Part Audit and Pin Grouping
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Make the functional group more general.
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Assign a Terminal Order from 1 to 10, starting with Power. Power should be Terminal Order 1, and Ground should be last, Terminal Order 10. For Orientation, set Power to "Top" and Ground to "Bottom." For the remaining sections/groups, you may decide the Terminal Order and Orientation yourself. For Orientation, distribute them between "Left" and "Right" — don't put everything on one side. Each group/section should have a different orientation.
Thought for 14 sec
I’ll consolidate the pins into broader groups, assign group-level order from Power = 1 through Ground = 10, and alternate the non-power groups between Left and Right while keeping Power Top and Ground Bottom.
Worked for 1 min 42 sec
Updated and verified all 15 pins:
- Power: order 1, Top
- Digital: order 3, Left
- Analog: order 5, Right
- Sensor: order 7, Left
- Other: order 8, Right
- Ground: order 10, Bottom
Each pin belongs to exactly one group, and every Section matches its Pin Group.
Fix metadata issues
Correct footprint geometry
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LMP91000SDX/NOPB Part Audit
Review scope
Reviewed the part identity and properties, official Texas Instruments datasheet, schematic symbol terminals, functional grouping, PCB footprint, and 3D asset.
Identity and metadata
Table
| Field | Current value | Assessment |
|---|---|---|
| Manufacturer part number | LMP91000SDX/NOPB | Matches TI orderable part |
| Manufacturer | Texas Instruments | Correct |
| Part type | Sensors | Acceptable, though Analog Front End / Sensor AFE would be more specific |
| Package | 14-WSON, TI package code NHL | Correct |
| Physical terminals | 14 perimeter pins plus exposed DAP/EP | Correct physical count: 15 PCB pads |
| Datasheet | https://www.ti.com/lit/ds/symlink/lmp91000.pdf | Updated to official TI Rev. I PDF |
| Lifecycle | Active | Confirmed on TI product page |
| Operating temperature | -40°C to +85°C | Correct |
Key specifications
- Configurable potentiostat analog front end for 2-electrode and 3-electrode electrochemical sensors.
- Supply range: 2.7 V to 5.25 V.
- Average supply current: less than 10 µA.
- Programmable TIA gains: 2.75 kΩ, 3.5 kΩ, 7 kΩ, 14 kΩ, 35 kΩ, 120 kΩ, and 350 kΩ.
- TIA gain accuracy: 5%.
- I²C-compatible interface; 7-bit address 0x48.
- Analog output drive current: 750 µA.
- Cell-conditioning current capability: up to 10 mA.
- Integrated temperature sensor available through VOUT.
- Package: 14-pin WSON, NHL, nominal 4.0 mm × 4.0 mm, 0.8 mm maximum height, 0.50 mm pitch.
Pinout cross-check
Pins 1 through 14 match the TI datasheet exactly:
Table
| Pin | Name | Datasheet function |
|---|---|---|
| 1 | DGND | Digital ground |
| 2 | MENB | Active-low module enable |
| 3 | SCL | I²C clock input |
| 4 | SDA | I²C bidirectional data |
| 5 | NC | Not internally connected |
| 6 | VDD | Supply voltage |
| 7 | AGND | Analog ground |
| 8 | VOUT | Analog output |
| 9 | C2 | External filter connection |
| 10 | C1 | External filter connection |
| 11 | VREF | Voltage-reference input |
| 12 | WE | Working-electrode drive/output |
| 13 | RE | Reference-electrode input |
| 14 | CE | Counter-electrode drive/output |
| DAP | EP in project, numbered 15 | Exposed pad; connect to AGND |
Symbol organization applied
Every physical terminal is assigned to exactly one group, with Section equal to Pin Group:
- Power: VDD
- Ground: DGND, AGND, EP/DAP
- Digital Interface: SCL, SDA
- Control: MENB
- Analog Output / Filter: VOUT, C2, C1
- Reference: VREF
- Electrochemical Cell: WE, RE, CE
- No Connect: NC
Mismatches and quality flags
1. Missing pin descriptions and electrical types
All terminals currently have Pin Type = Unspecified, and no Pin Description properties are populated. The names and numbers are correct, but this reduces symbol clarity and ERC quality. Recommended types are Ground for DGND/AGND/EP, Power for VDD, Input for MENB/SCL/VREF/RE, Bidirectional for SDA, Output for VOUT/WE/CE, and Passive or Not Connected for C1/C2/NC as appropriate to Flux's available type vocabulary.
2. Exposed-pad naming/numbering differs from TI
TI calls the exposed pad DAP and does not assign it a numbered lead in the pin table. The project calls it EP and maps it as terminal/pad 15. Numbering the exposed pad as 15 is a common EDA convention and is electrically usable, but the pin description must explicitly state Connect to AGND.
3. Footprint differs materially from TI's recommended land pattern
The project footprint is named
SON50P400X400X80-15N, which correctly represents a 0.50 mm-pitch, 4 mm × 4 mm WSON with 15 PCB pads. However, its computed geometry differs from the official TI NHL land pattern:Table
| Feature | Current project | TI recommended | Assessment |
|---|---|---|---|
| Perimeter pad size | 0.30 × 0.85 mm | 0.30 × 0.75 mm | Project pads are 0.10 mm longer |
| Perimeter pad center from X centerline | ±1.95 mm | ±1.80 mm | Project rows are 0.15 mm farther outward |
| Y pitch/positions | 0.50 mm; ±1.50/1.00/0.50/0 | Same | Matches |
| Exposed pad | 2.70 × 3.10 mm | 2.60 × 2.60 mm | Project EP is larger and non-square |
This is the main manufacturability risk. The footprint may be an IPC-derived alternative, but it is not a match to TI's published recommended land pattern. Before production, replace or override it with a datasheet-backed NHL0014B land pattern and use segmented/window-pane paste apertures on the exposed pad.
4. Footprint paste and mask settings not explicitly available in the audit output
The imported footprint's detailed paste aperture and solder-mask expansion values were not exposed by the available computed PCB rules. Because this is an exposed-pad WSON, stencil segmentation and paste coverage should be verified directly before manufacturing.
5. 3D model metadata
A STEP model is present and rotated 90° / 0° / 90°. No dimensional model fit was proven by this audit; manufacturing should rely on the footprint and TI package drawing rather than the render.
Overall result
- Identity, package family, pin count, and pins 1–14: Correct.
- Official datasheet link: Corrected.
- Functional pin grouping: Completed with no duplicated physical pins.
- Symbol metadata quality: Incomplete because electrical pin types and descriptions are unspecified.
- Footprint: Flagged for correction or rigorous validation because several dimensions do not match TI's recommended NHL land pattern.
Review scope
Identity and metadata
Key specifications
Pinout cross-check
Symbol organization applied
Mismatches and quality flags
1. Missing pin descriptions and electrical types
2. Exposed-pad naming/numbering differs from TI
3. Footprint differs materially from TI's recommended land pattern
4. Footprint paste and mask settings not explicitly available in the audit output
5. 3D model metadata
Overall result
