Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the part metadata, locate the official datasheet if needed, update the Datasheet property, then verify symbol pins and footprint geometry against the manufacturer documentation. I’ll record the detailed findings in a project report and summarize any critical mismatches here.
Audit complete. I added the official NXP datasheet, verified all eight pin names/numbers, and confirmed the SOIC-N footprint pitch and ordering.
Key issues: the footprint is incorrectly classified as through-hole despite using SMD pads; Package, Description, pin types, and pin descriptions are missing. I filed an internal part-quality report. Full findings: MC33390D Part Audit.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
MC33390D is an automotive SAE J1850 Class B single-wire serial transceiver supporting 10.4 kbps VPWM half-duplex communication, 9–16 V operation, and a standard 8-pin SOIC package.
Keywords: MC33390D, SAE J1850 transceiver, Class B serial interface, automotive bus, SOIC-8
MC33390