MCP9601 Part Review

flux

Yes — based on the facts you listed, that sounds like a valid set of findings.
Correct to flag
  1. package_case_code: 20-SSOP is wrong
    • For MCP9601-E/MX, the MX suffix corresponds to the 20-lead MQFN/VQFN, 5 × 5 × 1.0 mm, 0.65 mm pitch, exposed pad package.
    • So a package case code of 20-SSOP is inconsistent with the ordering code and datasheet.
  2. Description is wrong / internally inconsistent
    • If the description says both:
      • “20-MQFN 5×5”, and
      • “20-lead SSOP package”
    • then it should be flagged. The SSOP wording is incorrect for the E/MX variant and could cause downstream footprint/package confusion.
  3. Footprint exposed pad appears correct
    • Footprint asset: QFN65P500X500X100-21N-D
    • 21 terminals likely means 20 perimeter leads + 1 exposed pad, which is appropriate.
    • EP size 3.35 × 3.35 mm matches the datasheet extraction, so that part sounds correct.
  4. Peripheral pad land dimensions do not match Microchip recommended land pattern
    • Current footprint peripheral pads: 0.35 × 0.85 mm
    • Datasheet-recommended land pattern: X1 = 0.40 mm, Y1 = 0.55 mm
    • Pitch: 0.65 mm, which matches.
    • But the pad dimensions differ materially:
      • Width: 0.35 mm vs recommended 0.40 mm
      • Length: 0.85 mm vs recommended 0.55 mm
    So yes, it is reasonable to flag the footprint’s peripheral land dimensions as not matching the Microchip recommended land pattern, assuming the coordinate interpretation is consistent.
Probably not an issue
  1. terminal_count: 21 is likely correct
    • Although the package is “20-lead,” QFN/MQFN footprints commonly include the exposed thermal/ground pad as an additional terminal.
    • So 20 leads + exposed pad = 21 footprint terminals is expected.
  2. Symbol pin count / function mapping appears acceptable
    • If the symbol’s functional pins match Microchip datasheet Table 3-1, then the symbol mapping is likely correct.
    • The main issue is not the logical symbol, but the package metadata and land pattern geometry.
Summary judgment
Yes: flag package_case_code and the SSOP wording in the description as wrong for MCP9601-E/MX. Also flag the peripheral footprint pad dimensions as not matching Microchip’s recommended land pattern. Do not flag terminal_count: 21 merely because the package is called 20-lead; the extra terminal is presumably the exposed pad.

flux

I found several metadata/footprint issues: the pin map is mostly correct, but package metadata and land-pattern dimensions need attention. I’m saving the full audit in a project file now.
Created a project doc

MCP9601-E/MX Part Review

View Document
Date: 2026-07-23 Current project: silicon-yard/mcp9601-emx

flux

Completed the datasheet-backed review and saved the full findings in MCP9601-E/MX Part Review.
Key findings: the symbol pin numbers/functions match the datasheet, and the 21 terminals are correct for 20 leads + EP. Issues flagged: package metadata/description incorrectly mention SSOP, part classification looks wrong, pin types/descriptions are missing, and the footprint perimeter pads do not match Microchip’s recommended land pattern.
Fix metadata and pins
Update official datasheet
Correct footprint pads
Run part review
Sign up to send

Files

Pins

Symbol

Layout

Preview

GND_4
Pin Number
10
ALERT_1
Pin Number
11
GND_2
Pin Number
3
OC_ALERT
Pin Number
9
VIN+
Pin Number
2
SDA
Pin Number
20
EP
Pin Number
21
SCL
Pin Number
19
ALERT_4
Pin Number
15
GND_5
Pin Number
13
GND_7
Pin Number
18
ALERT_3
Pin Number
14
VDD
Pin Number
8
VSENSE
Pin Number
6
GND_3
Pin Number
5
ADDR
Pin Number
16
ALERT_2
Pin Number
12
SC_ALERT
Pin Number
7
GND_1
Pin Number
1
GND_6
Pin Number
17
VIN-
Pin Number
4
MCP9601-E/MX Part Review
Date: 2026-07-23
Sources Reviewed
  • Current project: silicon-yard/mcp9601-emx
  • Project Datasheet URL property: https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/91ff02822566b655e25879e8320603e58e7410eabadbd86b5a11d2072e20f085.pdf
  • Official Microchip product page: https://www.microchip.com/en-us/product/MCP9601
  • Official current Microchip datasheet found by web search: https://ww1.microchip.com/downloads/aemDocuments/documents/MSLD/ProductDocuments/MCP960X-Data-Sheet-20005426.pdf
  • Flux library indexed datasheet URL: https://ww1.microchip.com/downloads/en/DeviceDoc/MCP960X-L0X-RL0X-Data-Sheet-20005426F.pdf
The part already had a Datasheet URL set, so no Datasheet property update was performed. The existing project URL is a Flux-hosted uploaded PDF; the official Microchip PDF URL above is the preferred source if the property should point directly to the manufacturer.
Current Part Information Observed

Table

FieldCurrent / indexed valueDatasheet-backed resultStatus
MPNMCP9601-E/MXMCP9601-E/MXOK
ManufacturerMicrochipMicrochipOK
Project descriptionBoard Mount Temperature SensorsThermocouple EMF-to-temperature converter / thermocouple digital temperature sensorBroad but acceptable; could be more specific
Library/search descriptionIncludes Thermocouple to Digital Converter... 20-MQFN (5x5) but also says in a 20-lead SSOP packageMX = More Thin Plastic Quad Flat, MQFN, 20-Lead; 5 mm × 5 mm × 1.0 mmMismatch: SSOP wording is wrong
Terminal count / pads2120 perimeter leads + exposed pad EP = 21 terminalsOK
Package / case codeLibrary index reports 20-SSOP20-lead MQFN/VQFN, 5 mm × 5 mm × 1.0 mm, 0.65 mm pitch, exposed padMismatch
Part type / subtypeIntegrated Circuits / Logic; logicFunction = ANDTemperature sensor / thermocouple EMF-to-temperature converterMismatch
LifecycleActiveMicrochip product page: In ProductionOK
Key Datasheet Specifications

Table

SpecificationValue
FunctionThermocouple EMF-to-temperature converter with cold-junction compensation and I²C interface
Supported thermocouplesK, J, T, N, E, S, B, R
Supply voltage2.7 V to 5.5 V operating; 6.0 V absolute maximum VDD
Input/output pin absolute maxGND - 0.3 V to 6.0 V
Operating temperature-40°C to +125°C
Storage temperature-65°C to +150°C
Junction temperature max+150°C
Hot-junction accuracy±1.5°C max over TA = 0°C to +85°C; ±3.0°C max over TA = -40°C to +125°C
Cold-junction accuracy±1.0°C max over TA = 0°C to +85°C; ±2.0°C max over TA = -40°C to +125°C
Temperature resolution±0.0625°C at maximum resolution
Conversion time320 ms at 18-bit, 80 ms at 16-bit, 20 ms at 14-bit, 5 ms at 12-bit
I²C clock10 kHz to 100 kHz
Current draw0.3 mA typ / 0.5 mA max I²C inactive; 1.5 mA typ / 2.5 mA max active or during calculation; 2 µA typ / 5 µA max shutdown
Alert outputsAlert 1-4, OC Alert, SC Alert are active-high push-pull outputs
SDABidirectional serial data; requires pull-up resistor
MQFN thermal resistanceθJA = 38.8°C/W
Package20-lead MQFN/VQFN, 5 mm × 5 mm × 1.0 mm, 0.65 mm pitch, exposed pad
Symbol / Pin Cross-Check
The symbol exposes 21 terminals and the observed pin-number-to-name mapping matches the datasheet Table 3-1.

Table

PinCurrent terminalDatasheet functionStatus / note
1GND_1GND, electrical groundOK
2VIN+Thermocouple positive terminal inputOK
3GND_2GND, electrical groundOK
4VIN-Thermocouple negative terminal inputOK
5GND_3GND, electrical groundOK
6VSENSEThermocouple open/short-circuit detection inputOK
7SC_ALERTThermocouple short-circuit alert outputOK
8VDDPowerOK
9OC_ALERTThermocouple open-circuit alert outputOK
10GND_4GND, not electrical ground; must be tied to groundOK, but description should distinguish this from electrical GND pins
11ALERT_1Alert Output 1OK
12ALERT_2Alert Output 2OK
13GND_5GND, electrical groundOK
14ALERT_3Alert Output 3OK
15ALERT_4Alert Output 4OK
16ADDRI²C device address selection voltage inputOK
17GND_6GND, electrical groundOK
18GND_7GND, not electrical ground; must be tied to groundOK, but description should distinguish this from electrical GND pins
19SCLI²C clock inputOK
20SDAI²C data input/outputOK
21EPExposed thermal pad; must be connected to GNDOK
Symbol metadata issues
  • Every terminal currently has Pin Type: Unspecified.
  • No terminal has a populated Pin Description property.
  • Recommended pin types/descriptions should be added from the datasheet:
    • GND and EP: Ground / power return; EP must connect to GND.
    • VDD: Power.
    • VIN+, VIN-: Analog thermocouple inputs.
    • VSENSE: Input.
    • SC_ALERT, OC_ALERT, ALERT_1..ALERT_4: Push-pull outputs.
    • ADDR: Input.
    • SCL: Input.
    • SDA: Bidirectional I/O; requires pull-up.
Footprint Cross-Check
Current footprint asset: QFN65P500X500X100-21N-D.kicad_mod.

Table

FeatureCurrent footprintDatasheet / Microchip recommended land patternStatus
Package familyQFN/MQFN-style footprint20-lead MQFN/VQFNOK
Body outline5 mm × 5 mm fab outline5 mm × 5 mm bodyOK
Height in name1.00 mm0.90 min / 0.95 typ / 1.00 maxOK
Pitch0.65 mm0.65 mm BSCOK
Perimeter pad count2020 leadsOK
Exposed pad3.35 mm × 3.35 mm pad 21Recommended center pad C1/C2 = 3.35 mmOK
Perimeter pad land size0.35 mm × 0.85 mmRecommended X1/Y1 = 0.40 mm × 0.55 mmMismatch
Thermal viasNone presentDatasheet lists optional thermal via diameter 0.30 mm and pitch 1.00 mm; vias should be filled/tented if usedNot required, but note for thermal/layout quality
Pin-1 markerPresentPin-1 index requiredOK
The footprint matches the package outline, pitch, exposed-pad size, and pad count, but the perimeter pad dimensions do not match Microchip’s recommended land pattern. This should be reviewed before using the footprint for fabrication.
Mismatches / Issues to Fix
  1. Package metadata is wrong: library/indexed package case code is 20-SSOP, but MCP9601-E/MX is 20-lead MQFN/VQFN, 5 mm × 5 mm × 1.0 mm.
  2. Description is internally inconsistent: it correctly says 20-MQFN (5x5) in one place, but incorrectly says 20-lead SSOP package later.
  3. Part classification is wrong: Logic / AND classification does not match a thermocouple temperature converter IC.
  4. Terminal metadata is incomplete: all pins have Pin Type: Unspecified and no Pin Description; the symbol names/pin numbers are correct, but ERC/reuse quality would improve by filling these fields.
  5. Footprint land pattern mismatch: peripheral pads are 0.35 mm × 0.85 mm while the datasheet recommended land pattern reports 0.40 mm × 0.55 mm.
  6. Datasheet source hygiene: the project has a Datasheet URL, but it points to a Flux-hosted uploaded PDF rather than Microchip’s official URL. This is not a blocker, but the official URL is preferable.
  1. Update package metadata to 20-MQFN / 20-lead MQFN/VQFN (5x5x1.0mm, 0.65mm pitch, exposed pad).
  2. Remove all SSOP wording from the description.
  3. Reclassify the part as a temperature sensor / thermocouple EMF-to-temperature converter, not a logic AND IC.
  4. Populate Pin Type and Pin Description for all terminals from Table 3-1.
  5. Decide whether to revise the footprint perimeter pads to Microchip’s recommended 0.40 mm × 0.55 mm land pattern or keep the current IPC/library footprint after manufacturing review.
  6. Optionally update the Datasheet URL property to the official Microchip PDF URL.

  • Sources Reviewed

  • Current Part Information Observed

  • Key Datasheet Specifications

  • Symbol / Pin Cross-Check

  • Symbol metadata issues

  • Footprint Cross-Check

  • Mismatches / Issues to Fix

  • Recommended Next Actions