IS61C5128AL-10TLI
512K x 8 HIGH-SPEED CMOS STATIC RAM, 10ns, TSOP II-44 SRAM MEMORY TSOP*10.16x18.41mm*P0.8mm*... show more11 Uses
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IS61C5128AS-25TLI
512K x 8 HIGH-SPEED CMOS STATIC RAM, 25ns, TSOP II-32 SRAM MEMORY TSOP*21.0x10.2mm*P1.27mm*... show more0 Uses
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TSOP36238TT
Infrared remote receiver TSOP36238TT SENSOR-SMD_TSOP36238TR LCSC Part Number: C3151601 JLCPCB Part Class: Extended Part Vishay IR receiver module for remote control systems, integrated PIN photodiode, preamplifier, AGC circuit, band-pass filter and demodulator in one epoxy package, 2.0V to 5.5V supply voltage, low supply current, digital output for direct MCU connection, high immunity to ambient noise from lamps, LCD TV and Wi-Fi, optimized for long-burst IR remote control applications. Search Keywords: Vishay IR receiver module, Vishay remote control IR receiver, Vishay TSOP IR receiver, Vishay TSSP IR receiver, IR receiver module, infrared receiver module, IR remote receiver, demodulating IR receiver, PIN diode preamplifier IR receiver, IR receiver with AGC, long burst IR receiver, 38kHz IR receiver, 36kHz IR receiver, 40kHz IR receiver, 2.0V to 5.5V IR receiver, MCU IR receiver Hashtags: #VishayIRReceiver #VishayTSOP #VishayTSSP #IRReceiver #InfraredReceiver #RemoteControlReceiver #IRRemoteReceiver #DemodulatingIRReceiver #PINPhotodiode #PreamplifierIRReceiver #AGCIRReceiver #LongBurstIRReceiver #38kHzIRReceiver #36kHzIRReceiver #40kHzIRReceiver #MCUInfraredReceiver... show more26 Uses
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MT29F256G08AUCABH3-10ITZ:A
SLC NAND Flash Parallel/Serial 3.3V 256G-bit 32G x 8 100-Pin LBGA FLASH - NAND (SLC) Memory IC 256Gbit Parallel 100 MHz 100-LBGA (12x18) The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm). • Open NAND Flash Interface (ONFI) 2.2-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 8640 bytes (8192 + 448 bytes) – Block size: 128 pages (1024K + 56K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 32Gb: 4096 blocks; 64Gb: 8192 blocks; 128Gb: 16,384 blocks; 256Gb: 32,768 blocks • Synchronous I/O performance – Up to synchronous timing mode 5 – Clock rate: 10ns (DDR) – Read/write throughput per pin: 200 MT/s • Asynchronous I/O performance – Up to asynchronous timing mode 5 – tRC/tWC: 20ns (MIN) – Read/write throughput per pin: 50 MT/s • Array performance – Read page: 35µs (MAX) – Program page: 350µs (TYP) – Erase block: 1.5ms (TYP) • Operating Voltage Range – VCC: 2.7–3.6V – VCCQ: 1.7–1.95V, 2.7–3.6V • Command set: ONFI NAND Flash Protocol • Advanced Command Set – Program cache – Read cache sequential – Read cache random – One-time programmable (OTP) mode – Multi-plane commands – Multi-LUN operations – Read unique ID – Copyback • First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see Error Management (page 114). • RESET (FFh) required as first command after power-on • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous interface • Copyback operations supported within the plane from which data is read • Quality and reliability – Data retention: JESD47G compliant; see qualification report – Endurance: 60,000 PROGRAM/ERASE cycles • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC • Package – 52-pad LGA – 48-pin TSOP – 100-ball BGA – 132-ball BGA #Micron #NANDFlash #SLCNAND #FlashMemory #NonVolatileMemory #ONFI #EmbeddedSystems #IndustrialElectronics #DataStorage #MemoryIC #LBGA100 #HighReliability #MT29F256G08AUCABH310ITZA #MicronMemory #ParallelNANDFlash... show more0 Uses
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AS4C32M16SB-7TCN
SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32... show more8 Uses
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TSOP38238
Remote Receiver Sensor 38.0kHz 45m Through Hole This IR receiver series is optimized for long burst remote control systems in different environments. The customer can chose between different IC settings (AGC variants), to find the optimum solution for his application. The higher the AGC, the better noise is suppressed, but the lower the code compatibility. The devices contain a PIN diode and a preamplifier assembled on a lead frame. The epoxy package contains an IR filter. The demodulated output signal can be directly connected to a microprocessor for decoding. These components have not been qualified to automotive specifications. Individual IC settings to reach maximum performance • Immunity against noise (lamps, LCD TV, Wi-Fi) • Low supply current • Photo detector and preamplifier in one package • Supply voltage: 2.0 V to 5.5 V VS1838B #CommonPartsLibrary #Sensor #Transducer #Optical-Sensor #Photo-Detectors #Remote-Receiver #TSOP38238... show more190 Uses
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TSOP38238
Vishay TSOP382/TSOP384 IR receiver module for remote control systems, integrated PIN photodiode, preamplifier, AGC, band-pass filter and demodulator in one epoxy package, optimized for long-burst IR remote control signals, 2.0V to 5.5V supply voltage, low supply current, high immunity to ambient noise from lamps, LCD TVs and Wi-Fi, demodulated digital output for direct microcontroller connection, suitable for TVs, set-top boxes, consumer electronics and embedded IR control applications. Search Keywords: TSOP382, TSOP384, Vishay TSOP382, Vishay TSOP384, Vishay IR receiver module, IR remote receiver, infrared receiver module, demodulating IR receiver, remote control receiver, PIN photodiode preamplifier, AGC IR receiver, 38kHz IR receiver, 36kHz IR receiver, 40kHz IR receiver, TSOP38238, TSOP38438 TSOP38238 SOT-23-3 Hashtags: #TSOP382 #TSOP384 #VishayTSOP382 #VishayTSOP384 #VishayIRReceiver #IRReceiver #InfraredReceiver #RemoteControlReceiver #DemodulatingIRReceiver #PINPhotodiode #AGCReceiver #38kHzIRReceiver #36kHzIRReceiver #40kHzIRReceiver... show more4 Uses
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