Part Audit Review

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, locate the official datasheet if needed, update the Datasheet property, then verify symbol pins and footprint geometry against the manufacturer documentation. I’ll record the detailed findings in a project report and summarize any critical mismatches here.
Created a project doc

MC33390D Part Audit

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The part is identifiable as MC33390D, an NXP/Freescale SAE J1850 Class B single-wire serial transceiver in an 8-lead narrow-body SOIC packag...
Audit complete. I added the official NXP datasheet, verified all eight pin names/numbers, and confirmed the SOIC-N footprint pitch and ordering.
Key issues: the footprint is incorrectly classified as through-hole despite using SMD pads; Package, Description, pin types, and pin descriptions are missing. I filed an internal part-quality report. Full findings: MC33390D Part Audit.
Fix metadata issues
Correct footprint attribute
Add pin metadata
Add part properties
Run full review
TX
Pin Number
7
4X/LOOP
Pin Number
6
RX
Pin Number
8
BUS
Pin Number
4
LOAD
Pin Number
3
GND
Pin Number
2
VBAT
Pin Number
5
*SLEEP
Pin Number
1

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MC33390D Part Audit
Result
The part is identifiable as MC33390D, an NXP/Freescale SAE J1850 Class B single-wire serial transceiver in an 8-lead narrow-body SOIC package. The missing Datasheet property was populated from the official NXP datasheet source:
Existing Part Information

Table


FieldExisting valueAudit
MPNMC33390DCorrect; corresponds to the D-suffix SOIC device
ManufacturerNXP USA Inc.Acceptable; datasheet is legacy Freescale, now NXP
Part typeIntegrated CircuitCorrect but generic
Pin count8Correct
Package propertyMissingMismatch/incomplete; should identify 8-SOICN / SOIC narrow body, package drawing 98ASB42564B
DescriptionMissingIncomplete; suggested: “SAE J1850 Class B single-wire serial transceiver, 10.4 kbps VPWM, 8-SOICN”
DatasheetPreviously missing; now populatedCorrect source used
Designator prefixUCorrect
LifecycleNot represented in propertiesNXP product page classifies the family as no longer manufactured
Symbol and Pin Audit
The symbol has eight terminals and the pin numbers and names match the datasheet exactly.

Table


PinSymbol nameDatasheet functionName/number auditMetadata audit
1*SLEEPLogic 1 enables; Logic 0 disables/sleepsFunctionally correct; asterisk conveys active-low convention but datasheet name is SLEEPPin Type is Unspecified; Pin Description absent
2GNDDevice groundCorrectPin Type should be power/ground; description absent
3LOADExternal pull-down connection for loss-of-ground protectionCorrectPin Type Unspecified; description absent
4BUSWaveshaped J1850 transmitter output and receiver inputCorrectPin Type should indicate bidirectional; description absent
5VBATDevice operating supplyCorrectPin Type should be power input; description absent
64X/LOOPTristate mode input: normal, 4X, or loopbackCorrectPin Type should be input; description absent
7TXMCU serial data input to transceiverCorrectPin Type should be input; description absent
8RXReceived serial data output to MCUCorrectPin Type should be output; description absent
Symbol findings
  • Pass: pin count, numbering, and functional pin names.
  • Incomplete: all terminal Pin Type values are Unspecified.
  • Incomplete: all terminal Pin Description fields are absent.
  • Minor naming difference: pin 1 is shown as *SLEEP; the datasheet table calls it SLEEP, while its behavior is active-low for sleep/disable. This is understandable but should be documented consistently.
Footprint Audit
The footprint asset is named F_MC33390D.kicad_mod, with value/model references indicating SO8. It contains eight SMD rectangular pads numbered 1 through 8.
Datasheet package
  • 8-lead SOIC narrow body / SOICN
  • Package drawing: 98ASB42564B
  • Lead pitch: 1.27 mm BSC
  • Body length: 4.80–5.00 mm
  • Body width: 3.80–4.00 mm
  • Overall lead span: 5.80–6.20 mm
  • Lead width: 0.33–0.51 mm
  • Datasheet does not provide a recommended PCB land pattern.
Footprint geometry observed
  • Pad pitch: 1.27 mm — matches datasheet.
  • Eight pads in standard SOIC numbering order — matches symbol/datasheet mapping.
  • Fab body outline is approximately 4.013 × 5.004 mm. This is essentially the expected narrow SOIC envelope, though the outline is marginally above the datasheet maximum by about 0.01 mm in each axis; this is negligible drafting tolerance rather than a solderability problem.
  • Pads are approximately 1.4605 × 0.5588 mm, with pad-center row spacing about 5.4737 mm. The datasheet has no land pattern, so these cannot be directly certified from this document; they are plausible standard SOIC lands.
  • Pin-1 markers are present.
Footprint mismatch
The KiCad footprint payload declares (attr through_hole) even though all eight pads are SMD. This is inconsistent and may affect assembly classification or export behavior. The pad geometry itself remains SMD.
3D Model
  • Model asset: SO8_FRE.step
  • Package family naming is consistent with SO-8.
  • A dimensional/model alignment check could not be fully certified from metadata alone; the footprint remains the manufacturing source of truth.
Key Electrical Specifications
  • Function: SAE J1850 Class B half-duplex single-wire serial transceiver
  • Nominal data rate: 10.4 kbps, VPWM
  • Full bus dynamics supply range: 9–16 V
  • Parametric electrical-characteristic supply range: 7–16 V
  • Communication can continue with reduced bus amplitude down to approximately 4.25 V VBAT
  • Absolute maximum VBAT: -0.3 to 40 V
  • MCU interface: standard 5 V CMOS
  • BUS waveshaped output: approximately 0–7 V
  • Operating ambient temperature: -40 to 125 °C
  • Sleep current: 65 µA max
  • BUS short-circuit current limiting and thermal shutdown included
  • External series diode required for reverse-battery protection
  • D-suffix ordering: MC33390D/DR2, 8-SOICN
  • Device family is legacy/no longer manufactured according to the current NXP product page
  1. Footprint classification: change the footprint attribute from through-hole to SMD.
  2. Package property: add 8-SOICN (SOIC narrow body), 98ASB42564B.
  3. Description: add a concise functional description.
  4. Pin descriptions: populate all eight descriptions from the datasheet table.
  5. Pin types: assign ground/power/input/output/bidirectional types as appropriate.
  6. Lifecycle metadata: mark the part as obsolete/no longer manufactured if the library supports lifecycle properties.
  7. Pin 1 naming: retain *SLEEP only if the asterisk convention is intentional; otherwise use SLEEP and explain active-low sleep behavior in the description.
Overall Assessment
The part is electrically mappable and the critical pin numbering is correct. The main manufacturing metadata risk is the erroneous through-hole footprint attribute. The remaining issues are incomplete metadata rather than wrong connectivity or pad numbering.
  • Result

  • Existing Part Information

  • Symbol and Pin Audit

  • Symbol findings

  • Footprint Audit

  • Datasheet package

  • Footprint geometry observed

  • Footprint mismatch

  • 3D Model

  • Key Electrical Specifications

  • Mismatches and Recommended Corrections

  • Overall Assessment

Assets

MC33390D

MC33390D

SO8_FRE.step3D Model
svg

MC33390D

MC33390D Symbol.svgDefault
image.png

image.png

imageThumbnail
kicad_mod

MC33390D

F_MC33390D.kicad_modFootprint

MC33390D

MC33390D thumbnail
MC33390D is an automotive SAE J1850 Class B single-wire serial transceiver supporting 10.4 kbps VPWM half-duplex communication, 9–16 V operation, and a standard 8-pin SOIC package.
Keywords: MC33390D, SAE J1850 transceiver, Class B serial interface, automotive bus, SOIC-8 MC33390

Properties

MC33390D

NXP USA Inc.

Integrated Circuit

U

parametric-v1

Pricing & Availability

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