LSM6DS3TR C Review

Worked for 39 sec

Updated and verified all pins.

Generalized groups: Power, Ground, Interface, Digital I/O, Other
Added/updated Section on every pin to exactly match its Pin Group
Kept the one-pin-one-group rule intact; no pin is assigned to multiple groups.

Assign a Terminal Order from 1 to 10, starting with Power. Power should be Terminal Order 1, and Ground should be last, Terminal Order 10. For Orientation, set Power to "Top" and Ground to "Bottom." For the remaining sections/groups, you may decide the Terminal Order and Orientation yourself. For Orientation, distribute them between "Left" and "Right" — don't put everything on one side. Each group/section should have a different orientation.

Thought for 7 sec

flux

I’ll assign terminal ordering and orientations by group, keeping Power at order 1/top and Ground at order 10/bottom, with the remaining groups split across left/right.

Worked for 1 min 20 sec

flux

Assigned and verified Terminal Order and Pin Orientation.

Power: order 1, orientation Top
Interface: order 2, orientation Left
Digital I/O: order 3, orientation Right
Other: order 9, orientation Right
Ground: order 10, orientation Bottom

Note: there are three remaining non-power/non-ground groups but only two allowed remaining orientations (Left/Right), so Other shares Right with Digital I/O while the left/right distribution requirement is still met.

Fix labels and review

Fix pin 1

Update footprint reference

Add MEMS keepout

Run part review

Files

Pins

Symbol

Layout

3D View

LSM6DS3TR-C Part Review

Scope

Reviewed project metadata, datasheet URL, schematic terminal definitions, terminal grouping, pin descriptions, footprint pads, and package information for the STMicroelectronics LSM6DS3TR-C part project.

Datasheet

Official datasheet property was already set: https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf
Source used for cross-check: STMicroelectronics LSM6DS3TR-C datasheet, DocID030071 Rev 3, May 2017.
ST MEMS LGA mounting guidance referenced for land-pattern recommendations: https://www.st.com/resource/en/technical_note/cd00134799-surface-mounting-guidelines-for-mems-sensors-in-an-lga-package-stmicroelectronics.pdf

Existing Part Metadata Reviewed

Manufacturer: STMicroelectronics
MPN: LSM6DS3TR-C
Part type: Sensors
Designator prefix: IC
Description: iNEMO inertial module, 3-axis accelerometer + 3-axis gyroscope
Published part UID: a031ce3c-c190-42aa-9345-a5a0ab3cc881
Terminals / pads: 14
Package: LGA-14 / LGA-14L, nominal 2.5 mm x 3.0 mm x 0.83/0.86 mm

Key Datasheet Specifications

Table

Parameter	Datasheet value
Function	6-axis IMU: 3-axis digital accelerometer + 3-axis digital gyroscope
Package	LGA-14L / LGA-14, 2.5 mm x 3.0 mm x 0.83 mm typ / 0.86 mm max
Supply VDD	1.71 V to 3.6 V, 1.8 V typical
Supply VDDIO	1.62 V to VDD + 0.1 V
Temperature	-40 degC to +85 degC
Interfaces	I2C, SPI 3-wire, SPI 4-wire; auxiliary I2C master / sensor hub in Mode 2
I2C address	0x6A when SDO/SA0 = GND; 0x6B when SDO/SA0 = VDD/VDDIO
I2C speed	Standard and Fast mode up to 400 kHz; external pull-ups required on SCL/SDA
SPI clock	Up to 10 MHz based on 100 ns minimum clock cycle
Accelerometer ranges	+/-2 g, +/-4 g, +/-8 g, +/-16 g
Gyroscope ranges	+/-125, +/-250/245, +/-500, +/-1000, +/-2000 dps
FIFO	8 KB
WHO_AM_I	0x6A
Recommended decoupling	100 nF ceramic on VDD and 100 nF ceramic on VDDIO, near pins

Applied Pin Grouping

Each physical pin is assigned to exactly one primary functional group. No pin is duplicated across groups.

Table

Group	Pins
Power	Pin 5 VDDIO; Pin 8 VDD
Ground	Pin 6 GND_1; Pin 7 GND_2
Host Interface	Pin 1 ADO/SA0; Pin 12 CS; Pin 13 SCL; Pin 14 SDA
Auxiliary Sensor Hub	Pin 2 SDX; Pin 3 SCX
Interrupts	Pin 4 INT1; Pin 9 INT2
No Connect	Pin 10 NC_1; Pin 11 NC_2

Datasheet Pin Table Cross-Check

Table

Pin	Datasheet name	Project terminal	Result
1	SDO/SA0	ADO/SA0	Mismatch: project label appears to be a typo; description now records correct SDO/SA0 function.
2	SDx	SDX	OK; capitalization differs only.
3	SCx	SCX	OK; capitalization differs only.
4	INT1	INT1	OK.
5	VDDIO	VDDIO	OK.
6	GND	GND_1	OK; suffix distinguishes duplicate ground pins.
7	GND	GND_2	OK; suffix distinguishes duplicate ground pins.
8	VDD	VDD	OK.
9	INT2	INT2	OK.
10	NC	NC_1	OK; suffix distinguishes duplicate NC pins.
11	NC	NC_2	OK; suffix distinguishes duplicate NC pins.
12	CS	CS	OK.
13	SCL	SCL	OK.
14	SDA	SDA	OK.

Footprint Cross-Check

Project footprint asset: LSM6DS3USTR.kicad_mod, description LGA-14(2.5x3x0.86).

Observed footprint pads:

14 rectangular SMD pads.
Nominal pad size in footprint: 0.250 mm x 0.475 mm.
Pad pitch/spacing follows 0.5 mm increments around the perimeter.
Body fab outline: 3.0 mm x 2.5 mm, matching the LGA-14 package outline.
3D model asset: LSM6DS3TR-C.stp.

Footprint assessment:

Pad count and nominal package outline match the LSM6DS3TR-C LGA-14 datasheet.
The footprint pad dimensions match the datasheet package land dimensions, but ST MEMS LGA mounting guidance recommends PCB lands about package land + 0.1 mm in length and width for this pad spacing. For 0.475 mm x 0.25 mm package pads, that guideline implies PCB lands around 0.575 mm x 0.35 mm, with solder-mask opening around 0.675 mm x 0.45 mm.
The imported footprint filename references LSM6DS3USTR rather than LSM6DS3TR-C. The LSM6DS3US family appears to use the same 14-LGA 2.5 mm x 3.0 mm mechanical package, but the file naming should be reviewed to avoid part-family confusion.
The footprint does not explicitly show ST MEMS top-layer keepout guidance under the sensor body. ST recommends avoiding vias/traces below MEMS LGA sensors on the top side and using symmetric pad routing.

Mismatches / Items to Flag

Pin 1 label mismatch: Project terminal is ADO/SA0; datasheet pin name is SDO/SA0. This should be renamed if exact datasheet pin naming is desired.
Footprint file name mismatch: Footprint asset is named LSM6DS3USTR.kicad_mod while the part is LSM6DS3TR-C. Mechanical compatibility appears plausible, but the asset name should be cleaned up or replaced with an LSM6DS3TR-C-specific footprint reference.
PCB land-pattern sizing risk: The footprint uses 0.250 mm x 0.475 mm pads, matching package land size. ST MEMS LGA mounting guidance recommends enlarged PCB lands around 0.35 mm x 0.575 mm for this pad spacing. This is a manufacturability/solder-joint reliability concern.
MEMS layout keepout not encoded: No explicit keepout under the sensor body was found in the footprint/layout rules. ST recommends no top-layer vias/traces under the sensor and symmetric routing to pads.
No part-review check details returned: Component review query returned no populated check categories, so the manual datasheet cross-check above is the authoritative review for this pass.

Recommended Next Fixes

Rename pin 1 from ADO/SA0 to SDO/SA0.
Replace or update the footprint asset name to reference LSM6DS3TR-C.
Consider resizing PCB pads to ST MEMS LGA recommended land dimensions and adding solder-mask openings per TN0018.
Add a top-layer keepout under the MEMS body if the platform footprint supports keepout geometry/rules.
Preserve the current functional grouping policy: one physical pin belongs to exactly one primary group.

Scope
Datasheet
Existing Part Metadata Reviewed
Key Datasheet Specifications
Applied Pin Grouping
Datasheet Pin Table Cross-Check
Footprint Cross-Check
Mismatches / Items to Flag
Recommended Next Fixes