Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems

2.4 GHz Wi-Fi® + Bluetooth® 5 SoC – High-performance dual-core Xtensa® LX7 wireless System-on-Chip (SoC) for IoT devices, smart home products, industrial automation, AIoT, wearable electronics, HMI systems, and embedded wireless applications. Operates at up to 240 MHz with 512 KB on-chip SRAM and supports external SPI Flash and PSRAM. Integrates Wi-Fi 802.11 b/g/n (2.4 GHz) and Bluetooth® 5 (LE) with Long Range and 2 Mbps PHY, delivering up to +21 dBm transmit power and 150 Mbps maximum Wi-Fi data rate. Features native USB 2.0 OTG, AI vector instructions for machine learning acceleration, 30 GPIOs, SPI, I²C, I²S, UART, RMT, LCD/Camera interface, TWAI® (CAN-compatible), PWM, ADC, capacitive touch sensing, AES-128/256, SHA, RSA, ECC, HMAC, Flash encryption, Secure Boot, and a True Random Number Generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +105°C temperature range, and is housed in a 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3 #WirelessSoC #WiFi #Bluetooth5 #DualCore #XtensaLX7 #USBOTG #AIoT #IoT #SecureBoot #FlashEncryption #EmbeddedSystems

WiFi Modules ESP32-S3-MINI-1-N4R2 BULETM-SMD_ESP32-S3-MINI-1-N8 LCSC Part Number: C3013941 JLCPCB Part Class: Extended Part Manufactured by ESPRESSIF Espressif ESP32-S3-MINI-1/1U Wi-Fi and Bluetooth LE MCU module based on ESP32-S3, dual-core 32-bit Xtensa LX7 processor up to 240MHz, supports 2.4GHz Wi-Fi and Bluetooth LE, 8MB Quad SPI flash, optional 2MB Quad SPI PSRAM, up to 80MHz SPI flash clock, integrated low-power co-processor, -40°C to +85°C operating temperature, compact SMD module for IoT, smart home, embedded systems and wearable electronics; ESP32-S3-MINI-1 includes PCB antenna, ESP32-S3-MINI-1U supports external antenna connector. Search Keywords: ESP32-S3-MINI-1, ESP32-S3-MINI-1U, ESP32-S3-MINI-1-N8, ESP32-S3-MINI-1-N4R2, ESP32-S3-MINI-1U-N8, ESP32-S3-MINI-1U-N4R2, Espressif ESP32-S3-MINI, ESP32-S3 WiFi Bluetooth module, ESP32-S3 BLE module, ESP32-S3 MCU module, ESP32-S3-MINI 8MB flash, ESP32-S3-MINI 2MB PSRAM, ESP32-S3-MINI PCB antenna, ESP32-S3-MINI external antenna, ESP32-S3-MINI-1U antenna connector, ESP32-S3 SMD module, ESP32-S3 IoT module, ESP32-S3-MINI datasheet Hashtags: #ESP32S3MINI1 #ESP32S3MINI1U #ESP32S3MINI1N8 #ESP32S3MINI1N4R2 #ESP32S3MINI1UN8 #ESP32S3MINI1UN4R2 #Espressif #ESP32S3 #ESP32Module #WiFiModule #BluetoothLEModule #BLEModule #MCUModule #IoTModule #SMDModule #PCBantenna #ExternalAntenna #XtensaLX7 #8MBFlash #2MBPSRAM