross-Check
The symbol exposes 21 terminals and the observed pin-number-to-name mapping matches the datasheet Table 3-1.

Table

PinCurrent terminalDatasheet functionStatus / note
1GND_1GND, electrical groundOK
2VIN+Thermocouple positive terminal inputOK
3GND_2GND, electrical groundOK
4VIN-Thermocouple negative terminal inputOK
5GND_3GND, electrical groundOK
6VSENSEThermocouple open/short-circuit detection inputOK
7SC_ALERTThermocouple short-circuit alert outputOK
8VDDPowerOK
9OC_ALERTThermocouple open-circuit alert outputOK
10GND_4GND, not electrical ground; must be tied to groundOK, but description should distinguish this from electrical GND pins
11ALERT_1Alert Output 1OK
12ALERT_2Alert Output 2OK
13GND_5GND, electrical groundOK
14ALERT_3Alert Output 3OK
15ALERT_4Alert Output 4OK
16ADDRI²C device address selection voltage inputOK
17GND_6GND, electrical groundOK
18GND_7GND, not electrical ground; must be tied to groundOK, but description should distinguish this from electrical GND pins
19SCLI²C clock inputOK
20SDAI²C data input/outputOK
21EPExposed thermal pad; must be connected to GNDOK
Symbol metadata issues
  • Every terminal currently has Pin Type: Unspecified.
  • No terminal has a populated Pin Description property.
  • Recommended pin types/descriptions should be added from the datasheet:
    • GND and EP: Ground / power return; EP must connect to GND.
    • VDD: Power.
    • VIN+, VIN-: Analog thermocouple inputs.
    • VSENSE: Input.
    • SC_ALERT, OC_ALERT, ALERT_1..ALERT_4: Push-pull outputs.
    • ADDR: Input.
    • SCL: Input.
    • SDA: Bidirectional I/O; requires pull-up.
Footprint Cross-Check
Current footprint asset: QFN65P500X500X100-21N-D.kicad_mod.

Table

FeatureCurrent footprintDatasheet / Microchip recommended land patternStatus
Package familyQFN/MQFN-style footprint20-lead MQFN/VQFNOK
Body outline5 mm × 5 mm fab outline5 mm × 5 mm bodyOK
Height in name1.00 mm0.90 min / 0.95 typ / 1.00 maxOK
Pitch0.65 mm0.65 mm BSCOK
Perimeter pad count2020 leadsOK
Exposed pad3.35 mm × 3.35 mm pad 21Recommended center pad C1/C2 = 3.35 mmOK
Perimeter pad land size0.35 mm × 0.85 mmRecommended X1/Y1 = 0.40 mm × 0.55 mmMismatch
Thermal viasNone presentDatasheet lists optional thermal via diameter 0.30 mm and pitch 1.00 mm; vias should be filled/tented if usedNot required, but note for thermal/layout quality
Pin-1 markerPresentPin-1 index requiredOK
The footprint matches the package outline, pitch, exposed-pad size, and pad count, but the perimeter pad dimensions do not match Microchip’s recommended land pattern. This should be reviewed before using the footprint for fabrication.
Mismatches / Issues to Fix
  1. Package metadata is wrong: library/indexed package case code is 20-SSOP, but MCP9601-E/MX is 20-lead MQFN/VQFN, 5 mm × 5 mm × 1.0 mm.
  2. Description is internally inconsistent: it correctly says 20-MQFN (5x5) in one place, but incorrectly says 20-lead SSOP package later.
  3. Part classification is wrong: Logic / AND classification does not match a thermocouple temperature converter IC.
  4. Terminal metadata is incomplete: all pins have Pin Type: Unspecified and no Pin Description; the symbol names/pin numbers are correct, but ERC/reuse quality would improve by filling these fields.
  5. Footprint land pattern mismatch: peripheral pads are 0.35 mm × 0.85 mm while the datasheet recommended land pattern reports 0.40 mm × 0.55 mm.
  6. Datasheet source hygiene: the project has a Datasheet URL, but it points to a Flux-hosted uploaded PDF rather than Microchip’s official URL. This is not a blocker, but the official URL is preferable.
  1. Update package metadata to 20-MQFN / 20-lead MQFN/VQFN (5x5x1.0mm, 0.65mm pitch, exposed pad).
  2. Remove all SSOP wording from the description.
  3. Reclassify the part as a temperature sensor / thermocouple EMF-to-temperature converter, not a logic AND IC.
  4. Populate Pin Type and Pin Description for all terminals from Table 3-1.
  5. Decide whether to revise the footprint perimeter pads to Microchip’s recommended 0.40 mm × 0.55 mm land pattern or keep the current IPC/library footprint after manufacturing review.
  6. Optionally update the Datasheet URL property to the official Microchip PDF URL.

  • Sources Reviewed

  • Current Part Information Observed

  • Key Datasheet Specifications

  • Symbol / Pin Cross-Check

  • Symbol metadata issues

  • Footprint Cross-Check

  • Mismatches / Issues to Fix

  • Recommended Next Actions