36-V, single-supply, low-power operational amplifier for cost-sensitive systems SC-70-5 #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #TLV172

1-MHz, Low-Power, General-Purpose, 2.7-V Operational Amplifiers SC-70-6 #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #LMV601

150 MHz to 960 MHz Low Power Long Range Transceiver, 22dBm output power, spreading factor from 5 to 12, LoRA, QFN-24 low-power lora transceiver QFN*1EP*4x4mm*P0.5mm*

This tiny board is an easy way to use Toshiba’s TB6612FNG dual motor driver, which can independently control two bidirectional DC motors or one bipolar stepper motor. A recommended motor voltage of 4.5 V to 13.5 V and peak current output of 3 A per channel (1 A continuous) make this a great motor driver for low-power motors. #Module #Motor-Driver #TB6612FNG

CH32V003 series is an industrial-grade general-purpose microcontroller designed based on QingKe RISC-V2A core, which supports 48MHz system main frequency in the product function. The series features wide voltage, single-wire serial debug interface, low-power consumption and ultra-small package. It provides commonly used peripheral functions, built-in 1 group of DMA controller, 1 group of 10-bit analog-to-digital conversion ADC, 1 group of op-amp comparator, multiple timers, standard communication interfaces such as USART, I2C, SPI, etc. The rated operating voltage of the product is 3.3V or 5V, and the operating temperature range is -40℃～85℃ industrial- grade. #CommonPartsLibrary #Microcontroller #CH32V003A4M6

GPS01-TD module is a quad-mode Mini GPS module that supports BDS/GPS/GLONASS/Galileo/QZSS/SBAS and fully supports BeiDou B3, which can provide users with high quality, strong anti-jamming and low-power positioning and navigation solutions.

Low-Power, Two-Port, High-Speed, USB2.0 (480Mbps) or UART Switch, MSOP-10 USB 2.0 UART High Speed Switch MSOP*3x3mm*P0.5mm*

8-Bit to 12-Bit Low-Power Angle Sensor with Integrated Wake-Up Angle Detection #ultralibrarian

The AP22916 is a small, low leakage, single P-channel power MOSFET designed for low-power consumption and load-switching applications. LOAD SWITCH X1-WLB0808-4 T&R 3K Power Switch/Driver 1:1 P-Channel 2A X1-WLB0808-4

Low-Power Rail-To-Rail Output 12-Bit Serial Input DAC SOT-23-8

1 MHz, Low-Power Op Amp 8-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #MCP6002

High Performance and Low-power Processor for Digital Media Application #CommonPartsLibrary #IntegratedCircuits #Processor

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

137 MHz to 1020 MHz Low Power Long Range Transceiver, spreading factor from 6 to 12, LoRA, QFN-28 low-power lora transceiver QFN*1EP*6x6mm*P0.65mm*

Precision, 10-MHz, Low-Noise, Low-Power, RRIO, CMOS Operational Amplifier, SOIC-8 dual opamp SOIC*3.9x4.9mm*P1.27mm*

Bluetooth Low Energy 5.0 transceiver module, nRF52832-based, 1.7-3.6 V supply, 6.5 x 6.5 mm SMD-52 package

Hongfa Europe GMBH PCB Mount Power Relay, 5V dc Coil, 5A Switching Current, SPS The HF49FD/005-1H11TF is part of the Hongfa HF49FD series, which consists of compact, high-sensitivity power relays. It operates using a 5 V DC coil and provides electrical isolation between the control circuit and the load, allowing low-power signals (e.g., from a microcontroller) to switch higher voltages or currents. Key Characteristics Type: Electromagnetic relay (non-latching) Contact Configuration: SPST-NO (1 Form A, normally open) Coil Voltage: 5 V DC Switching Current: up to 5 A Switching Voltage: 250 VAC 30 VDC Mounting Type: Through-hole / PCB mount Size: ~20 × 5 × 12.5 mm (slim design) Coil Power Consumption: ~120 mW (low power) Dielectric Strength: up to 3 kV isolation Functional Overview Uses a coil + mechanical contacts: When 5 V is applied → coil energizes → contacts close When removed → contacts open Provides electrical isolation between: control side (low voltage) load side (higher voltage/current) #Relay

Connector Header Through Hole 22 position 0.100" (2.54mm) PinHeader_1x22_P2.54mm_Vertical General Description The TSW-122-07-G-S is a through-hole vertical pin header manufactured by Samtec. It is part of the TSW series, designed for board-to-board or wire-to-board interconnections. This component features a single-row configuration with standard 2.54 mm pitch spacing, making it widely compatible with common prototyping and production PCB designs. It is commonly used in embedded systems, development boards, and general-purpose electronic assemblies requiring reliable and cost-effective connectivity. Key Features Single-row vertical pin header Through-hole mounting style Standard 2.54 mm pitch spacing Tin-plated contacts for reliable electrical connection Black thermoplastic insulator housing Designed for board-to-board or cable interfacing Compatible with standard mating connectors and sockets Electrical Characteristics Current rating suitable for signal-level and low-power applications Contact resistance designed for stable electrical performance Insulation resistance suitable for typical PCB environments Mechanical Characteristics Number of positions: twenty-two Row configuration: single row Mounting type: through-hole Orientation: vertical Contact material: copper alloy Contact plating: tin Housing material: high-temperature thermoplastic Environmental Characteristics Operating temperature range suitable for industrial and commercial electronics RoHS compliant Designed for durability under normal handling and soldering conditions Applications Microcontroller and development boards Prototyping platforms Board-to-board interconnections Embedded systems General electronic assemblies #commonpartslibrary #connector #header

16 Position Header Connector 0.100" (2.54mm) Through Hole, Right Angle Gold The PPPC082LJBN-RC is a dual-row, right-angle pin header connector intended for through-hole PCB mounting. It uses a standard 2.54 mm pitch with a 2×8 pin configuration and is commonly used for board-to-board or board-to-cable connections. The connector provides stable mechanical support and reliable electrical performance, making it suitable for prototyping, embedded systems, and general-purpose electronic designs. Mechanical Specifications Connector Type: Pin Header Mounting Type: Through-Hole, Right Angle Number of Positions: 16 (2×8) Pitch: 2.54 mm Row Spacing: 2.54 mm Contact Orientation: Right Angle Termination Style: Solder Housing Material: Thermoplastic (UL94V-0 rated) Contact Material: Brass Electrical Specifications Current Rating: Typically up to 3 A per contact Voltage Rating: Typically 250 V Contact Resistance: ≤ 20 mΩ Insulation Resistance: ≥ 1000 MΩ Dielectric Withstanding Voltage: ~500 VAC Environmental Specifications Operating Temperature Range: -40°C to +105°C Flammability Rating: UL94V-0 RoHS Compliance: Yes Plating Contact Plating: Gold flash over nickel (typical) Tail Plating: Tin over nickel Applications PCB interconnections Embedded systems and microcontroller boards Industrial control interfaces Consumer electronics prototyping Signal and low-power connections Mating Compatibility Compatible with standard 2.54 mm pitch female headers and IDC connectors #commonpartslibrary #connector #header

25 Hz ~ 20 kHz Analog Microphone MEMS (Silicon) 1.5 V ~ 3.63 V Omnidirectional (-32dB @ 94dB SPL) Solder Pads The ICS-40730 is a high-performance analog MEMS microphone designed for precision audio capture in compact electronic systems. It integrates a micro-electromechanical sensing element with an internal impedance conversion amplifier, providing a stable analog output suitable for direct interfacing with audio processing circuits. The device is optimized for applications requiring high signal integrity, low noise, and consistent performance across a wide frequency range. Its small form factor and surface-mount package make it ideal for space-constrained designs such as portable electronics, embedded systems, and industrial sensing equipment. Key Features Omnidirectional microphone response Low noise floor for high signal clarity Wide dynamic range for accurate sound reproduction Analog output interface Surface-mount package for automated assembly Stable performance over temperature variations Electrical Characteristics Supply voltage range suitable for low-power systems Low current consumption for energy-efficient operation High signal-to-noise ratio enabling clear audio capture Consistent sensitivity across operating conditions Acoustic Performance Omnidirectional pickup pattern Flat frequency response over the audible range High acoustic overload point for handling loud sound sources Low total harmonic distortion Mechanical Characteristics Compact surface-mount package Designed for reflow soldering processes Robust structure for reliable operation in portable devices Environmental Specifications Operational across standard industrial temperature ranges Resistant to typical humidity and environmental conditions encountered in consumer and industrial electronics Applications Voice-enabled devices Audio recording systems Industrial monitoring equipment Smart home and IoT devices Portable and wearable electronics Compliance and Standards Designed to meet common environmental and electronic component compliance requirements for modern electronic assemblies #commonpartslibrary #audio #microphone #analog