ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing

The ESP32-C3FH4 is a highly integrated wireless microcontroller designed for Internet of Things, smart devices, industrial automation, consumer electronics, and embedded connectivity applications. It combines a low-power RISC-V processor with integrated Wi-Fi and Bluetooth Low Energy connectivity, providing a cost-effective and secure platform for wireless communication and edge computing. The device incorporates embedded flash memory, advanced security features, low-power operating modes, and a rich set of peripheral interfaces, making it suitable for battery-powered and always-connected systems. Its compact design and comprehensive software ecosystem enable rapid development of connected products while maintaining high reliability and energy efficiency. The ESP32-C3FH4 is widely used in smart sensors, home automation devices, wearable electronics, industrial monitoring systems, wireless control modules, and cloud-connected embedded products. Features Integrated RISC-V microcontroller core Built-in Wi-Fi connectivity Integrated Bluetooth Low Energy support Embedded flash memory Low-power operation for battery-powered applications Hardware cryptographic acceleration Secure boot capability Flash encryption support Multiple GPIO interfaces Integrated UART, SPI, I²C, I²S, PWM, and ADC peripherals Real-time processing capability Wireless networking and cloud connectivity support OTA firmware update support Compact surface-mount package Industrial-grade reliability Electrical Characteristics Wireless microcontroller architecture Integrated RF subsystem Low-power operating modes High-performance embedded processing Secure communication support Multi-protocol wireless connectivity Flexible peripheral expansion capability Optimized power consumption for IoT devices Applications Internet of Things devices Smart home automation Wireless sensor networks Industrial monitoring systems Asset tracking devices Wearable electronics Smart appliances Remote control systems Data acquisition platforms Edge computing applications Connected consumer products Embedded wireless gateways Package Information Surface-mount package Compact footprint for embedded applications Suitable for automated assembly processes Optimized thermal and electrical performance PCB-friendly package design #commonpartslibrary #integratedcircuit #microcontroller #wirelessconnectivity #wifi #bluetoothlowenergy #iot #embeddedsystems #espressif #smartdevices #industrialautomation #edgecomputing #wirelessmodule #internetofthings #electronicsdesign #riscv #embeddedelectronics #lowpowerdesign

ARM® Cortex®-M33F, ARM® Cortex®-M7F RT1180 Microcontroller IC 32-Bit Dual-Core 240MHz, 800MHz 160KB (160K x 8) ROM 289-LFBGA (14x14) The MIMXRT1189XVM8C is a high-performance crossover microcontroller from the NXP Semiconductors i.MX RT1180 family, designed for advanced industrial and real-time embedded applications. It combines the real-time performance of a microcontroller with the connectivity and security features typically found in application processors. The device integrates dual Arm® Cortex® cores, high-speed networking with Time-Sensitive Networking (TSN), and advanced EdgeLock® security technology, making it ideal for industrial automation, robotics, motor control, automotive gateways, and Industry 4.0 systems. Key Features Dual-core architecture: Arm® Cortex®-M7 core running up to 800 MHz Arm® Cortex®-M33 core running up to 300 MHz Integrated Gigabit TSN Ethernet switch for deterministic real-time networking Supports industrial Ethernet protocols including: EtherCAT PROFINET Ethernet/IP CC-Link IE Advanced EdgeLock® Secure Enclave for secure boot, cryptography, and tamper detection Up to 1.5 MB on-chip SRAM with ECC protection High-speed external memory interfaces Multiple communication peripherals: CAN-FD UART SPI I2C USB Ethernet High-resolution ADCs and advanced PWM/timer modules Supports MCUXpresso SDK and Zephyr RTOS Industrial temperature range operation from -40°C to +125°C BGA package optimized for compact industrial designs #Commonpartlibrary #Microcontroller #MIMXRT1189

MGM210LA22JIF devices are PCB modules for Zigbee, Thread, Bluetooth and multiprotocol (Zigbee + Bluetooth) connectivity built around the EFR32MG21 Wireless Gecko Series 2 SoC and designed and optimized for the unique needs of smart LED lightbulbs. Delivering unparalleled RF performance and energy consumption compliance with CA Title 20, the module also offers a powerful and energy-efficient MCU core, 1024 kB of flash memory to enable future-proofing capabilities and over-the-air firmware updates with a dedicated core for enhanced security features. With its extended temperature rating and form factor, the device is suitable for enclosed operation in lightbulb housings. #CommonpartLibrary #Module #EFR32MG21 #arduino-matter

802.15.4 Bluetooth, Wi-Fi Bluetooth v5.0, ZigBee® Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N4 is based on the ESP32-C6 single-core RISC-V microcontroller, integrating advanced wireless standards and secure connectivity in a small module format. It is designed for next-generation IoT devices that require Wi-Fi 6 efficiency, mesh networking, and Bluetooth Low Energy support. Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless Connectivity: Wi-Fi 6 (802.11ax, 2.4 GHz) Bluetooth LE 5.0 IEEE 802.15.4 (Thread / Zigbee support) Memory (N4 variant): 4 MB Flash Security: Secure boot Flash encryption Cryptographic hardware acceleration #commonpartslibrary #rf #wireless #transceiver #module #zigbee

Authentication Chip 8-UDFN (2x3) ATECC608A-MAHDA-S is a secure cryptographic authentication device from Microchip Technology designed to provide hardware-based security for embedded systems, IoT devices, and connected electronic products. The device integrates secure key storage, cryptographic acceleration, authentication functions, and tamper-resistant hardware protection to enable secure device identity and encrypted communication. This secure element supports advanced cryptographic algorithms including Elliptic Curve Cryptography, SHA hashing, key generation, digital signatures, secure boot validation, and encrypted data exchange. It is optimized for applications requiring authentication, anti-counterfeiting protection, secure firmware updates, cloud connectivity security, and hardware root-of-trust implementation. The ATECC608A-MAHDA-S communicates through a standard serial interface and is commonly integrated into wireless modules, industrial automation systems, smart home products, medical devices, payment systems, and battery-powered IoT hardware. Its low-power architecture and compact package make it suitable for resource-constrained embedded applications requiring strong cybersecurity and secure credential storage. #commonpartslibrary #secureelement #cryptography #iotsecurity #embeddedhardware #microchiptechnology #authentication #cybersecurity #hardwaresecurity #securecommunication

Video Separator IC NTSC, PAL, SECAM 8-PDIP Package # LM1881N/NOPB Engineering Specifications **General Description** The LM1881N/NOPB is a precision video synchronization separator integrated circuit manufactured by Texas Instruments. It is designed to extract timing information from composite video signals and generate synchronization outputs required for video processing, display control, video capture, and television signal applications. The device separates composite sync, vertical sync, burst or back-porch timing, and odd/even field information from standard analog video formats. It operates with both monochrome and color composite video signals and is commonly used in video synchronization systems, frame grabbers, video overlays, video switching equipment, and display synchronization circuits. The integrated circuit simplifies video timing recovery by eliminating the need for complex discrete-component sync separation circuits. Its low-power bipolar architecture provides reliable operation across a wide range of video applications while maintaining accurate synchronization detection. **Engineering Specifications** **Manufacturer:** Texas Instruments **Manufacturer Part Number:** LM1881N/NOPB **Component Type:** Video synchronization separator integrated circuit **Function:** Composite video sync extraction and timing separation **Technology:** Bipolar analog integrated circuit **Video Signal Compatibility:** Composite video input **Supported Video Formats:** NTSC, PAL and SECAM composite video systems **Input Signal Type:** Composite video **Composite Sync Output:** Available **Vertical Sync Output:** Available **Burst or Back-Porch Output:** Available **Odd/Even Field Output:** Available **Synchronization Detection:** Automatic extraction of video timing signals **Power Supply Configuration:** Single-supply operation **Supply Voltage Range:** Wide operating voltage range suitable for video processing systems **Power Consumption:** Low-power operation **Output Configuration:** TTL and CMOS compatible synchronization outputs **Input Coupling:** AC-coupled composite video input **Noise Immunity:** High immunity to video signal disturbances and noise **Signal Processing Capability:** Composite sync, vertical sync and field identification extraction **Applications Compatibility:** Video displays, frame grabbers, video processors, video switching systems and synchronization controllers **Operating Temperature Range:** Commercial temperature range **Package Type:** Plastic dual in-line package **Package Configuration:** Through-hole mounting package **Pin Configuration:** Standard DIP package layout **Mounting Style:** Through-hole **Environmental Compliance:** Lead-free and RoHS compliant NOPB version **Reliability Features:** Stable synchronization extraction and accurate timing recovery **Typical Applications** Video synchronization circuits Video capture equipment Frame grabber systems Television signal processing Video overlay generators Video switching equipment Security and surveillance video systems Display synchronization controllers Industrial video monitoring equipment Embedded video processing systems #LM1881N #LM1881NNOPB #TexasInstruments #VideoSyncSeparator #CompositeVideo #VideoProcessing #EmbeddedSystems #SignalProcessing #FrameGrabber #VideoElectronics #AnalogIC #ElectronicComponents #EngineeringSpecifications #VideoSynchronization

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.412GHz ~ 2.484GHz PCB Trace Surface Mount SP32-C3-MINI-1-N4 is a compact Wi-Fi + Bluetooth Low Energy (BLE) module based on Espressif’s ESP32-C3 chip, designed for low-power IoT and embedded applications. The module integrates a RISC-V 32-bit single-core processor with wireless connectivity, making it suitable for cost-sensitive and power-efficient smart devices. Key features Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE support) Flash: “N4” variant typically includes 4 MB SPI flash Memory: Internal SRAM for lightweight embedded applications Security features: Secure boot Flash encryption Hardware cryptographic acceleration Low power modes: Deep sleep support for battery-powered devices GPIO: Multiple general-purpose I/O pins (shared with peripherals like UART, SPI, I2C, ADC, PWM) Package: Compact “MINI” form factor for space-constrained PCB designs #CommonPartsLibrary #Module #RF

ARM® Cortex®-M0+ STM32G0 Microcontroller IC 32-Bit Single-Core 64MHz 32KB (32K x 8) FLASH 8-SOIC The STM32G031J6M6 is a compact, low-power 32-bit microcontroller from STMicroelectronics, based on the Arm® Cortex®-M0+ core running at up to 64 MHz. It belongs to the STM32G0 series, designed for cost-sensitive and energy-efficient embedded applications. This MCU integrates essential peripherals, memory, and system functions into a small package (8-pin SOIC), making it suitable for consumer electronics, industrial control, appliances, and IoT devices where space and power efficiency are critical. Key Features Core & Performance 32-bit Arm Cortex-M0+ CPU Up to 64 MHz clock frequency Memory Protection Unit (MPU) for improved reliability and security 💾 Memory 32 KB Flash memory (program storage) 8 KB SRAM Flash protection (read/write protection, secure area) Peripherals & Interfaces Communication: I2C (2x) SPI (2x) / I2S USART (2x) + Low-power UART 12-bit ADC (up to ~2.5 MSps, multiple channels) DMA controller (5 channels) Timers: Advanced PWM timer (motor control capable) General-purpose timers (16-bit & 32-bit) Low-power timers Watchdog timers RTC (Real-Time Clock) with VBAT backup Power & Efficiency Operating voltage: 1.7 V to 3.6 V Multiple low-power modes: Sleep, Stop, Standby, Shutdown Optimized for low energy consumption (battery-powered designs) I/O & Package Up to 44 GPIOs (depending on package) 6 GPIOs available in the 8-pin (J6M6) package 5V-tolerant I/O pins (select pins) Compact SOIC-8 package#commonpartslibrary #integratedcircuit #microcontroller

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit 160MHz 4MB (4M x 8) FLASH 172-QFP (16x16) S32K344EHT1VPBST is an automotive-grade 32-bit microcontroller from NXP Semiconductors based on the Arm Cortex-M7 core architecture. The device is designed for high-performance real-time automotive body, chassis, powertrain, and domain control applications requiring functional safety, security, and advanced communication interfaces. It integrates high-speed processing capability, extensive peripheral integration, hardware security acceleration, and deterministic control functions suitable for safety-critical embedded systems. The microcontroller operates with an Arm Cortex-M7 CPU core running at high frequency with floating-point support and DSP extensions for computationally intensive applications. Integrated flash memory and SRAM provide embedded program and data storage optimized for automotive embedded control systems. The device supports hardware-assisted security features including secure boot, cryptographic acceleration, and tamper protection for secure automotive network communication and firmware integrity. The S32K344EHT1VPBST includes multiple communication peripherals supporting CAN FD, FlexCAN, LIN, SPI, UART, I2C, and Ethernet interfaces for distributed automotive networking and gateway applications. Advanced analog integration includes ADC modules, timers, PWM generators, watchdogs, and motor-control-oriented peripherals enabling precision sensing and control functionality. The device supports functional safety development aligned with ISO 26262 requirements and includes error correction, memory protection, fault monitoring, and safety management features. Power management functionality supports low-power operating modes for energy-efficient automotive electronic control units. The microcontroller is housed in a thermally enhanced LQFP package suitable for automotive operating environments with extended temperature capability and AEC-Q100 qualification for automotive reliability standards. #commonpartslibrary #integratedcircuit #microcontroller #arm #m7

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O, QPI, DTR 133 MHz 8-SOIC 128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI Winbond W25Q128JV is a 128-Mbit (16 MB) serial NOR Flash memory device designed for code and data storage in embedded systems. It supports standard SPI, Dual SPI, Quad SPI (QSPI), and Dual/Quad Peripheral Interface (DPI/QPI) modes, enabling high-speed data transfer rates up to 133 MHz clock operation and up to 532 MB/s equivalent throughput in Quad I/O DTR mode. The device supports Execute-In-Place (XIP), allowing processors and microcontrollers to run code directly from external flash memory without copying it to RAM. Features include 4 KB sector erase, 32 KB and 64 KB block erase, page programming, hardware/software write protection, security registers, JEDEC identification, SFDP support, suspend/resume operations, and low-power standby modes. Suitable for microcontrollers, FPGA configuration storage, IoT devices, industrial controllers, networking equipment, consumer electronics, and embedded systems requiring reliable non-volatile memory. Search Keywords: W25Q128JV, Winbond flash memory, SPI NOR Flash, QSPI Flash, Quad SPI memory, Serial Flash memory, 128Mbit Flash, 16MB Flash memory, Execute In Place XIP, external MCU flash, ESP32 flash memory, FPGA configuration memory, NOR flash storage, W25Q128, Dual SPI Flash, Quad I/O Flash, embedded nonvolatile memory, serial flash IC Hashtags: #W25Q128JV #Winbond #NORFlash #SPIMemory #QSPI #SerialFlash #FlashMemory #EmbeddedSystems #Microcontroller #ESP32 #FPGA #NonVolatileMemory #XIP #IoT #ElectronicsDesign #MemoryIC #FirmwareStorage #QuadSPI #EmbeddedHardware #ElectronicComponents

The ESP32-C3-MINI-1-N4 is a compact, low-power wireless module from Espressif Systems built around the ESP32-C3 SoC. It integrates a 32-bit RISC-V single-core processor, 2.4 GHz Wi-Fi, Bluetooth 5 Low Energy (BLE), onboard flash memory, crystal oscillator, RF circuitry, and PCB antenna in a small surface-mount package. The module is designed for IoT devices, smart home products, industrial automation, sensor nodes, wearable devices, and other wireless embedded applications. Key Features 32-bit RISC-V Single-Core CPU Up to 160 MHz operating frequency Optimized for low-power IoT applications Integrated Memory 4 MB embedded Flash (N4 version) 400 KB SRAM 384 KB ROM 8 KB RTC SRAM Wireless Connectivity IEEE 802.11 b/g/n Wi-Fi (2.4 GHz) Data rates up to 150 Mbps Bluetooth 5 LE support Bluetooth Mesh capability Simultaneous Wi-Fi and Bluetooth operation using a shared antenna Security Features Secure Boot Flash Encryption Hardware cryptographic acceleration RSA, AES, HMAC, and Digital Signature support Rich Peripheral Set Up to 15 GPIOs UART SPI I²C I²S USB Serial/JTAG PWM TWAI (CAN 2.0 compatible) SAR ADC Timers and Watchdog timers Temperature sensor Integrated Components On-board PCB antenna 40 MHz crystal oscillator RF matching circuitry No external RF design required Power Supply Operating voltage: 3.0 V to 3.6 V Designed for low-power applications Environmental Specifications Operating temperature: −40°C to +85°C (N4 variant) RoHS and REACH compliant #module #RF-Transceiver #ESP32-C3

The RP2350, developed by Raspberry Pi Ltd, is a high-performance microcontroller designed to cater to a broad range of applications requiring efficient power management, advanced security features, and versatile IO options. This microcontroller stands out with its dual-core architecture, featuring either Cortex-M33 or Hazard3 processors operating at up to 150 MHz, ensuring robust performance for complex applications. It boasts a substantial 520 KB of on-chip SRAM distributed across 10 independent banks, enhancing parallel data processing capabilities. Additionally, the RP2350 supports up to 16 MB of external QSPI flash/PSRAM for extensive program and data storage, further expandable via an optional second chip-select. A notable feature of the RP2350 is its integrated on-chip switched-mode power supply, designed to generate core voltage efficiently, complemented by a low-quiescent-current LDO mode for reduced power consumption in sleep states. Security is a paramount feature of the RP2350, offering options for boot signing with key fingerprint in OTP, hardware mitigations against fault injection attacks, and a hardware SHA-256 accelerator for cryptographic operations. The microcontroller is also equipped with a comprehensive set of peripherals, including USB 1.1 controller and PHY, multiple UARTs, SPI, and I2C controllers, 24 PWM channels, and 12 programmable IO (PIO) state machines, providing extensive interface capabilities. The RP2350 is available in QFN-60 and QFN-80 packages, with or without flash-in-package options, catering to various design requirements and application needs.

The RP2350, developed by Raspberry Pi Ltd, is a high-performance microcontroller designed to cater to a broad range of applications requiring efficient power management, advanced security features, and versatile IO options. This microcontroller stands out with its dual-core architecture, featuring either Cortex-M33 or Hazard3 processors operating at up to 150 MHz, ensuring robust performance for complex applications. It boasts a substantial 520 KB of on-chip SRAM distributed across 10 independent banks, enhancing parallel data processing capabilities. Additionally, the RP2350 supports up to 16 MB of external QSPI flash/PSRAM for extensive program and data storage, further expandable via an optional second chip-select. A notable feature of the RP2350 is its integrated on-chip switched-mode power supply, designed to generate core voltage efficiently, complemented by a low-quiescent-current LDO mode for reduced power consumption in sleep states. Security is a paramount feature of the RP2350, offering options for boot signing with key fingerprint in OTP, hardware mitigations against fault injection attacks, and a hardware SHA-256 accelerator for cryptographic operations. The microcontroller is also equipped with a comprehensive set of peripherals, including USB 1.1 controller and PHY, multiple UARTs, SPI, and I2C controllers, 24 PWM channels, and 12 programmable IO (PIO) state machines, providing extensive interface capabilities. The RP2350 is available in QFN-60 and QFN-80 packages, with or without flash-in-package options, catering to various design requirements and application needs.

The RP2350, developed by Raspberry Pi Ltd, is a high-performance microcontroller designed to cater to a broad range of applications requiring efficient power management, advanced security features, and versatile IO options. This microcontroller stands out with its dual-core architecture, featuring either Cortex-M33 or Hazard3 processors operating at up to 150 MHz, ensuring robust performance for complex applications. It boasts a substantial 520 KB of on-chip SRAM distributed across 10 independent banks, enhancing parallel data processing capabilities. Additionally, the RP2350 supports up to 16 MB of external QSPI flash/PSRAM for extensive program and data storage, further expandable via an optional second chip-select. A notable feature of the RP2350 is its integrated on-chip switched-mode power supply, designed to generate core voltage efficiently, complemented by a low-quiescent-current LDO mode for reduced power consumption in sleep states. Security is a paramount feature of the RP2350, offering options for boot signing with key fingerprint in OTP, hardware mitigations against fault injection attacks, and a hardware SHA-256 accelerator for cryptographic operations. The microcontroller is also equipped with a comprehensive set of peripherals, including USB 1.1 controller and PHY, multiple UARTs, SPI, and I2C controllers, 24 PWM channels, and 12 programmable IO (PIO) state machines, providing extensive interface capabilities. The RP2350 is available in QFN-60 and QFN-80 packages, with or without flash-in-package options, catering to various design requirements and application needs.

IC RF TxRx Only Bluetooth, WiFi Bluetooth v5.0, Thread, Zigbee® 2.412GHz ~ 2.484GHz 32-VFQFN Exposed Pad The ESP32-C6FH4 is a low-power, highly integrated wireless microcontroller from Espressif Systems, designed for IoT applications. It is based on a 32-bit RISC-V processor running at up to 160 MHz, providing efficient performance for embedded systems while maintaining low power consumption. This variant includes 4 MB of embedded flash memory, making it suitable for standalone applications without the need for external flash. The ESP32-C6FH4 supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band (backward compatible with Wi-Fi 4/802.11 b/g/n) Bluetooth Low Energy (BLE 5) IEEE 802.15.4 (used for protocols like Thread and Zigbee) Key features include: Rich set of GPIO pins with support for peripherals such as UART, SPI, I2C, PWM, ADC, and more Integrated hardware security features (secure boot, flash encryption, cryptographic accelerators) Multiple low-power modes for battery-operated devices On-chip temperature sensor and RTC peripherals #commonpartslibrary #transceiver

The CH32X035/X033 series, developed by WCH, encompasses industrial-grade microcontrollers based on the QingKe RISC-V core. These microcontrollers, including models such as the CH32X035R8T6, CH32X035C8T6, CH32X035G8U6, CH32X035G8R6, CH32X035F8U6, CH32X035F7P6, and CH32X033F8P6, are equipped with integrated USB and PD PHY, supporting USB Host and Device functionalities, as well as PDUSB and Type-C fast charging capabilities. The series features a programmable protocol I/O controller, two groups of operational amplifiers (OPA), three groups of comparators (CMP), four USARTs, I2C, SPI, multiple timers, a 12-bit ADC, and 14-channel capacitive touch-key interfaces, among other peripherals. These microcontrollers offer a comprehensive suite of features, including a 32-bit QingKe RISC-V4C core with support for the RV32IMAC instruction set, fast interrupt handling, and low-power modes, making them suitable for a wide range of embedded applications. With a robust memory architecture comprising 20KB SRAM and 62KB CodeFlash, alongside various power management and security features, the CH32X035/X033 series is designed to deliver high performance and flexibility for industrial applications.

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

IC RF TxRx + MCU General ISM < 1GHz Z-Wave® 863MHz ~ 870MHz, 902MHz ~ 928MHz 48-VFQFN Exposed Pad The Silicon Labs EFR32ZG23B020F512IM48-B is a 2.4 GHz–independent (sub-GHz) RF Tx/Rx + MCU SoC optimized for Z-Wave smart home and IoT mesh networks. It integrates computing, RF communication, and security features in a compact 48-pin QFN package. It is part of the EFR32ZG23 Series 2 platform, which focuses on low-power, secure, long-range wireless connectivity for smart home, building automation, and industrial IoT devices. Key Features MCU Core & Memory ARM Cortex-M33 core (up to ~80 MHz) 512 kB Flash memory 64 kB RAM RF / Wireless Z-Wave protocol support (mesh + long-range) Frequency bands: 863–870 MHz (EU) 902–928 MHz (US) Max data rate: up to 100 kbps Output power: up to +20 dBm High sensitivity: around –110 dBm Security Secure Vault™ high-level security subsystem Hardware cryptography support Secure boot and key protection (IoT-grade security) Low Power Performance Ultra-low receive and transmit currents (single-digit mA RX, tens of mA TX) Designed for battery-powered IoT nodes Peripherals & Interfaces GPIO (up to ~31 pins depending on variant) ADC, I2C, SPI, UART, I2S, IrDA Flexible digital/analog peripheral integration Package & Electrical 48-pin QFN (6 × 6 mm) Supply voltage: 1.71 V – 3.8 V Industrial temperature range: –40°C to +125°C #CommonPartsLibrary #IntegratedCircuit #RF-transceiver #EFR32ZG23B020