133MHz LQFN-56(7x7) Microcontrollers (MCU/MPU/SOC) ROHS RP2040 The RP2040 is a high-performance, low-cost 32-bit microcontroller developed by Raspberry Pi Ltd.. It features dual ARM Cortex-M0+ processor cores, flexible digital interfaces, and a unique Programmable I/O (PIO) subsystem that enables custom hardware protocols and timing-critical applications. The device is widely used in embedded systems, IoT devices, robotics, industrial control, consumer electronics, and educational projects. Key Features Dual ARM Cortex-M0+ CPU cores operating up to 133 MHz (up to 200 MHz under specific conditions) 264 KB on-chip SRAM organized in six independent memory banks External QSPI Flash interface with Execute-In-Place (XIP) support and up to 16 MB Flash memory capability 30 multifunction GPIO pins with extensive peripheral multiplexing 2 × UART interfaces 2 × SPI controllers 2 × I²C controllers 16 PWM channels for motor control and signal generation USB 1.1 Host and Device support with integrated PHY 12-bit ADC with four external analog inputs and internal temperature sensor, up to 500 ksps sampling rate 12-channel DMA controller for efficient data transfers Programmable I/O (PIO) subsystem with 8 state machines for implementing custom communication interfaces and precise timing applications Integrated PLLs and programmable LDO regulator for clock and power management Operating voltage range: 1.8 V to 3.3 V Available in a compact 7 mm × 7 mm QFN-56 package Typical Applications IoT and connected devices Industrial automation Robotics and motor control Human-machine interfaces (HMI) Consumer electronics USB peripherals Sensor data acquisition systems Educational and maker projects Custom communication protocol implementations using PIO #CommonPartsLibrary #IntegratedCircuit #Microcontroller

The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, built around the ESP32-S3 SoC. It integrates a dual-core Xtensa® LX7 processor running at up to 240 MHz, along with 16 MB Quad SPI Flash and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive embedded, IoT, AIoT, multimedia, and edge AI applications. The module includes an onboard PCB antenna, RF matching circuitry, crystal oscillator, and flash/PSRAM, simplifying hardware design and reducing development time. Key Features Dual-core Xtensa LX7 CPU operating up to 240 MHz 16 MB onboard Flash memory 8 MB onboard Octal PSRAM for large buffers, graphics, and AI workloads 2.4 GHz Wi-Fi (IEEE 802.11 b/g/n) Bluetooth 5.0 Low Energy (BLE) Built-in support for AI acceleration and vector instructions for machine learning and signal processing applications Rich peripheral set including: GPIO UART SPI I²C I²S USB 2.0 OTG PWM ADC Touch sensing SD/MMC interface CAN (TWAI) Integrated USB Serial/JTAG debugging capability Supply voltage range: 3.0 V to 3.6 V Operating temperature: −40°C to +65°C Surface-mount module with integrated PCB antenna Supports secure boot, flash encryption, and hardware cryptographic acceleration for secure IoT devices. Typical Applications Smart home and IoT devices Edge AI and machine learning Voice assistants and speech recognition Industrial automation Human-machine interfaces (HMI) Wireless sensors and gateways Smart displays and touch panels Audio streaming and multimedia devices Robotics and connected products #RF-Transceiver #Module #ESP32

The LSM6DSOXTR is a low-power inertial measurement unit integrating a three-axis accelerometer and a three-axis gyroscope within a compact surface-mount package. Designed for motion tracking, gesture recognition, activity monitoring, and sensor fusion applications, the device incorporates embedded machine learning capabilities and programmable finite state machines to enable intelligent edge processing with reduced host processor workload. The sensor supports high-performance motion sensing while maintaining low power consumption, making it suitable for wearable devices, IoT products, industrial monitoring systems, smart home equipment, and portable electronics. Engineering Specification Device Type Six-axis inertial measurement unit featuring a three-axis accelerometer and three-axis gyroscope. Sensor Functions Motion sensing, orientation detection, vibration monitoring, gesture recognition, activity tracking, tilt sensing, and sensor fusion. Integrated Features Embedded machine learning core, finite state machine engine, sensor hub functionality, timestamp generation, event detection, and programmable interrupt generation. Communication Interface Supports digital communication through I²C, SPI, and I³C interfaces for integration with microcontrollers and embedded processors. Power Characteristics Optimized for low-power operation with multiple performance modes supporting battery-powered and always-on applications. Measurement Capabilities Provides configurable acceleration and angular rate measurement ranges with programmable output data rates and digital filtering options. Embedded Intelligence Includes on-chip machine learning and event classification capabilities to enable local data processing and reduce system power consumption. Package Style Compact surface-mount LGA package suitable for space-constrained electronic designs. Applications Wearable electronics, asset tracking devices, industrial sensors, robotics, smart appliances, navigation systems, handheld devices, health monitoring equipment, and IoT products. Manufacturer STMicroelectronics. Hashtags #LSM6DSOXTR #STMicroelectronics #IMU #MotionSensor #Accelerometer #Gyroscope #SensorFusion #MachineLearningCore #EmbeddedSystems #WearableElectronics #IndustrialAutomation #IoT #SmartDevices #MEMS #CommonPartsLibrary

Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications. Key Features 9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries Applications Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems #BNO085 #IMU #9AxisSensor #MotionTracking #SensorFusion #OrientationSensor #Robotics #AR #VR #IoT #Wearables #EmbeddedSystems #CEVA #HillcrestLabs #MotionDetection #Quaternion #InertialMeasurementUnit

IXYS Integrated Circuits brings OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. As part of this family, the CPC1709J single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output, constructed with an efficient MOSFET switch and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.3 °C/W). Features • 22.8ADC Load Current with 5°C/W Heat Sink • Low 0.05 On-Resistance • 60VP Blocking Voltage • 2500Vrms Input/Output Isolation • Low Thermal Impedance: JC = 0.3 °C/W • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications • Low Drive Power Requirements • No EMI/RFI Generation Applications • Industrial Controls / Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment #CPC1709J #IXYS #Littelfuse #SolidStateRelay #SSR #OptoMOS #PowerRelay #DCRelay #MOSFETRelay #HighCurrentSwitching #ElectricalIsolation #IndustrialElectronics #PowerManagement #BatterySystems #AutomationControl

MAX-M10 RF Receiver BeiDou, Galileo, GLONASS, GPS, GNSS 1.561GHz, 1.575GHz, 1.602GHz -167dBm 921.6kbps Not Included Module The MAX-M10S-00B is a professional-grade, ultra-low-power GNSS positioning module from u-blox based on the u-blox M10 platform. It is designed for battery-powered applications such as asset trackers, wearables, IoT devices, and navigation systems. The module supports simultaneous reception of multiple GNSS constellations, providing high positioning availability, fast acquisition times, and excellent sensitivity even in challenging urban or weak-signal environments. It integrates a TCXO, LNA, and SAW filter to improve RF performance while maintaining very low power consumption. Key Features Multi-constellation GNSS receiver: GPS Galileo GLONASS BeiDou QZSS SBAS support (WAAS, EGNOS, MSAS, GAGAN) Concurrent tracking of up to four GNSS constellations for improved position availability and accuracy. Ultra-low power consumption: Approximately 25 mW in continuous tracking mode, making it ideal for battery-powered devices. High RF sensitivity: Tracking sensitivity up to −167 dBm for reliable operation in weak-signal conditions. High positioning accuracy: Typical position accuracy of approximately 1.5 m CEP under suitable conditions. Navigation update rate: Up to 10 Hz for responsive tracking applications. Integrated RF front-end: Built-in LNA (Low Noise Amplifier) Built-in SAW filter Integrated TCXO for stable operation. Supports Assisted GNSS services: AssistNow Online AssistNow Offline AssistNow Autonomous CloudLocate support for low-power IoT positioning. Communication interfaces: UART I²C NMEA and UBX protocols supported. Wide operating temperature range: −40°C to +85°C. Supply voltage: 1.76 V to 3.6 V. Typical Applications Asset tracking devices Wearable electronics Fleet management systems Industrial IoT Smart meters Drone and robotics navigation Personal navigation devices Timing and synchronization systems Package Information Package Type: Surface-mount LCC module Dimensions: 9.7 mm × 10.1 mm × 2.5 mm (typical module size) #Commonpartslibrary #RF #Wireless #RFreceivers #MAXM10S #uBlox #GNSS #GPS #Galileo #GLONASS #BeiDou #QZSS #NavigationModule #GNSSModule #GPSTracking #AssetTracking #IoT #IndustrialIoT #WearableTech #FleetManagement #DroneNavigation #EmbeddedSystems #ElectronicsDesign #PCBDesign #HardwareEngineering #LowPowerDesign #LocationTracking #Geolocation #RFDesign #LNA #SMTModule