IM72D128V01XTMA1
20 Hz ~ 19 kHz Digital, PDM Microphone MEMS (Silicon) 1.62 V ~ 3.6 V Omnidirectional (-36dB ±1dB @ 94dB SPL) Solder Pads #commonpartslibrary #microphone #audio... show more39 Uses
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SPG08P4HM4H-1
30 Hz ~ 10 kHz Digital, PDM Microphone MEMS (Silicon) Omnidirectional (-26dB ±1dB @ 94dB SPL) Solder Pads #commonpartslibrary #audio #microphone... show more0 Uses
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IM69D130V01XTSA1
20 Hz ~ 20 kHz Digital, PDM Microphone MEMS (Silicon) 1.62 V ~ 3.6 V Omnidirectional (-36dB ±1dB @ 94dB SPL) Solder Pads #commonpartslibrary #sensor #audiosensor #integratedcircuit... show more37 Uses
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ANNA-B112-01B
Bluetooth Low Energy 5.0 SiP module, nRF52832-based, 6.5 x 6.5 x 1.15 mm 52-pad package with optional internal or external antenna The ANNA-B112-01B is an ultra-compact, stand-alone Bluetooth® Low Energy (BLE) 5 module developed by u-blox. It is built around the Nordic nRF52832 SoC, which integrates a powerful Arm Cortex-M4 processor with FPU, RF circuitry, memory, and antenna in a single System-in-Package (SiP). This module is designed for industrial and IoT applications, offering a combination of high performance, low power consumption, and small size. It supports both host-controlled operation (AT commands via u-connectXpress) and standalone embedded applications (open CPU mode), giving designers flexibility in system architecture. 🔑 Key Features 🧠 Processing & Memory 64 MHz Arm Cortex-M4 CPU with FPU 512 KB Flash and 64 KB RAM Supports open CPU (run user firmware directly on module) 📡 Wireless Connectivity Bluetooth 5.0 (BLE) compliant Supports: GATT client & server Bluetooth mesh Simultaneous central + peripheral roles Data rate up to 2 Mbps 📶 RF & Antenna Operates at 2.4 GHz ISM band Integrated chip antenna Optional external antenna via antenna pin Range up to ~160 m (internal antenna) 🔌 Interfaces & Peripherals Communication interfaces: UART, SPI, I²C, I²S Additional features: ADC (12-bit) PWM, PDM Up to 25 GPIOs Supports NFC (for pairing / data) ⚙️ Software & Development Comes with u-connectXpress firmware: AT command interface Serial Port Service (SPS) Easy integration without deep BLE stack knowledge Supports development using: Nordic SDK Arm Mbed Supports FOTA (Firmware Over-The-Air updates) 🔋 Power & Electrical Supply voltage: 1.7V to 3.6V Optimized for low-power applications Sleep current as low as ~300 nA 📦 Physical Characteristics Ultra-compact size: 6.5 × 6.5 × 1.2 mm Package: 52-pin SMD module Operating temperature: –40°C to +85°C 🌍 Certifications Globally pre-certified (FCC, CE, etc.) Reduces time and cost for product certification... show more64 Uses
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IM69D130V01XTSA1
20 Hz ~ 20 kHz Digital, PDM Microphone MEMS (Silicon) 1.62 V ~ 3.6 V Omnidirectional (-36dB ±1dB @ 94dB SPL) Solder Pads #CommonPartsLibrary #Audio #MEMS #Microphone... show more56 Uses
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SPH0655LM4H-1
Digital, PDM Microphone MEMS (Silicon) Omnidirectional (-37dB ±1dB @ 94dB SPL) Solder Pads #CommonPartsLibrary #Audio #MEMS #Microphone... show more56 Uses
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IM69D130V01XTSA1
20 Hz ~ 20 kHz Digital, PDM Microphone MEMS (Silicon) 1.62 V ~ 3.6 V Omnidirectional (-36dB ±1dB @ 94dB SPL) Solder Pads The IM69D130V01XTSA1 is a high-performance digital MEMS microphone designed for applications requiring compact size, low power consumption, and reliable acoustic performance. The device integrates a MEMS sensing element with signal conditioning and digital output functionality within a surface-mount package suitable for automated assembly processes. The component is intended for use in voice-enabled systems, consumer electronics, industrial equipment, communication devices, and embedded audio applications where consistent sensitivity, low noise operation, and environmental robustness are required. The microphone supports digital audio interfacing and is optimized for far-field voice capture and speech recognition environments. The device construction is designed to provide stable operation under standard environmental and mechanical conditions. It is compatible with modern PCB manufacturing processes and supports integration into space-constrained electronic assemblies. Electrical and acoustic characteristics are engineered to maintain reliable performance across varying operating conditions. The component complies with standard electronic manufacturing and handling requirements for moisture sensitivity, electrostatic discharge protection, and reflow soldering compatibility. Proper PCB layout, grounding practices, and acoustic port alignment are recommended to achieve optimal system-level performance. #CommonPartsLibrary #Audio #MEMS #Microphone... show more36 Uses
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SPK0641HT4H-1
20 Hz ~ 20 kHz Digital, PDM Microphone MEMS (Silicon) 1.6 V ~ 3.6 V Omnidirectional (-26dB ±1dB @ 94dB SPL) Solder Pads #CommonPartsLibrary #Audio #MEMS #Microphone... show more45 Uses
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rk3566
BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign... show more5 Uses
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TAA3020IRTER
Audio 16 b, 20 b, 24 b, 32 b 768k I2C, I2S, TDM 20-WQFN (3x3) The TAA3020IRTER is a high-performance 2-channel audio analog-to-digital converter (ADC) from Texas Instruments, designed for professional and embedded audio applications. It supports up to two analog microphone/line inputs or four digital PDM microphone channels with simultaneous sampling. The device delivers excellent audio quality with a 104 dB dynamic range, supports sample rates up to 768 kHz, and integrates advanced audio processing features such as programmable gain, digital filters, automatic gain control (AGC), voice activity detection (VAD), and an integrated PLL. It communicates through an I²C control interface and supports I²S, TDM, and Left-Justified (LJ) digital audio formats, making it ideal for smart speakers, conferencing systems, IP cameras, and other high-performance audio acquisition systems. Key Features High-performance 2-channel audio ADC Supports 2 analog microphone/line inputs or 4 digital PDM microphone inputs 104 dB dynamic range (DR) and –95 dB THD+N Sampling rates from 8 kHz to 768 kHz Programmable microphone gain from 0 dB to 42 dB Digital volume control from –100 dB to +27 dB Integrated programmable HPF, biquad filters, and low-latency filter modes Built-in Automatic Gain Control (AGC) and Voice Activity Detection (VAD) Integrated audio PLL and programmable microphone bias supply Supports I²S, TDM, and Left-Justified (LJ) audio interfaces Configurable for 1.8 V or 3.3 V supply operation Available in a compact 20-pin WQFN (RTE) package Operating temperature range: –40°C to +105°C #AudioADC #TexasInstruments #TAA3020 #HighPerformanceADC #I2S #TDM #PDMMicrophone #AudioProcessing #AGC #VAD #EmbeddedAudio #ProfessionalAudio... show more0 Uses
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CMM-4737DT-26186-TR
100 Hz ~ 10 kHz Digital, PDM Microphone MEMS (Silicon) Omnidirectional () Solder Pads #CommonPartsLibrary #Audio #MEMS #Microphone... show more0 Uses
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SPW0690LM4H-1
20 Hz ~ 10 kHz Digital, PDM Microphone MEMS (Silicon) 1.65 V ~ 3.6 V Omnidirectional (-41dB ±1dB @ 94dB SPL) Solder Pads #CommonPartsLibrary #Audio #MEMS #Microphone... show more39 Uses
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CMM-4030DT-26354-TR
100 Hz ~ 10 kHz Digital, PDM Microphone MEMS (Silicon) 1.6 V ~ 3.6 V Omnidirectional (-26dB ±1dB @ 94dB SPL) Solder Pads #commonpartslibrary #audioproduct #microphone... show more0 Uses
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IM73D122V01XTMA1
Ultra-Low Noise Digital MEMS Microphone with PDM Output – High-performance omnidirectional MEMS microphone designed for voice assistants, smart speakers, conferencing systems, industrial voice interfaces, IoT devices, wearables, automotive applications, and embedded audio systems. Part of the Infineon XENSIV™ microphone family, it features a digital PDM output, 73 dB(A) signal-to-noise ratio (SNR), −26 dBFS sensitivity (±1 dB @ 94 dB SPL), and an acoustic overload point (AOP) of 122 dB SPL, delivering excellent speech intelligibility and high dynamic range. Operates from a 1.62 V to 3.6 V supply with 980 µA typical current consumption, supports a 20 Hz to 19 kHz frequency response, and includes multiple operating modes for power optimization. Features a bottom-port acoustic design, IP57 dust and water resistance, and AEC-Q103 qualification (on demand) for demanding environments. Housed in a compact 5-pad LLGA package (4.0 × 3.0 × 1.2 mm) and specified for operation over a −40°C to +85°C temperature range. #Infineon #IM73D122V01XTMA1 #XENSIV #MEMSMicrophone #DigitalMicrophone #PDM #VoiceInterface #SmartSpeaker #IoT #AudioProcessing #AECQ103 #EmbeddedSystems... show more10 Uses
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Seeed Studio XIAO nRF52840 Sense
Seeed Studio XIAO nRF52840 Sense is carrying Bluetooth 5.0 wireless capability and is able to operate with low power consumption. Featuring onboard IMU and PDM, it can be your best tool for embedded Machine Learning projects. #SeeedStudio #xiao... show more35 Uses
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XVF3800-QF60B-C
Voice Processor IC for far-field voice capture and audio processing, integrating AI, DSP, control, and I/O functions in a single device. It supports up to four PDM microphones, USB and I²S audio interfaces, operates with 3.3 V I/O, and is housed in a 60-pin QFN package, with integrated voice-processing functions including acoustic echo cancellation, beamforming, and post-processing. #XMOS #VoiceProcessor #AudioDSP #FarFieldVoice #PDMMicrophone #USBAudio #I2S #QFN60 #3V3IO #EmbeddedAudio... show more1 Use
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