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adrian95

adrian95

Assign a Terminal Order from 1 to 10, starting with Power. Power should be Terminal Order 1, and Ground should be last, Terminal Order 10. For Orientation, set Power to "Top" and Ground to "Bottom." For the remaining sections/groups, you may decide the Terminal Order and Orientation yourself. For Orientation, distribute them between "Left" and "Right" — don't put everything on one side. Each group/section should have a different orientation.

flux

I’ll assign each functional group a consistent Terminal Order and Pin Orientation, with Power at order 1/top and Ground at order 10/bottom, then verify the metadata.

flux

Assigned Terminal Order and Pin Orientation across all terminal pins.
Mapping used:
  • 1 Top: Power Supply
  • 2 Left: Control
  • 3 Right: Status
  • 4 Left: USB
  • 5 Right: UART
  • 6 Left: USIM
  • 7 Right: ADC / I2C / PCM
  • 8 Left: SGMII
  • 9 Left/Right: SD Card, Wireless, Antenna, Reserved
  • 10 Bottom: Ground
Verified Power Supply is order 1/top and Ground is order 10/bottom.
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EC21AUVFA512STD Datasheet Review
Date: 2026-07-07
Reviewed Sources
Project Metadata Review

Table

FieldProject valueDatasheet cross-checkStatus
Manufacturer Part NumberEC21AUVFA512STDDatasheet covers EC21 series and EC21-AU / EC21-AUX variants; OCR note says EC21-AUV-related information was deleted in this v1.9 revision.Needs caution
ManufacturerQuectelDatasheet is Quectel EC21 Series Hardware Design.OK
Part TypeCellular ModuleLTE/UMTS/GSM wireless communication module.OK
Package or Case CodeModuleSMD module, 144 pins: 80 LCC + 64 LGA.OK but could be more specific
Pin count / padsProject has 132 schematic terminal components and 132 PCB padsDatasheet module has 144 physical pins, but pins 73-84 are explicitly marked as a keepout area that should not be designed in schematic or PCB decal.OK if intentional; document as 144 physical / 132 exposed pads
Datasheet propertySetExisting URL is usable. No update required.OK
Key Datasheet Specs
  • Cellular module series: LTE Cat 1 EC21 series.
  • Variant relevant to part naming: EC21-AU family; note that the exact AUV variant may not be fully described in this v1.9 datasheet because the OCR text states EC21-AUV-related information was deleted in this revision.
  • LTE bands for EC21-AU: FDD B1/B2/B3/B4/B5/B7/B8/B28; TDD B40.
  • WCDMA bands for EC21-AU: B1/B2/B5/B8.
  • GSM bands for EC21-AU: 850/900/1800/1900 MHz.
  • GNSS support listed for EC21-AU: GPS, GLONASS, BeiDou/COMPASS, Galileo, QZSS.
  • Supply voltage: 3.3 V min, 3.8 V typ, 4.3 V max on VBAT_BB and VBAT_RF.
  • Absolute maximum VBAT_RF/VBAT_BB: -0.3 V to 4.7 V.
  • Peak current: VBAT_BB up to 0.8 A; VBAT_RF up to 1.8 A; IVBAT peak current max 2.0 A during transmission slot.
  • USB_VBUS: 3.0 V min, 5.0 V typ, 5.25 V max; absolute max -0.3 V to 5.5 V.
  • Digital pins: absolute max -0.3 V to 2.3 V; most digital interfaces are 1.8 V domain unless otherwise noted.
  • USB 2.0 differential pair: 90 ohm differential impedance required.
  • Antenna interfaces: ANT_MAIN, ANT_DIV, ANT_GNSS are 50 ohm RF interfaces.
  • Mechanical size: 29.0 ±0.15 mm × 32.0 ±0.15 mm × 2.4 ±0.2 mm.
  • Weight: approximately 4.9 g.
  • Operating temperature: -35 °C to +75 °C; extended range -40 °C to +85 °C; storage -40 °C to +90 °C.
  • Package: SMD module with 144 pins total, including 80 LCC pins and 64 LGA pins.
Symbol / Terminal Cross-Check
The project represents the part as 132 terminal components. Pin names, pin numbers, and functional sections match the datasheet for the exposed pins reviewed. Examples:
  • Power: VBAT_RF pins 57/58; VBAT_BB pins 59/60; VDD_EXT pin 7; USIM_VDD pin 14; VDD_SDIO pin 34; USIM2_VDD pin 128.
  • USB: USB_DP pin 69, USB_DM pin 70, USB_VBUS pin 71.
  • Main UART: RI 62, DCD 63, CTS 64, RTS 65, DTR 66, TXD 67, RXD 68.
  • Debug UART: DBG_RXD 11, DBG_TXD 12.
  • USIM: USIM_GND 10, USIM_PRESENCE 13, USIM_VDD 14, USIM_DATA 15, USIM_CLK 16, USIM_RST 17.
  • SD Card: SD_INS_DET 23, SDC2_DATA3/2/1/0 pins 28/29/30/31, SDC2_CLK 32, SDC2_CMD 33, VDD_SDIO 34.
  • PCM: PCM_IN 24, PCM_OUT 25, PCM_SYNC 26, PCM_CLK 27.
  • I2C: I2C_SCL 41 and I2C_SDA 42, both open-drain.
  • SGMII: EPHY_RST_N 119, EPHY_INT_N 120, SGMII_MDATA 121, SGMII_MCLK 122, SGMII_TX_M/P 123/124, SGMII_RX_P/M 125/126, USIM2_VDD 128.
  • WLAN/Bluetooth: SDC1_DATA3/2/1/0 pins 129/130/131/132, SDC1_CLK 133, SDC1_CMD 134, WAKE_ON_WIRELESS 135, WLAN_EN 136, COEX_UART_RX 137, COEX_UART_TX 138, BT_EN 139, BT_RTS/TXD/RXD/CTS pins 37/38/39/40.
  • Antennas: ANT_DIV 35, ANT_GNSS 47, ANT_MAIN 49.
  • Control/status: WAKEUP_IN 1, AP_READY 2, W_DISABLE# 4, NET_MODE 5, NET_STATUS 6, STATUS 61, PWRKEY 21, RESET_N 20, USB_BOOT 115.
Reserved Pins / Pin Count Finding
Datasheet reserved pins: 3, 18, 43, 55, 73-84, 113, 114, 116, 117, 140-144.
Project includes reserved terminal entries for: 3, 18, 43, 55, 113, 114, 116, 117, 140, 141, 142, 143, 144.
Project intentionally omits pins 73-84. The datasheet explicitly says these pins should not be designed in the schematic or PCB decal and should serve as a keepout area. Therefore the 132 project pads are acceptable if the intent is to expose only solderable/designed pads. The project metadata or description should ideally say 144 physical pins; 132 exposed schematic/PCB pads; pins 73-84 are keepout / not designed.
Footprint / Mechanical Cross-Check
  • The project layout contains 132 pad nodes, consistent with omitting pins 73-84.
  • The footprint includes an associated STEP model reference.
  • The datasheet recommended footprint notes that the pin 73-84 area is a keepout and should not be designed, and recommends about 3 mm clearance between the module and nearby motherboard components for maintenance.
  • The layout inspection showed pad coordinates and sizes in very small numeric values while rule overrides show text placement in mm; this appears to be an internal unit/display convention. I did not flag it as a mismatch solely from the readout, but the footprint should still be visually/mechanically verified against Figure 46 before release.
Mismatches / Risks Flagged
  1. Variant documentation risk: The MPN contains AUV, but the available EC21 Series Hardware Design v1.9 OCR states EC21-AUV-related information was deleted in this revision. The datasheet covers EC21-AU and EC21-AUX family data, so electrical/mechanical information is likely applicable, but exact ordering-code / regional certification details for EC21AUVFA512STD should be confirmed from Quectel ordering documentation.
  2. Pin-count wording risk: Project context says Pads: 132, while datasheet says 144 physical pins. This is not necessarily wrong because pins 73-84 should not be designed, but the distinction should be documented in metadata.
  3. Footprint precision risk: The recommended footprint is figure-based in the datasheet. I confirmed pad count and keepout rule conceptually, but a final mechanical verification should compare every pad size/location and keepout against Figure 46 or an official CAD footprint.
  4. Description supply-voltage mismatch: The project description says 3.0 V to 3.6 V supply. Datasheet Table 43 / key features specify VBAT 3.3 V min, 3.8 V typ, 4.3 V max. This should be corrected in the description/properties if this project is meant to reflect the Quectel EC21 datasheet.
  • Update project description supply range from 3.0-3.6 V to 3.3-4.3 V, typical 3.8 V.
  • Add a metadata note or implementation detail: 144 physical pins; 132 designed pads; pins 73-84 are keepout / not in schematic or PCB decal per datasheet.
  • Obtain Quectel ordering-code documentation for EC21AUVFA512STD to confirm exact variant bands, GNSS, voice/data feature, and regulatory SKU details.
  • Perform a footprint-by-footprint measurement audit against Figure 46 or import/compare the official Quectel footprint if available.

  • Reviewed Sources

  • Project Metadata Review

  • Key Datasheet Specs

  • Symbol / Terminal Cross-Check

  • Reserved Pins / Pin Count Finding

  • Footprint / Mechanical Cross-Check

  • Mismatches / Risks Flagged

  • Recommended Follow-Up