Bus Switch 1 x 8:1 24-VQFN (4x4) # TCA9548ARGER Engineering Specifications **General Description** The TCA9548ARGER is a low-voltage I²C and SMBus switch manufactured by Texas Instruments. It is designed to expand and manage I²C communication networks by allowing a single master device to selectively communicate with multiple downstream buses through independent switching channels. The device functions as a bidirectional translating switch, enabling communication between devices operating at different voltage levels while maintaining protocol compatibility. Through software control, individual channels can be enabled or disabled, providing flexible bus segmentation, address conflict resolution, and system scalability. The TCA9548ARGER is widely used in embedded systems, industrial control equipment, data acquisition platforms, telecommunications hardware, server management systems, sensor networks, and Internet of Things applications where multiple I²C devices must be connected to a single controller. Its low-power CMOS architecture, integrated reset functionality, and hot-insertion support make it suitable for complex digital systems requiring reliable and efficient I²C bus management. **Engineering Specifications** **Manufacturer:** Texas Instruments **Manufacturer Part Number:** TCA9548ARGER **Component Type:** I²C bus switch and multiplexer **Technology:** Low-voltage CMOS **Interface Standard:** I²C and SMBus compatible **Switch Configuration:** Multiple downstream I²C channel selection **Channel Operation:** Software-controlled channel enable and disable **Communication Direction:** Bidirectional signal transmission **Voltage Translation Capability:** Supports communication between devices operating at different logic voltages **Bus Isolation Function:** Independent channel isolation for address conflict management **Control Method:** I²C command-based channel selection **Address Selection:** Configurable device addressing through hardware address pins **Power Supply Configuration:** Single-supply operation **Power Consumption:** Low-power operation suitable for embedded applications **Signal Integrity Features:** Low ON-state resistance and low propagation delay **Reset Function:** Dedicated hardware reset input **Hot Insertion Support:** Prevents bus disruption during device insertion and removal **Fail-Safe Characteristics:** Protection against unintended bus communication during power transitions **Bus Capacitance Management:** Improves communication reliability in large I²C networks **System Scalability:** Supports expansion of sensor, peripheral, and control-device networks **Electrostatic Protection:** Integrated ESD protection circuitry **Operating Temperature Range:** Industrial temperature range **Package Type:** VQFN surface-mount package **Mounting Style:** Surface mount technology **Package Construction:** Leadless thermally efficient package **Environmental Compliance:** RoHS compliant and lead-free **Reliability Features:** Designed for high-reliability industrial and embedded applications **Typical Applications** I²C bus expansion systems Sensor aggregation networks Industrial automation equipment Embedded controller platforms Server management systems Data acquisition hardware Telecommunications equipment Internet of Things devices Medical instrumentation Consumer electronics Robotics and automation systems Environmental monitoring devices Smart building control systems Automotive electronic subsystems Multi-sensor embedded applications #TCA9548A #TCA9548ARGER #TexasInstruments #I2C #SMBus #BusMultiplexer #I2CSwitch #EmbeddedSystems #IndustrialAutomation #SensorNetworks #IoT #DataAcquisition #ElectronicsEngineering #ElectronicComponents #EngineeringSpecifications

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

SDRAM - Mobile LPDDR4 Memory IC 48Gbit 2.133 GHz MT53E1536M32D4DT-046 WT:A is a high-density 48Gb (6GB) LPDDR4/LPDDR4X SDRAM memory device from Micron Technology. It is designed for high-performance, low-power applications requiring fast memory bandwidth and efficient power management. The device features a 32-bit data bus, supports data rates up to 4266 MT/s, and is packaged in a compact 200-ball FBGA, making it suitable for embedded computing, industrial systems, networking equipment, AI edge devices, automotive electronics, and mobile platforms. Key Features 48Gb (6GB) LPDDR4/LPDDR4X SDRAM Organized as 1.5G × 32 bits Data transfer rates up to 4266 MT/s Maximum clock frequency of 2133 MHz Low-power operation with 1.1V core supply 32-bit memory interface 200-ball FBGA package JEDEC LPDDR4-compliant architecture Per-bank refresh support Temperature-compensated refresh Self-refresh and deep power-down modes Partial-array self-refresh capability High bandwidth with reduced power consumption Optimized for compact embedded designs Operating temperature range: –30°C to +85°C Typical Applications Embedded Linux computers Single-board computers (SBCs) AI and edge computing platforms Industrial automation systems Networking and telecommunications equipment Automotive infotainment and control systems Tablets and mobile devices FPGA and SoC-based designs #commonpartslibrary #integratedcircuit #memory #dram #sdram #lpddr4 #lpddr4x #mobiledram #micron #embeddedsystems #embeddedcomputing #industrialelectronics #automotiveelectronics #edgecomputing #artificialintelligence #networking #telecommunications #highspeedmemory #lowpowerdesign #computerhardware #electroniccomponents #semiconductor #datasheet #fbga #memorychip #electronicsdesign #pcbdesign #hardwareengineering #electronicengineering #systemonchip #fpga #iot #internetofthings #computermemory #digitalelectronics #surfaceMount #smt #bga #storage #highperformancecomputing #hpc #mobiledevices #industrialautomation #electronicdesign #componentlibrary #fluxlibrary #parametricpart #eda #schematic #pcb #electronicdesignautomation #chipdesign #embeddedhardware #memorymodule #lowpowerelectronics #highbandwidthmemory #electronics #hardwaredevelopment #engineering #electricalengineering

IC RF TxRx + MCU General ISM < 1GHz LoRaWAN 1.0, Sigfox 915MHz 73-UFBGA The STM32WL55JCI6TR is an ultra-low-power wireless microcontroller developed by STMicroelectronics. It integrates a high-performance Arm Cortex-M4 core with a secondary Arm Cortex-M0+ core and a sub-GHz radio transceiver within a single package. The device is designed for long-range wireless communication, industrial automation, smart metering, environmental monitoring, asset tracking, and Internet of Things applications. Its highly integrated architecture reduces external component count while providing secure, energy-efficient operation suitable for battery-powered and embedded systems. #STM32WL55JCI6TR #STM32WL #STM32 #STMicroelectronics #Microcontroller #WirelessMCU #LoRa #SubGHz #IoT #EmbeddedSystems #IndustrialAutomation #SmartMetering #LowPowerDesign #WirelessCommunication #RemoteMonitoring

USB-C (USB TYPE-C) Receptacle Connector 24 Position Panel Mount, Through Hole, Right Angle The MUSBRM1C1M0 is a ruggedized USB Type-C receptacle connector designed for high-reliability data and power connectivity in industrial, embedded, transportation, and harsh-environment applications. The connector features a reversible USB Type-C interface that supports modern high-speed communication protocols while providing robust mechanical durability and secure board-level attachment. Its reinforced construction helps withstand vibration, shock, and repeated mating cycles, making it suitable for demanding applications where reliability and long service life are critical. The device is commonly used in industrial controllers, communication equipment, medical devices, consumer electronics, and next-generation embedded systems requiring compact and versatile connectivity. Engineering Specifications Manufacturer: Amphenol Communications Solutions Part Number: MUSBRM1C1M0 Connector Type: USB Type-C Receptacle Interface Standard: Universal Serial Bus Type-C Connector Gender: Receptacle Mounting Style: Surface Mount Orientation: Right Angle Contact Configuration: USB Type-C Multi-Function Interface Data Support: High-Speed Data Transmission Power Delivery Support: Compatible with USB Power Delivery Architectures Shielding: Integrated EMI Shielding Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Strength Metal Shield Construction Durability: High Mating Cycle Life Environmental Performance: Designed for Industrial Applications Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Automation, Consumer Electronics, Communication Equipment, Medical Devices, IoT Products, Portable Electronics, Data Acquisition Systems Key Features Reversible USB Type-C connection interface Ruggedized mechanical construction High-speed data communication capability Secure PCB mounting design Enhanced resistance to vibration and mechanical stress Integrated shielding for improved electromagnetic compatibility Compact footprint for space-constrained designs Supports modern USB power and data architectures Long operational lifespan with high insertion cycle durability Suitable for industrial and commercial electronic systems #MUSBRM1C1M0 #Amphenol #USBTypeC #USBConnector #TypeCReceptacle #HighSpeedConnectivity #PowerDelivery #IndustrialElectronics #EmbeddedSystems #CommunicationEquipment #IoTDevices #ConsumerElectronics #PCBDesign #ElectronicComponents #SurfaceMount #DataTransmission #USBPD #IndustrialAutomation #MedicalElectronics #ConnectorTechnology

Isolated Module DC DC Converter 2 Output 12 ~ 15V -12 ~ -15V 125mA, 125mA 18V - 36V Input The CC3-2412DF-E is an isolated DC-DC converter module designed to provide efficient and reliable power conversion in industrial, telecommunications, instrumentation, and embedded electronic systems. The module converts a regulated DC input voltage into isolated dual-output DC supplies while maintaining electrical isolation between the input and output stages. Its compact encapsulated design simplifies PCB integration and enhances system reliability by reducing the need for external conversion circuitry. The device is optimized for applications requiring isolated power rails, noise reduction, and protection against ground loop interference. Engineering Specifications Manufacturer: TDK-Lambda Part Number: CC3-2412DF-E Device Type: Isolated DC-DC Converter Module Conversion Topology: Isolated Power Conversion Input Voltage: Nominal DC Input Operation Output Configuration: Dual Output Output Regulation: Regulated DC Output Isolation Type: Galvanic Isolation Efficiency: High-Efficiency Power Conversion Protection Features: Short Circuit Protection and Overload Tolerance Package Type: Encapsulated Through-Hole Module Mounting Style: Through-Hole Operating Temperature Range: Industrial Grade Reliability: Designed for Continuous Operation RoHS Compliant: Yes Applications: Industrial Automation, Telecommunications Equipment, Embedded Systems, Instrumentation, Data Acquisition Systems, Process Control Equipment, Power Distribution Circuits, Isolated Interface Designs Key Features Isolated input-to-output power conversion Dual regulated output architecture Compact PCB-mount package High efficiency operation Reduced electrical noise and ground loop interference Reliable performance in industrial environments Simplified power supply design integration Robust protection against abnormal operating conditions Suitable for mixed-signal and sensitive analog systems Long operational lifespan and stable output characteristics #CC32412DFE #TDKLambda #DCDCConverter #IsolatedPowerSupply #PowerModule #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerConversion #GalvanicIsolation #Telecommunications #Instrumentation #AutomationSystems #PCBDesign #ElectronicComponents #DualOutput #PowerManagement #IndustrialAutomation #ElectricalEngineering #PowerSupplyDesign

Cellular, Navigation BeiDou, EGDE, Galileo, GLONASS, GPS, GNSS, GSM, LTE Transceiver Module 850MHz, 900MHz, 1.8GHz, 1.9GHz Antenna Not Included Surface Mount The BG95M3LA-64-SGNS is a compact low-power LTE cellular communication module designed for IoT, telematics, asset tracking, industrial automation, and embedded wireless applications. The module supports global LTE Cat M1, Cat NB2, and EGPRS connectivity, enabling reliable wide-area wireless communication for battery-powered and mobile embedded systems. The device integrates cellular modem functionality, GNSS positioning capability, power management features, and multiple peripheral communication interfaces within a highly compact surface-mount package optimized for space-constrained embedded designs. The module is engineered for low-power operation, making it suitable for long-life IoT deployments requiring efficient wireless connectivity. The BG95M3LA-64-SGNS supports integrated satellite positioning technologies including GPS, GLONASS, Galileo, and BeiDou for location-aware applications. Its robust RF performance and industrial-grade operating capability allow deployment in harsh environmental conditions and demanding remote monitoring systems. The module provides comprehensive support for embedded communication protocols and is commonly used in smart meters, telematics units, industrial gateways, environmental monitoring systems, fleet tracking devices, and connected sensor platforms. Key Features LTE Cat M1 cellular communication support LTE Cat NB2 narrowband IoT capability EGPRS fallback connectivity Integrated GNSS positioning functionality Low-power optimized architecture Global wireless network compatibility Compact surface-mount module design Embedded TCP/IP protocol stack support UART, USB, and serial communication interfaces Integrated power management subsystem Industrial operating temperature support Embedded IoT connectivity optimization High-reliability wireless communication platform Multi-constellation satellite navigation support Electrical Characteristics Low operating power consumption Wide input voltage support High RF sensitivity performance Embedded low-power sleep functionality Stable wireless communication architecture Integrated RF and baseband processing Optimized antenna interface support Industrial-grade reliability performance Fast network registration capability Applications IoT and M2M communication systems Asset tracking devices Fleet management platforms Smart utility metering Industrial automation equipment Remote environmental monitoring Smart agriculture systems Telematics and transportation electronics Portable wireless data terminals Embedded gateway systems Smart city infrastructure Connected sensor platforms Package Information Package Type: LGA Module Mounting Type: Surface Mount Compact embedded wireless module package RoHS compliant configuration available #commonpartslibrary #wirelessmodule #lte #iot #embeddedhardware #cellularcommunication #gnss #telematics #industrialautomation #assettracking

The CC1101RGP is a low-power sub-gigahertz RF transceiver designed for wireless communication applications requiring reliable long-range data transmission and high receiver sensitivity. It integrates a complete radio frequency front-end, packet handling engine, modulation and demodulation circuitry, frequency synthesizer, and advanced power management features within a compact package. The device supports multiple modulation formats and is optimized for industrial, scientific, medical, smart metering, home automation, remote control, wireless sensor networks, and Internet of Things applications. Its flexible configuration options enable designers to achieve an optimal balance between communication range, data throughput, power consumption, and system robustness. Features Sub-gigahertz RF transceiver for license-free ISM frequency bands High receiver sensitivity for extended communication range Programmable output power for optimized power consumption Multiple modulation schemes including FSK, GFSK, ASK, OOK, and MSK Integrated packet handling and error detection functions Fast frequency synthesizer settling time Low current consumption in transmit, receive, and sleep modes Hardware support for address filtering and data buffering Programmable channel spacing and data rate configuration Integrated RSSI, LQI, and clear channel assessment functions SPI interface for configuration and data communication Suitable for battery-powered wireless devices Applications Smart metering systems Wireless sensor networks Industrial monitoring and control Home and building automation Remote keyless entry systems Alarm and security systems Asset tracking devices Telemetry and data acquisition systems IoT communication nodes Proprietary wireless communication networks Electrical Characteristics Wide operating supply voltage range Low-power transmit and receive operation Programmable RF output power levels High-performance frequency synthesizer Low standby and sleep current consumption Integrated crystal oscillator support Robust RF performance across supported frequency bands Interface and Connectivity Serial Peripheral Interface communication Digital control and status signals Configurable interrupt outputs Integrated FIFO buffers for transmit and receive data External antenna connection through matching network Package Information Surface-mount package suitable for automated assembly Compact footprint for space-constrained applications RoHS-compliant device construction #commonpartslibrary #integratedcircuit #wirelesscommunication #rftransceiver #subghz #iot #embeddedsystems #industrialautomation #smartmetering #wirelesssensornetwork #lowpowerdesign #telemetry #homeautomation #remotecontrol #texasinstruments

The LSM6DSOXTR is a low-power inertial measurement unit integrating a three-axis accelerometer and a three-axis gyroscope within a compact surface-mount package. Designed for motion tracking, gesture recognition, activity monitoring, and sensor fusion applications, the device incorporates embedded machine learning capabilities and programmable finite state machines to enable intelligent edge processing with reduced host processor workload. The sensor supports high-performance motion sensing while maintaining low power consumption, making it suitable for wearable devices, IoT products, industrial monitoring systems, smart home equipment, and portable electronics. Engineering Specification Device Type Six-axis inertial measurement unit featuring a three-axis accelerometer and three-axis gyroscope. Sensor Functions Motion sensing, orientation detection, vibration monitoring, gesture recognition, activity tracking, tilt sensing, and sensor fusion. Integrated Features Embedded machine learning core, finite state machine engine, sensor hub functionality, timestamp generation, event detection, and programmable interrupt generation. Communication Interface Supports digital communication through I²C, SPI, and I³C interfaces for integration with microcontrollers and embedded processors. Power Characteristics Optimized for low-power operation with multiple performance modes supporting battery-powered and always-on applications. Measurement Capabilities Provides configurable acceleration and angular rate measurement ranges with programmable output data rates and digital filtering options. Embedded Intelligence Includes on-chip machine learning and event classification capabilities to enable local data processing and reduce system power consumption. Package Style Compact surface-mount LGA package suitable for space-constrained electronic designs. Applications Wearable electronics, asset tracking devices, industrial sensors, robotics, smart appliances, navigation systems, handheld devices, health monitoring equipment, and IoT products. Manufacturer STMicroelectronics. Hashtags #LSM6DSOXTR #STMicroelectronics #IMU #MotionSensor #Accelerometer #Gyroscope #SensorFusion #MachineLearningCore #EmbeddedSystems #WearableElectronics #IndustrialAutomation #IoT #SmartDevices #MEMS #CommonPartsLibrary

USB-A (USB TYPE-A) USB 2.0 Receptacle Connector 4 Position Through Hole, Right Angle The ADS1256IDBT is a high-precision, low-noise, 24-bit analog-to-digital converter manufactured by Texas Instruments. It is designed for high-resolution measurement applications requiring exceptional accuracy, low drift, and programmable data rates. The device integrates a low-noise programmable gain amplifier, a precision delta-sigma ADC core, and a flexible multiplexer that supports multiple differential or single-ended analog inputs. The converter is optimized for industrial process control, sensor measurement, weigh scales, data acquisition systems, temperature monitoring, and portable instrumentation. Its integrated digital filtering and selectable gain settings enable direct interfacing with low-level sensors such as strain gauges, thermocouples, RTDs, and bridge sensors without requiring extensive external signal conditioning. The ADS1256IDBT supports SPI-compatible serial communication and operates with low power consumption while maintaining excellent dynamic performance and high effective resolution. The device provides programmable output data rates suitable for both low-speed precision measurements and higher-speed acquisition systems. Device Features 24-bit delta-sigma analog-to-digital converter Low-noise programmable gain amplifier Eight single-ended or four differential analog input channels Programmable gain settings from 1 to 64 Programmable data output rates SPI-compatible serial interface Integrated digital filter for noise reduction Low offset drift and gain drift Internal oscillator support Sensor burnout detection capability Self-calibration and system calibration functions Low power operation Wide analog supply voltage range Excellent 50 Hz and 60 Hz rejection performance Electrical Characteristics Resolution of 24 bits Maximum data rate up to 30 kSPS Differential input architecture Input multiplexer for multi-channel acquisition Low RMS noise performance High common-mode rejection ratio High power-supply rejection ratio Programmable gain amplifier integrated on-chip Internal reference support with external reference capability Interface and Control SPI-compatible digital communication interface Configurable control registers Read and write register functionality Synchronization and standby control support Hardware reset capability Interrupt and data-ready signaling support Package Information Manufacturer package designation: DBT Package type: TSSOP Surface-mount device Fine-pitch lead configuration Industrial temperature grade device Applications Precision data acquisition systems Industrial automation and control Weigh scales and bridge sensors Temperature measurement systems Pressure sensing applications Portable instrumentation Medical instrumentation Laboratory measurement equipment Energy monitoring systems Process monitoring and control Manufacturer Information Manufacturer: Texas Instruments Manufacturer Part Number: ADS1256IDBT Product Category: Precision Analog-to-Digital Converter RoHS compliant device #commonpartslibrary #integratedcircuit #analog #adc #deltasigma #precisionadc #sensorinterface #dataacquisition #industrialautomation #instrumentation #signalconditioning #texasinstruments #spiinterface #mixedsignal #measurementsystems